Abstract We review the existing fabrication processes for superconductor digital electronics and describe approaches to increasing the scale of integration of superconducting digital circuits from the current level of about one million Josephson junctions (JJs) on a 1-cm 2 chip toward ten million JJs per chip. We present designs of ac-clocked Single Flux Quantum (SFQ) shift registers, convenient benchmarking circuits, in a 250-nm-linewidth superconductor electronics fabrication process developed recently at MIT Lincoln Laboratory (MIT LL). For shift registers using resistively shunted JJs with Josephson critical current density, J c of 100 μA/μm 2 , we achieved a record-high circuit density of 4.2·10 6 JJs per cm 2 , a factor of three higher than the previous record obtained in the MIT LL 350-nm-linewidth SFQ5ee process. Using self-shunted JJs with J c of 600 μA/μm 2 , we increased this record circuit density to 7.4·10 6 JJs per cm 2 .
Abstract We review the existing fabrication processes for superconductor digital electronics and describe approaches to increasing the scale of integration of superconducting digital circuits from the current level of about one million Josephson junctions (JJs) on a 1-cm 2 chip toward ten million JJs per chip. We present designs of ac-clocked Single Flux Quantum (SFQ) shift registers, convenient benchmarking circuits, in a 250-nm-linewidth superconductor electronics fabrication process developed recently at MIT Lincoln Laboratory (MIT LL). For shift registers using resistively shunted JJs with Josephson critical current density, J c of 100 μA/μm 2 , we achieved a record-high circuit density of 4.2·10 6 JJs per cm 2 , a factor of three higher than the previous record obtained in the MIT LL 350-nm-linewidth SFQ5ee process. Using self-shunted JJs with J c of 600 μA/μm 2 , we increased this record circuit density to 7.4·10 6 JJs per cm 2 .
The Superconductivity Research Laboratory has successfully fabricated large quantities of single flux quantum (SFQ) large scale integrated circuits, including several thousands of Josephson junctions (JJs). Using a Jc = 2.5 kA cm−2 process in which the number of Nb layers was four and the minimum JJ size was 2 µm square. We developed a new advanced fabrication process that produced a Jc = 10 kA cm−2, nine Nb layers and a minimum JJ size of 1 µm square. The increase in the number of Nb layers was achieved by using a planarization technique. The target of our next generation process is a Jc = 40 kA cm−2 with a 0.5 µm square for the minimum junction size. This specification will be achieved by using advanced semiconductor technologies. This process will enable SFQ circuits to be produced with one million JJs on a chip and achieve a clock frequency greater than 100 GHz.
Arrays of vortex transitional (VT) memory cells with functional density up to 1 Mbit/cm2have been designed, fabricated, and successfully demonstrated. This progress is due to recent advances in design optimization and in superconductor electronics fabrication achieved at MIT Lincoln Laboratory. As a starting point, we developed a demo array of VT cells for the 100-μA/μm2MIT LL fabrication process SFQ5ee with eight niobium layers. The studied two-junction memory cell with a two-junction nondestructive readout occupied 168 μm2, resulting in an over 0.5 Mbit/cm2functional density. Then, we reduced the cell area down to 99 μm2(corresponding to over 0.9 Mbit/cm2functional density) by utilizing self-shunted Josephson junctions (JJs) with critical current density JC of 600 μA/μm2and eliminating shunt resistors. The fabricated high-JC memory cells were fully operational and possessed wide read/write current margins, quite close to the theoretically predicted values. We discuss approaches to further increasing the integration scale of superconductor memory and logic circuits: 1) miniaturization of superconducting transformers by using soft magnetic materials; and 2) reduction of JJ area by using planar high-JC junctions similar to variable thickness bridges.
Superconducting digital circuits based on Josephson junctions with amorphous niobium-silicon (a-NbSi) barriers have been designed, fabricated, and tested. Single-flux-quantum (SFQ) shift registers operated with ±30% bias margins, confirming junction reproducibility and uniformity. Static digital dividers operated up to 165 GHz for a single value of bias current, which was only marginally slower than circuits fabricated with externally shunted AlOx-barrier junctions having a comparable critical current density of 4.5 kA/cm2. In comparison, self-shunted a-NbSi junctions enabled a doubling in circuit density. This and their relatively thick 10 nm barriers could increase the yield of complex SFQ circuits.
A variety of superconductor integrated circuits composed of six ac-powered SFQ shift registers with a total of 27078 bits and 108500 Josephson junctions (JJs) per 5 mm × 5 mm chip have been designed, fabricated, and tested to characterize flux trapping, fabrication process yield, and parameter spread. The six 4513-bit registers in the circuits have a common single-phase ac clock and individual input/output drivers, allowing for their parallel testing. We have investigated flux trapping in the circuits with various geometry, size, distance between moats in active ground planes (GPs), and containing up to three additional ‘dummy’ GPs, using multiple cooldowns through the critical temperature with various cooling rates and residual magnetic fields up to ∼ 1.2 µT. For the slit-type and square moats arrayed along the sides of the register cells, we have found a negligible effect of flux sequestered in the moats on the operating margins of the registers, and a negligible probability of detrimental flux trapping outside of the moats. Circuits with 0.3-µm-wide slit moats occupying less than 2% of the circuit area were fully operational in 100% of cooldowns, supporting the viability of a very large-scale integration of superconductor digital circuits. We have also found a strong enhancement of flux trapping outside the moats in circuits with closely spaced GPs and determined a critical distance,${{{\boldsymbol{t}}}_{\boldsymbol{c}}} \approx $0.6 µm, between them. The presence of two or more GPs spaced below thetcrendered the circuits nonoperational in 100% of cooldowns. We have measured 30 chips with over 3M JJs and determined individual cell operating margins in 138 registers to characterize the fabrication-related parameter spread and detect fabrication defects and flux-trapping events. By finding outlier bit-cells in the statistical distribution of the individual cell margins, we detected about one fabrication defect per million JJs, in most cases causing magnetic flux trapping in the affected cell.The circuits have been fabricated in the SFQ5ee fabrication process at MIT Lincoln Laboratory (MIT LL).
We implemented, optimized, and fully tested a superconducting Josephson junction fabrication process over multiple runs tailored for integrated digital circuits that are used for control and readout of superconducting qubits operating at millikelvin temperatures. This process was optimized for highly energy efficient rapid single flux quantum (ERSFQ) circuits with critical currents reduced by a factor of ∼10 as compared to those operated at 4.2 K. Specifically, it implemented Josephson junctions with 10 μA unit critical current fabricated with 10 μA/μm2 critical current density. In order to circumvent the substantial size increase in the SFQ circuit inductors, we employed an NbN high kinetic inductance layer with 8.5 pH/sq sheet inductance. Similarly, to maintain the small size of junction resistive shunts, we used a non-superconducting PdAu alloy with 4.0 Ω/sq sheet resistance. For integration with quantum circuits in a multi-chip module, 5 and 10 μm height bump processes were also optimized. To keep the fabrication process in check, we developed and thoroughly tested a comprehensive process control monitor chip set.
Flux transformers are the necessary component of all superconductor digital integrated circuits utilizing flux biasing and ac power excitation and clocking of logic cells, e.g., adiabatic quantum flux parametron (AQFP), reciprocal quantum logic (RQL), superconducting sensor arrays, qubits, etc. On average, one transformer is required per one Josephson junction. We consider limitations to the integration scale (device number density) imposed by the critical current of the ac power transmission lines (primary of the transformers) and cross-coupling between the adjacent transformers. The former sets the minimum linewidth and the mutual coupling length in the transformer, whereas the latter sets the minimum spacing between the transformers. Decreasing linewidth of superconducting (Nb) wires increases kinetic inductance of the transformer's secondary, decreasing its length and mutual coupling to the primary. This limits the minimum size. As a result, there is a minimum linewidth${{\boldsymbol{w}}}_{\mathbf{min}}\sim $100 nm, which determines the maximum achievable scale of integration. Using AQFP circuits as an example, we calculate dependences of the AQFP number density on linewidth for various types of microstrip-based and stripline-based transformers and inductors available in the SFQ5ee fabrication process developed at MIT Lincoln Laboratory, and estimate the maximum circuit density as a few million AQFPs per cm2. We propose an advanced fabrication process for a 10× increase in the density of AQFP and other ac-powered circuits. In this process, inductors are formed from a patterned bilayer of a geometrical inductance material, Nb, deposited over a layer of high kinetic inductance material, e.g., NbN. Individual pattering of the bilayer layers allows to create stripline inductors in a wide range of inductances, from the low values typical to Nb striplines to the high values typical for NbN thin films, and preserve sufficient mutual coupling in stripline transformers with extremely low cross-talk. Energy efficiency of ac-powered circuits is limited by dielectric losses in the ac power transmissions lines. Problems of scaling associated with multiphase ac power distribution are discussed.