Bulletin of the American Physical Society

Intel Superconducting Qubits, Part 2: Integration on through-silicon-via (TSV) substrates.

David J. Michalak, Román Caudillo, Lester F. Lampert, Adel A. Elsherbini, Javier Falcon, Ye Seul Nam, Preston Myers, Jeanette M. Roberts, Alessandro Bruno, Nandini Muthusubramanian, Cornelis Christiaan Bultink, Filip K. Malinowski, Nadia Haider, L. DiCarlo, Jim Clarke

Published Mar 7, 2019• 0 citations

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