Bulletin of the American Physical Society

Fabrication of Sn-filled superconducting through-silicon vias (SC-TSV) for large-scale superconducting quantum circuits

Go Fujii, Masahiro Ukibe, Kazumasa Makise, Mutsuo Hidaka, Shuichi Nagasawa, Hirotake Yamamori, K. Inomata, Takahiro Yamada, Shiro Kawabata

Published Mar 8, 2018• 0 citations

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