Bulletin of the American Physical Society

Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing

Justin Mallek, D. Yost, Danna Rosenberg, Greg Calusine, Matthew Cook, Rabindra Nath Das, Evan B. Golden, David K. Kim, Alexander J. Melville, Corey Stull, Wayne H. Woods, Jonilyn Yoder, William D. Oliver

Published Mar 8, 2018• 0 citations

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