Bulletin of the American Physical Society

3D Integration for Superconducting Qubits; Part 2 Superconducting Through Silicon Via Interposer Fabrication

D. Yost, Justin Mallek, Danna Rosenberg, Greg Calusine, Matthew Cook, Rabindra Nath Das, Alexandra L. Day, Evan B. Golden, David K. Kim, Alexander J. Melville, Corey Stull, Wayne H. Woods, Jonilyn Yoder, Andrew J. Kerman, William D. Oliver

Published Mar 8, 2018• 0 citations

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