Bulletin of the American Physical Society

Superconducting Qubits Integrated with Superconducting Through-Substrate Vias (TSVs): Fabrication

D. Yost, Mollie E. Schwartz, Danna Rosenberg, Justin Mallek, Rabindra Nath Das, Alexandra L. Day, David K. Kim, Bethany M. Niedzielski, Alexander J. Melville, Wayne H. Woods, Jonilyn Yoder, Andrew J. Kerman, William D. Oliver

Published Mar 7, 2019• 0 citations

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