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arXiv:2201.03184 · Applied Physics Letters

Tunable coupling of widely separated superconducting qubits: A possible application toward a modular quantum device

Peng Zhao, Yingshan Zhang, Guangming Xue, Yirong Jin, Haifeng Yu

Published Jul 18, 2022• 19 citations
arXivHTMLPDF

Abstract

In addition to striving to assemble more and more qubits in a single monolithic quantum device, taking a modular design strategy may mitigate numerous engineering challenges for achieving large-scalable quantum processors with superconducting qubits. Nevertheless, a major challenge in the modular quantum device is how to realize high-fidelity entanglement operations on qubits housed in different modules while preserving the desired isolation between modules. In this work, we propose a conceptual design of a modular quantum device, where nearby modules are spatially separated by centimeters. In principle, each module can contain tens of superconducting qubits and can be separately fabricated, characterized, packaged, and replaced. By introducing a bridge module between nearby qubit modules and taking the coupling scheme utilizing a tunable bus, tunable coupling of qubits that are housed in nearby qubit modules could be realized. Given physically reasonable assumptions, we expect that sub-100-ns two-qubit gates for qubits housed in nearby modules, which are spatially separated by more than two centimeters could be obtained. In this way, the inter-module gate operations are promising to be implemented with gate performance comparable with that of intra-module gate operations. Moreover, with the help of through-silicon vias technologies, this long-range coupling scheme may also allow one to implement inter-module couplers in a multi-chip stacked processor. Thus, the tunable longer-range coupling scheme and the proposed modular architecture may provide a promising foundation for solving challenges toward large-scale quantum information processing with superconducting qubits.

DOI
10.1063/5.0097521

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In addition to striving to assemble more and more qubits in a single monolithic quantum device, taking a modular design strategy may mitigate numerous engineering challenges for achieving large-scalable quantum processors with superconducting qubits. Nevertheless, a major challenge in the modular quantum device is how to realize high-fidelity entanglement operations on qubits housed in different modules while preserving the desired isolation between modules. In this work, we propose a conceptual design of a modular quantum device, where nearby modules are spatially separated by centimeters. In principle, each module can contain tens of superconducting qubits and can be separately fabricated, characterized, packaged, and replaced. By introducing a bridge module between nearby qubit modules and taking the coupling scheme utilizing a tunable bus, tunable coupling of qubits that are housed in nearby qubit modules could be realized. Given physically reasonable assumptions, we expect that sub-100-ns two-qubit gates for qubits housed in nearby modules, which are spatially separated by more than two centimeters could be obtained. In this way, the inter-module gate operations are promising to be implemented with gate performance comparable with that of intra-module gate operations. Moreover, with the help of through-silicon vias technologies, this long-range coupling scheme may also allow one to implement inter-module couplers in a multi-chip stacked processor. Thus, the tunable longer-range coupling scheme and the proposed modular architecture may provide a promising foundation for solving challenges toward large-scale quantum information processing with superconducting qubits.
The path toward practical superconducting quantum processors requires the integration of a large number of high-performance qubits. Modular architectures could offer a way to address the scaling limitations of monolithic designs by partitioning a large quantum processor into physically separated modules, or chiplets, linked through long-range interconnects. In this context, although fluxonium qubits have emerged as a compelling platform for quantum computing due to their long coherence times and high-fidelity gates, existing coupling schemes remain restricted to qubits in close proximity on a single chip. This limitation inherently precludes the long-range interconnects essential for modular integration. In this work, we propose a long-range tunable coupler designed to interconnect fluxonium qubits separated by more than one centimeter, thereby supporting the realization of modular fluxonium quantum processors. Under realistic assumptions, the proposed coupler has the potential to achieve inter-module two-qubit gate performance, specifically sub-100-ns gates with intrinsic errors below 10−410^{-4}10−4, comparable to that of intra-module (intra-chiplet) gates, while enabling modular integration with low quantum crosstalk, a key requirement for scalable systems. We further discuss the integration of this coupler into modular fluxonium lattices and explore its feasibility for achieving the higher connectivity and longer coupling range required for complex quantum error correction codes. This work could contribute to the development of large-scale fluxonium quantum processors by bridging their demonstrated potential with modular scalability.
Abstract Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, achieving two-qubit gate fidelities as high as 99.1 ± 0.5% and 98.3 ± 0.3% for iSWAP and CZ entangling gates, respectively. The quality of the inter-module entanglement is further confirmed by a demonstration of Bell-inequality violation for disjoint pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.
High-fidelity quantum interconnection remains a critical challenge for scaling up superconducting quantum chips. Here, we realize a simple fixed coupling scheme to achieve high-fidelity two-qubit gate operation across separate superconducting quantum chips. In this scheme, qubit-qubit coupling between separate chips can be realized via exchange interaction mediated by a bus resonator. By merely tuning the frequency of a single qubit, the resonant mode of the bus resonator can be modulated, enabling high-quality and stable quantum interconnection across different chips. Consequently, the experimentally implemented two-qubit gate operations between separate chips exhibit excellent performance, with a maximum two-qubit CZ gate fidelity reaching 99.57%. This work lays a technical foundation for the realization of high-fidelity chip-to-chip quantum interconnection, which facilitates the development of large-scale superconducting quantum chips with high fidelity.
Abstract Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of 9×10−39 \times 10^{-3}9×10−3 9 × 10 − 3 in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of 6×10−46 \times 10^{-4}6×10−4 6 × 10 − 4 , consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of 7×10−37 \times 10^{-3}7×10−3 7 × 10 − 3 extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors.
The development of modular and versatile quantum interconnect hardware is a key next step in the scaling of quantum information platforms to larger size and greater functionality. For superconducting quantum systems, fast and well-controlled tunable circuit couplers will be paramount for achieving high-fidelity and resource-efficient connectivity, whether for performing two-qubit gate operations, encoding or decoding a quantum data bus, or interfacing across modalities. Here we propose a versatile and internally tunable double-transmon coupler (DTC) architecture that implements tunable coupling via flux-controlled interference in a three-junction dc superconducting quantum interference device. Crucially, the DTC possesses an internally defined zero-coupling state that is independent of the coupled data qubits or circuit resonators. This makes it particularly attractive as a modular and versatile design element for realizing fast and robust linear coupling in several applications such as high-fidelity two-qubit gate operations, qubit readout, and quantum bus interfacing.
We use a floating tunable coupler to mediate interactions between qubits on separate chips to build a modular architecture. We demonstrate three different designs of multichip tunable couplers using vacuum-gap capacitors or superconducting indium-bump bonds to connect the coupler to a microwave line on a common substrate and then connect to the qubit on the next chip. We show that the zero-coupling condition between qubits on separate chips can be achieved in each design and that the relaxation rates for the coupler and qubits are not noticeably affected by the extra circuit elements. Finally, we demonstrate two-qubit gate operations with fidelity at the same level as qubits with a tunable coupler on a single chip. Using one or more indium bonds does not degrade qubit coherence or impact the performance of two-qubit gates.