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arXiv:1204.4147 · New Journal of Physics

Controlling trapping potentials and stray electric fields in a microfabricated ion trap through design and compensation

S. Charles Doret, Jason Amini, Kenneth Wright, Curtis Volin, Tyler N. Killian, Arkadaş Özakın, Douglas R. Denison, Harley Hayden, C. S. Pai, Richart E. Slusher, Alexa W. Harter

Published Jul 6, 2012• 77 citations
arXivHTMLPDF

Abstract

Recent advances in quantum information processing with trapped ions have demonstrated the need for new ion trap architectures capable of holding and manipulating chains of many (>10) ions. Here we present the design and detailed characterization of a new linear trap, microfabricated with scalable complementary metal-oxide-semiconductor (CMOS) techniques, that is well-suited to this challenge. Forty-four individually controlled dc electrodes provide the many degrees of freedom required to construct anharmonic potential wells, shuttle ions, merge and split ion chains, precisely tune secular mode frequencies, and adjust the orientation of trap axes. Microfabricated capacitors on dc electrodes suppress radio-frequency pickup and excess micromotion, while a top-level ground layer simplifies modeling of electric fields and protects trap structures underneath. A localized aperture in the substrate provides access to the trapping region from an oven below, permitting deterministic loading of particular isotopic/elemental sequences via species-selective photoionization. The shapes of the aperture and radio-frequency electrodes are optimized to minimize perturbation of the trapping pseudopotential. Laboratory experiments verify simulated potentials and characterize trapping lifetimes, stray electric fields, and ion heating rates, while measurement and cancellation of spatially-varying stray electric fields permits the formation of nearly-equally spaced ion chains.

DOI
10.1088/1367-2630/14/7/073012

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Recent advances in quantum information processing with trapped ions have demonstrated the need for new ion trap architectures capable of holding and manipulating chains of many (>10) ions. Here we present the design and detailed characterization of a new linear trap, microfabricated with scalable complementary metal-oxide-semiconductor (CMOS) techniques, that is well-suited to this challenge. Forty-four individually controlled dc electrodes provide the many degrees of freedom required to construct anharmonic potential wells, shuttle ions, merge and split ion chains, precisely tune secular mode frequencies, and adjust the orientation of trap axes. Microfabricated capacitors on dc electrodes suppress radio-frequency pickup and excess micromotion, while a top-level ground layer simplifies modeling of electric fields and protects trap structures underneath. A localized aperture in the substrate provides access to the trapping region from an oven below, permitting deterministic loading of particular isotopic/elemental sequences via species-selective photoionization. The shapes of the aperture and radio-frequency electrodes are optimized to minimize perturbation of the trapping pseudopotential. Laboratory experiments verify simulated potentials and characterize trapping lifetimes, stray electric fields, and ion heating rates, while measurement and cancellation of spatially-varying stray electric fields permits the formation of nearly-equally spaced ion chains.
Trapped ions within Paul traps have shown to be a promising architecture in the realisation of a quantum information processor together with the ability of providing quantum simulations. Linear Paul traps have demonstrated long coherence times with ions being well isolated from the environment, single and multi-qubit gates and the high fidelity detection of states. The scalability to large number of qubits, incorporating all the previous achievements requires an array of linear ion traps. Microfabrication techniques allow for fabrication and micron level accuracy of the trap electrode dimensions through photolithography techniques. The first part of this thesis presents the experiential setup and trapping of Yb+ ions needed to test large ion trap arrays. This include vacuum systems that can host advanced symmetric and asymmetric ion traps with up to 90 static voltage control electrodes. Demonstration of a single trapped Yb+ ion within a two-layer macroscopic ion trap is presented. with an ion-electrode distance of 310(10) µm. The anomalous heating rate and spectral noise density of the trap was measured, a main form of decoherence within ion traps. The second half of this thesis presents the design and fabrication of multi-layer asymmetric ion traps. This allows for isolated electrodes that cannot be accessed via surface pathways, allowing for higher density of electrodes as well as creating novel trap designs that allow for the potential of quantum simulations to be demonstrated. These include two-dimensional lattices and ring trap designs in which the isolated electrodes provide more control in the ion position. For the microfabrication of these traps I present a novel high-aspect ratio electroplated electrode design that provides shielding of the dielectric layer. This provides a means to mitigate stray electric field due to charge build up on the dielectric surfaces. Electrical testing of the trap structures was performed to test bulk breakdown and surface flashover of the ion trap architectures. Results showed sufficient isolation between electrodes for both radio frequency and static breakdown. Surface flashover voltage measurements over the dielectric layer showed an improvement of more than double over previous results using a new fabrication technique. This will allow for more powerful ion trap chips needed for the next generation of microfabricated ion trap arrays for scalable quantum technologies.
We present the design, fabrication, and characterization of a monolithic, segmented, three-dimensional linear Paul ion trap for quantum science applications. The trap is fabricated from a single fused-silica block using selective laser-induced etching (SLE) and is subsequently metallized, forming electrodes isolated by self-shadowing trench structures without the need for layer alignment or external shadow masks. The segmented electrodes allow for shaping of the axial potential, enabling the creation of anharmonic potential wells, such as those required for equidistant ion strings. In addition, they enable shuttling and splitting of ion chains. We discuss key design choices and SLE-imposed constraints on achievable feature sizes, and evaluate electron-beam evaporation and magnetron sputtering as metallization approaches. Across two independent experimental setups, we demonstrate stable trapping and control of linear chains of up to 33 40^{40}40Ca+^++ ions, including approximately equally spaced configurations. The measured secular frequencies in both traps agree with boundary-element simulations at the percent level, with residual deviations attributed to stray electric fields in the presence of anharmonic axial potentials, rather than fabrication imperfections. We measure axial micromotion field strengths on the order of 100 V/m along the trap axis, in approximate agreement with simulations. For radial mode frequencies near 2 MHz and an ion-electrode distance of 300 um, we measure heating rates of the order of 10 quanta/s in all but one motional mode, which is elevated by a technical noise source. The presented trap design is thus suitable for a wide range of quantum science applications and demonstrates the viability of SLE for the fabrication of finely segmented, monolithic, three-dimensional ion traps.
Excess micromotion can be a substantial source of errors in trapped-ion based quantum processors and clocks due to the sensitivity of the internal states of the ion to external fields and motion. This problem can be fixed by compensating background electric fields in order to position ions at the RF node and minimize their driven micromotion. Here we describe techniques for compensating ion chains in scalable surface ion traps. These traps are capable of cancelling stray electric fields with fine spatial resolution in order to compensate multiple closely spaced ions due to their large number of relatively small control electrodes. We demonstrate a technique that compensates an ion chain to better than 5 V/m and within 0.1 degrees of chain rotation.
An ion trap is a device to confine charged particles by utilizing electromagnetic fields.Since the trapped ions have a feasibility of the individual state manipulation, a long coherence time, and an ideal isolation from the surroundings, the ion-trap technology becomes one of the leading candidates for the physical implementation of quantum information processing.In order to build a large-scale integrated iontrap system for realizing complex quantum algorithms, microfabrication technologies have been applied to construct ion traps.The use of micro-electromechanical system (MEMS) ion-trap chip allows a scalable architecture of ion-trap arrays and integration of functional components to the trap chip, but a few side effects also arise.One of the most particular problems is stray fields generated by the charges accumulated on the sidewalls of thick dielectric pillars or the native oxide grown on metal surfaces, since the stray fields lead to ion micromotions which can cause heating and escape of the trapped ions.This dissertation presents a silicon surface ion-trap chip with dielectric sidewalls shielded by metal films.The oxide pillars supporting the top electrodes are fabricated to have overhang structures, and the upper and lower part of the pillars are coated by separate aluminum layers which are electrically isolated from each other.In order to evaluate the effects of the native ii metal oxide on the electrode surface to the charging phenomenon, a trap chip with an additional gold layer on the aluminum electrodes is also fabricated.An ultra-high vacuum (UHV) chamber, electrical connections, and an optical setup are prepared to trap 174 Yb + ions, and the ions are successfully trapped by using the experimental setup including the fabricated ion-trap chip.To evaluate the effectiveness of the proposed electrode structures, charging is intentionally induced on the chip surface by injecting a 355-nm pulse laser with 40-μW power perpendicularly to the chip surface.The intensity of the stray field is estimated by measuring the displacement of ion position after charging is induced.When the Al-based chips with exposed and Al-coated dielectric sidewalls are used, the standard deviation of the intensities of stray fields are 3.53, and 5.63 V/m, respectively.However, the standard deviation of the intensity of stray fields in the case of using Au-coated chip is 1.56 V/m, and any stray field is measured when the laser was injected on the surface or sidewalls of the gold-coated electrodes.These experimental results indicate that the gold coating on the surface of the aluminum electrodes and the sidewalls of dielectric pillars is effective for eliminating the generation of stray fields induced by static charges.
Microfabricated ion trap chips are at the core of some of the most advanced quantum computers. How a large number of ions is arranged and controlled on an ion trap chip depends on the chosen trap architecture. One such architecture is the quantum spring array (QSA). In the QSA architecture, ion chains are arranged in a two-dimensional lattice and interact with ion chains in neighboring sites in the radial and axial directions of the respective chain. This interaction, or coupling, is mediated by the Coulomb force while keeping ions in separate trapping sites, and scales inversely with the third power of the separation. The capability to control the distance between ions in the lattice is thus essential. In previous works, the radial separation between ions was tuned by controlling the rf pseudo-potential, which revealed to be experimentally challenging to realize while maintaining low heating rates. In this work, we present an ion trap chip design that allows tuning of the radial distance between ions using only dc voltages. The radial transport is executed between different interaction zones, designated for quantum operations, through specifically designed transition zones. A prototype of this type of ion trap chip was microfabricated on fused silica substrate. Its functionality is characterized by demonstrating dc-controlled radial transport of a single ion through a transition zone and measuring stray fields and ion heating rates in the center of the trap. Moreover, the fabrication of a multi-metal layer version of such a trap is presented as a scaling path for the presented chip design.
Abstract Scaling trapped-ion quantum computing will require robust trapping of at least hundreds of ions over long periods, while increasing the complexity and functionality of the trap itself. Symmetric three-dimensional (3D) structures enable high trap depth, but microfabrication techniques are generally better suited to planar structures that produce less ideal conditions for trapping. We present an ion trap fabricated on stacked eight-inch wafers in a large-scale micro-electro-mechanical system microfabrication process that provides reproducible traps at a large volume. Electrodes are patterned on the surfaces of two opposing wafers bonded to a spacer, forming a 3D structure with 2.5 μm standard deviation in alignment across the stack. We implement a design achieving a trap depth of 1 eV for a 40Ca+ ion held at 200 μm from either electrode plane. We characterize traps, achieving measurement agreement with simulations to within ±5% for mode frequencies spanning 0.6–3.8 MHz, and evaluate stray electric field across multiple trapping sites. We measure motional heating rates over an extensive range of trap frequencies, and temperatures, observing 40 phonons/s at 1 MHz and 185 K. This fabrication method provides a highly scalable approach for producing a new generation of 3D ion traps.