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Microfabricated ion trap chip with in situ radio-frequency sensing

Peter Maunz

Published Jan 23, 2023• 0 citations
OpenAlex

Abstract

A radio-frequency (RF) surface ion trap chip includes an RF electrode and an integrated capacitive voltage divider in which an intermediate voltage node is capacitively connected between the RF electrode and a ground. A sensor output trace is connected to the intermediate voltage node.

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Microfabricated surface ion traps are a principal component of many ion-based quantum information science platforms. The operational parameters of these devices are pushed to the edge of their physical capabilities as the experiments strive for increasing performance. When the applied radio-frequency (RF) voltage is increased excessively, the devices can experience damaging electric discharge events known as RF breakdown. We introduce two novel techniques for in situ detection of RF breakdown, which we implemented while characterizing the breakdown threshold of surface ion traps produced at Sandia National Laboratories. In these traps, breakdown did not always occur immediately after increasing the RF voltage, but often minutes or even hours later. This result is surprising in the context of the suggested mechanisms for RF breakdown in vacuum. Additionally, the extent of visible damage caused by breakdown events increased with the applied voltage. To minimize the probability for damage when RF power is first applied to a device, our results strongly suggest that the voltage should be ramped up over the course of several hours and monitored for breakdown.
Ion traps can provide both physical implementation of quantum information processing and direct observation of quantum systems. Recently, surface ion traps have been developed using microfabrication technologies and are considered to be a promising platform for scalable quantum devices. This paper presents detailed guidelines for designing the electrodes of surface ion traps. First, we define and explain the key specifications including trap depth, q-parameter, secular frequency, and ion height. Then, we present a numerical-simulation-based design procedure, which involves determining the basic assumptions, determining the shape and size of the chip, designing the dimensions of the radio frequency (RF) electrode, and analyzing the direct current (DC) control voltages. As an example of this design procedure, we present a case study with tutorial-like explanations. The proposed design procedure can provide a practical guideline for designing the electrodes of surface ion traps.
Large surface-electrode ion traps with multiple trapping regions and junctions are a natural approach to scaling trapped ion quantum computers, supporting the connectivity and ion counts necessary for complex quantum algorithms. However, a major hurdle in this scaling is on-chip power dissipation from the applied RF voltage, which increases at a rate between linear and cubic relative to trap size, depending on whether the losses are dielectric or Ohmic. Here, we present two versions of a trap with features designed to reduce both types of RF power dissipation. The first variant contains a raised RF electrode that increases the electrode–ground distance to reduce capacitance. Different DC voltage sources are demonstrated on this trap to show that technical noise before the filter remains the dominant source of voltage noise and therefore motional heating. The second variant additionally includes a method for removing dielectric from beneath the RF electrode to further reduce dielectric losses. These traps were demonstrated at room temperature with 40Ca+ ions. The similar heating rates and heating rate axial frequency dependencies between 2.4 and 3.0 MHz illustrate that this dielectric modification is not detrimental to trap performance.
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Si substrate provide the integration platform for surface ion trap device fabrication. Grounding metal for the surface ion trap is necessary because of high RF voltage (> 100V) applied and lower RF loss required within functionality. High resistivity Si substrate with floating metal grounding and low-grade Si substrate with connected grounding metal were integrated with surface ion trap. Ion trap resonance curves were observed at 47.1 MHz frequency for ion trap devices with different grounding metal. The curves have similar resonant power.