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arXiv:2605.11488

Breaking the scalability barrier via a vertical tunable coupler in 3D integrated transmon system

Xudong Liao, Shuyi Pan, Zhenxing Zhang, Sainan Huai, Zhiwen Zong, Xiaopei Yang, Kunliang Bu, Wen Zheng, Xinsheng Tan, Yang Yu, Yuan Li, Yi-Cong Zheng, Tianqi Cai, Shengyu Zhang

quant-phSubmitted May 12, 2026• Announced May 13, 2026• 0 citations
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Abstract

Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous single-qubit gate fidelities of 99.87 % with negligible crosstalk, and controlled-Z gates achieve an average fidelity of 97.5 % for both intrachip and interchip operations. We further demonstrate high-fidelity Bell-state preparation and coherent generation of a four-qubit $W$ state, confirming the architecture's capability for interchip entanglement distribution. These results establish vertical coupling as a promising pathway toward scalable quantum processors compatible with advanced quantum error-correcting codes.

Comments
7 pages, 5 figures

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Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous single-qubit gate fidelities of 99.87 % with negligible crosstalk, and controlled-Z gates achieve an average fidelity of 97.5 % for both intrachip and interchip operations. We further demonstrate high-fidelity Bell-state preparation and coherent generation of a four-qubit WWW state, confirming the architecture's capability for interchip entanglement distribution. These results establish vertical coupling as a promising pathway toward scalable quantum processors compatible with advanced quantum error-correcting codes.
Abstract Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can further improve scalability and performance by enabling the integration of elements with different substrates or fabrication processes, by increasing the fabrication yield of completed devices, and by physically separating the qubits onto distinct modules to avoid correlated errors mediated by a common substrate. We present a design for a multi-chip module comprising one carrier chip and four qubit modules. Measuring two of the qubits, we analyze the readout performance, finding a mean three-level state-assignment error of 9×10−39 \times 10^{-3}9×10−3 9 × 10 − 3 in 200 ns. We calibrate single-qubit gates and measure a mean simultaneous randomized benchmarking error of 6×10−46 \times 10^{-4}6×10−4 6 × 10 − 4 , consistent with the coherence times of the qubits. Using a wiring-efficient static inter-module coupler featuring galvanic inter-chip transitions, we demonstrate a controlled-Z two-qubit gate in 100 ns with an error of 7×10−37 \times 10^{-3}7×10−3 7 × 10 − 3 extracted from interleaved randomized benchmarking. Three-dimensional integration, as presented here, will continue to contribute to improving the performance of gates and readout as well as increasing the qubit count in future superconducting quantum processors.
Precise control of superconducting qubits is essential for advancing both quantum simulation and quantum error correction. Recently, transmon qubit systems employing the single-transmon coupler (STC) scheme have demonstrated high-fidelity single- and two-qubit gate operations by dynamically tuning the effective coupling between qubits. However, the integration of STCs increases the number of control lines, thereby posing a significant bottleneck for chip routing and scalability. To address this challenge, we propose a robust control line multiplexing scheme based on a double-transmon coupler (DTC) architecture, which enables shared coupler control lines to substantially reduce wiring complexity. Moreover, we experimentally verify that this multiplexed configuration efficiently suppresses undesirable static ZZZZZZ coupling while maintaining accurate control over two-qubit gate operations. We further demonstrate the feasibility of the architecture through two distinct gate implementations: a fast coupler ZZZ-control-based CZ gate and a parametric iSWAP gate. To validate the practical applicability of this multiplexing approach in quantum circuits, we prepare Bell and three-qubit GHZ states using the proposed scheme with fidelity exceeding 99% and 96%, respectively. This multiplexed DTC architecture offers significant potential to minimize wiring overhead in two-dimensional qubit arrays, thereby greatly enhancing the scalability of superconducting quantum processors.
Abstract We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips—one quantum chip and one control chip—that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
The path toward practical superconducting quantum processors requires the integration of a large number of high-performance qubits. Modular architectures could offer a way to address the scaling limitations of monolithic designs by partitioning a large quantum processor into physically separated modules, or chiplets, linked through long-range interconnects. In this context, although fluxonium qubits have emerged as a compelling platform for quantum computing due to their long coherence times and high-fidelity gates, existing coupling schemes remain restricted to qubits in close proximity on a single chip. This limitation inherently precludes the long-range interconnects essential for modular integration. In this work, we propose a long-range tunable coupler designed to interconnect fluxonium qubits separated by more than one centimeter, thereby supporting the realization of modular fluxonium quantum processors. Under realistic assumptions, the proposed coupler has the potential to achieve inter-module two-qubit gate performance, specifically sub-100-ns gates with intrinsic errors below 10−410^{-4}10−4, comparable to that of intra-module (intra-chiplet) gates, while enabling modular integration with low quantum crosstalk, a key requirement for scalable systems. We further discuss the integration of this coupler into modular fluxonium lattices and explore its feasibility for achieving the higher connectivity and longer coupling range required for complex quantum error correction codes. This work could contribute to the development of large-scale fluxonium quantum processors by bridging their demonstrated potential with modular scalability.
Abstract Superconducting fluxonium qubits provide a promising alternative to transmons on the path toward large-scale superconductor-based quantum computing due to their better coherence and larger anharmonicity. A major challenge for multi-qubit fluxonium devices is the experimental demonstration of a scalable crosstalk-free multi-qubit architecture with high-fidelity single-qubit and two-qubit gates, single-shot readout, and state initialization. Here, we present a two-qubit fluxonium-based quantum processor with a tunable coupler element. We experimentally demonstrate fSim-type and controlled-Z-gates with 99.55 and 99.23% fidelities, respectively. The residual ZZ interaction is suppressed down to the few kHz levels. Using a galvanically coupled flux control line, we implement high-fidelity single-qubit gates and ground state initialization with a single arbitrary waveform generator channel per qubit.
Superconducting quantum processors have largely converged on transmon-based architectures, while alternative qubit modalities with intrinsic error protection have lacked a demonstrated path to scalable system integration. In particular, although tunable-coupler-mediated interactions have been validated for small fluxonium systems, it remains unclear whether such designs can be scaled to a multi-qubit lattice. Here, we establish a scalable fluxonium processor architecture based on a modular qubit-coupler unit cell engineered to suppress residual interactions and spectator errors in a many-qubit lattice. The system enables parallel single-qubit gate fidelities approaching 99.99% and two-qubit CZ gate fidelities around 99%. With an optimized gate duration of 32 ns, the best CZ gate fidelity reaches 99.9%. We further validate this architecture in a 22-qubit processor based on the same configuration, where parallel operations enable the deterministic generation of Greenberger-Horne-Zeilinger states involving up to 10 qubits. Together, these results demonstrate that the fluxonium-tunable-coupler unit cell composes without emergent interaction pathologies and establish fluxonium as a scalable superconducting qubit platform.