Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Log inSign up
Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Blog
Job Board
Q3AS

© 2026 Aqora Quantum S.A.S.

TermsPrivacyLegal Notice

EPJ Quantum Technology

Performance characterization of a multi-module quantum processor with static inter-chip couplers

Graham J. Norris, Kieran Dalton, Dante Colao Zanuz, Alexander J. Rommens, Alexander Flasby, Mohsen Bahrami Panah, François Swiadek, Colin Scarato, Christoph Hellings, Jean-Claude Besse, Andreas J. Wallraff

Published Feb 11, 2026• 1 citation
Publisher

Abstract

Abstract Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of $9 \times 10^{-3}$ 9 × 10 − 3 in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of $6 \times 10^{-4}$ 6 × 10 − 4 , consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of $7 \times 10^{-3}$ 7 × 10 − 3 extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors.

DOI
10.1140/epjqt/s40507-026-00469-z

Related papers

Breaking the scalability barrier via a vertical tunable coupler in 3D integrated transmon system

Xudong Liao, Shuyi Pan, Zhenxing Zhang +11 more

Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous single-qubit gate fidelities of 99.87 % with negligible crosstalk, and controlled-Z gates achieve an average fidelity of 97.5 % for both intrachip and interchip operations. We further demonstrate high-fidelity Bell-state preparation and coherent generation of a four-qubit $W$ state, confirming the architecture's capability for interchip entanglement distribution. These results establish vertical coupling as a promising pathway toward scalable quantum processors compatible with advanced quantum error-correcting codes.

quant-pharXiv:2605.11488•May 13, 2026•0 citations

Building blocks of a flip-chip integrated superconducting quantum processor

Sandoko Kosen, Hang-Xi Li, Marcus Rommel +24 more

Abstract We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips—one quantum chip and one control chip—that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.

arXiv:2112.02717•Quantum Science and Technology•May 25, 2022•88 citations

Long-range tunable coupler for modular fluxonium quantum processors

Peng Zhao, Peng Xu, Zheng-Yuan Xue

The path toward practical superconducting quantum processors requires the integration of a large number of high-performance qubits. Modular architectures could offer a way to address the scaling limitations of monolithic designs by partitioning a large quantum processor into physically separated modules, or chiplets, linked through long-range interconnects. In this context, although fluxonium qubits have emerged as a compelling platform for quantum computing due to their long coherence times and high-fidelity gates, existing coupling schemes remain restricted to qubits in close proximity on a single chip. This limitation inherently precludes the long-range interconnects essential for modular integration. In this work, we propose a long-range tunable coupler designed to interconnect fluxonium qubits separated by more than one centimeter, thereby supporting the realization of modular fluxonium quantum processors. Under realistic assumptions, the proposed coupler has the potential to achieve inter-module two-qubit gate performance, specifically sub-100-ns gates with intrinsic errors below $10^{-4}$, comparable to that of intra-module (intra-chiplet) gates, while enabling modular integration with low quantum crosstalk, a key requirement for scalable systems. We further discuss the integration of this coupler into modular fluxonium lattices and explore its feasibility for achieving the higher connectivity and longer coupling range required for complex quantum error correction codes. This work could contribute to the development of large-scale fluxonium quantum processors by bridging their demonstrated potential with modular scalability.

quant-pharXiv:2604.12261•Apr 15, 2026•0 citations

Fluxonium qubits in a flip-chip package

Aaron Somoroff, Patrick Truitt, Adam C. Weis +10 more

The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump bonded to the quantum chip, forming a multichip module. The modular approach allows for improved connectivity between the qubits and control and readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high-fidelity single-qubit gates with 6-ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.

arXiv:2303.01481•Physical Review Applied•Feb 7, 2024•11 citations

Tunable coupling of widely separated superconducting qubits: A possible application toward a modular quantum device

Peng Zhao, Yingshan Zhang, Guangming Xue +2 more

In addition to striving to assemble more and more qubits in a single monolithic quantum device, taking a modular design strategy may mitigate numerous engineering challenges for achieving large-scalable quantum processors with superconducting qubits. Nevertheless, a major challenge in the modular quantum device is how to realize high-fidelity entanglement operations on qubits housed in different modules while preserving the desired isolation between modules. In this work, we propose a conceptual design of a modular quantum device, where nearby modules are spatially separated by centimeters. In principle, each module can contain tens of superconducting qubits and can be separately fabricated, characterized, packaged, and replaced. By introducing a bridge module between nearby qubit modules and taking the coupling scheme utilizing a tunable bus, tunable coupling of qubits that are housed in nearby qubit modules could be realized. Given physically reasonable assumptions, we expect that sub-100-ns two-qubit gates for qubits housed in nearby modules, which are spatially separated by more than two centimeters could be obtained. In this way, the inter-module gate operations are promising to be implemented with gate performance comparable with that of intra-module gate operations. Moreover, with the help of through-silicon vias technologies, this long-range coupling scheme may also allow one to implement inter-module couplers in a multi-chip stacked processor. Thus, the tunable longer-range coupling scheme and the proposed modular architecture may provide a promising foundation for solving challenges toward large-scale quantum information processing with superconducting qubits.

arXiv:2201.03184•Applied Physics Letters•Jul 18, 2022•19 citations

Modular superconducting-qubit architecture with a multichip tunable coupler

Mark Field, Angela Q. Chen, Ben Scharmann +7 more

We use a floating tunable coupler to mediate interactions between qubits on separate chips to build a modular architecture. We demonstrate three different designs of multichip tunable couplers using vacuum-gap capacitors or superconducting indium-bump bonds to connect the coupler to a microwave line on a common substrate and then connect to the qubit on the next chip. We show that the zero-coupling condition between qubits on separate chips can be achieved in each design and that the relaxation rates for the coupler and qubits are not noticeably affected by the extra circuit elements. Finally, we demonstrate two-qubit gate operations with fidelity at the same level as qubits with a tunable coupler on a single chip. Using one or more indium bonds does not degrade qubit coherence or impact the performance of two-qubit gates.

arXiv:2308.09240•Physical Review Applied•May 30, 2024•28 citations
Abstract Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of 9×10−39 \times 10^{-3}9×10−3 9 × 10 − 3 in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of 6×10−46 \times 10^{-4}6×10−4 6 × 10 − 4 , consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of 7×10−37 \times 10^{-3}7×10−3 7 × 10 − 3 extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors.
Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous single-qubit gate fidelities of 99.87 % with negligible crosstalk, and controlled-Z gates achieve an average fidelity of 97.5 % for both intrachip and interchip operations. We further demonstrate high-fidelity Bell-state preparation and coherent generation of a four-qubit WWW state, confirming the architecture's capability for interchip entanglement distribution. These results establish vertical coupling as a promising pathway toward scalable quantum processors compatible with advanced quantum error-correcting codes.
Abstract We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips—one quantum chip and one control chip—that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
The path toward practical superconducting quantum processors requires the integration of a large number of high-performance qubits. Modular architectures could offer a way to address the scaling limitations of monolithic designs by partitioning a large quantum processor into physically separated modules, or chiplets, linked through long-range interconnects. In this context, although fluxonium qubits have emerged as a compelling platform for quantum computing due to their long coherence times and high-fidelity gates, existing coupling schemes remain restricted to qubits in close proximity on a single chip. This limitation inherently precludes the long-range interconnects essential for modular integration. In this work, we propose a long-range tunable coupler designed to interconnect fluxonium qubits separated by more than one centimeter, thereby supporting the realization of modular fluxonium quantum processors. Under realistic assumptions, the proposed coupler has the potential to achieve inter-module two-qubit gate performance, specifically sub-100-ns gates with intrinsic errors below 10−410^{-4}10−4, comparable to that of intra-module (intra-chiplet) gates, while enabling modular integration with low quantum crosstalk, a key requirement for scalable systems. We further discuss the integration of this coupler into modular fluxonium lattices and explore its feasibility for achieving the higher connectivity and longer coupling range required for complex quantum error correction codes. This work could contribute to the development of large-scale fluxonium quantum processors by bridging their demonstrated potential with modular scalability.
The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump bonded to the quantum chip, forming a multichip module. The modular approach allows for improved connectivity between the qubits and control and readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high-fidelity single-qubit gates with 6-ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.
In addition to striving to assemble more and more qubits in a single monolithic quantum device, taking a modular design strategy may mitigate numerous engineering challenges for achieving large-scalable quantum processors with superconducting qubits. Nevertheless, a major challenge in the modular quantum device is how to realize high-fidelity entanglement operations on qubits housed in different modules while preserving the desired isolation between modules. In this work, we propose a conceptual design of a modular quantum device, where nearby modules are spatially separated by centimeters. In principle, each module can contain tens of superconducting qubits and can be separately fabricated, characterized, packaged, and replaced. By introducing a bridge module between nearby qubit modules and taking the coupling scheme utilizing a tunable bus, tunable coupling of qubits that are housed in nearby qubit modules could be realized. Given physically reasonable assumptions, we expect that sub-100-ns two-qubit gates for qubits housed in nearby modules, which are spatially separated by more than two centimeters could be obtained. In this way, the inter-module gate operations are promising to be implemented with gate performance comparable with that of intra-module gate operations. Moreover, with the help of through-silicon vias technologies, this long-range coupling scheme may also allow one to implement inter-module couplers in a multi-chip stacked processor. Thus, the tunable longer-range coupling scheme and the proposed modular architecture may provide a promising foundation for solving challenges toward large-scale quantum information processing with superconducting qubits.
We use a floating tunable coupler to mediate interactions between qubits on separate chips to build a modular architecture. We demonstrate three different designs of multichip tunable couplers using vacuum-gap capacitors or superconducting indium-bump bonds to connect the coupler to a microwave line on a common substrate and then connect to the qubit on the next chip. We show that the zero-coupling condition between qubits on separate chips can be achieved in each design and that the relaxation rates for the coupler and qubits are not noticeably affected by the extra circuit elements. Finally, we demonstrate two-qubit gate operations with fidelity at the same level as qubits with a tunable coupler on a single chip. Using one or more indium bonds does not degrade qubit coherence or impact the performance of two-qubit gates.