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TURKISH JOURNAL OF ELECTRICAL ENGINEERING & COMPUTER SCIENCES

Heat flux capacity measurement and improvement for the test of superconducting logic circuits in closed-cycle cryostats

Sasan Razmkhah, Ali Bozbey

Published Aug 10, 2019• 12 citations
Publisher

Abstract

With the current progress of superconducting integrated circuits, circuit complexities have reached more than 100,000 Josephson junctions. At the laboratory environment, circuit tests are generally being conducted at liquid Helium environments. With the commercialization of the superconducting integrated circuit-based systems and/or price increase of liquid Helium, utilization of the closed-cycle systems will be inevitable. Even though it is possible to implement closed-cycle systems with quite substantial excess cooling powers after all the wirings and peripheral circuits, one point not to be overlooked is the power density at the superconducting chips. We have observed that the circuits designed for operation at liquid Helium bath have much higher power densities that exceed the heat flux capacities of closed-cycle cryocoolers. We have measured that the heat flux capacities of closed-cycle systems are about 0.1 W/cm${}^{2}$ when the chip is in vacuum. Thus, if the power density in any of the bias resistors are higher than these values, it is difficult to keep the chip in superconducting state. With the positive feedback from a local hot spot under current bias, the chip rapidly heats up due to Joule heating. To increase the limit of power density, we propose an encapsulation method that increases the heat flux capacity of the system. With the encapsulation, the heat flux capacity of the system is increased to about 0.4 W/cm${}^{2}$.

DOI
10.3906/elk-1903-164

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With the current progress of superconducting integrated circuits, circuit complexities have reached more than 100,000 Josephson junctions. At the laboratory environment, circuit tests are generally being conducted at liquid Helium environments. With the commercialization of the superconducting integrated circuit-based systems and/or price increase of liquid Helium, utilization of the closed-cycle systems will be inevitable. Even though it is possible to implement closed-cycle systems with quite substantial excess cooling powers after all the wirings and peripheral circuits, one point not to be overlooked is the power density at the superconducting chips. We have observed that the circuits designed for operation at liquid Helium bath have much higher power densities that exceed the heat flux capacities of closed-cycle cryocoolers. We have measured that the heat flux capacities of closed-cycle systems are about 0.1 W/cm2{}^{2}2 when the chip is in vacuum. Thus, if the power density in any of the bias resistors are higher than these values, it is difficult to keep the chip in superconducting state. With the positive feedback from a local hot spot under current bias, the chip rapidly heats up due to Joule heating. To increase the limit of power density, we propose an encapsulation method that increases the heat flux capacity of the system. With the encapsulation, the heat flux capacity of the system is increased to about 0.4 W/cm2{}^{2}2.
We demonstrate a packaging system/test probe suitable for testing complex, large scale superconducting integrated circuits with thousands of Josephson junctions. The cryopackage is designed to work with a 1 cm superconducting die, with liquid He immersion cooling using a standard storage dewar. The package has 80 high-speed input-output lines (DC to 20 GHz) which connect the chip to room temperature electronics. The tip of the cryopackage, containing the chip, is shielded from the ambient magnetic field with two mumetal cylinders and contains a built-in coil, which provides in-situ degaussing of the inner shield. To clear flux trapped in the chip being tested, the probe contains a novel gas manifold and a system of heaters. During the defluxing operation, a heater evaporates liquid helium inside the chip enclosure, the expanding vapor purging the liquid from the sample cell and warming the chip above its transition temperature. Once the chip is defluxed, the liquid helium is allowed back into the cell, at a rate slow enough to avoid trapping flux in the chip while it is cooled. The process can be automated and does not require any movement of the probe once inserted in the dewar.
Future development of superconductor digital and mixed-signal ICs requires extensive testing with a large number of input/output (I/O) lines for applying independent bias controls, injecting test signals, and monitoring outputs of different sub-circuits. There is a growing need for a standardized test apparatus for a variety of complex superconducting chips and multichip modules (MCMs). Such a test apparatus must support many I/O lines, be easy and cost-effective to operate, and support prolonged automated testing. Existing test apparatus include liquid He cryoprobes and cryocooled custom digital-RF systems, both of which have drawbacks. Liquid He cryoprobes with universal wiring, such as 40 or 80 coaxial cables, are convenient to use. Cooled by immersion in a tank filled with liquid He, these cryoprobes allow rapid cool-down and warm-up. However, large consumption of liquid He, the cost of which has been steadily increasing worldwide, makes this solution rather expensive and wasteful. On the other hand, one can exploit the modular reconfigurability of HYPRES' digital-RF receiver product to create a testbed for different ICs. Such a system uses the smallest commercially available closed-cycle refrigerator (~1.2 kW) and has negligible operating cost. However, reconfiguration takes time and expertise since these products are specially designed with customized chip package and wiring to minimize the thermal load on the cryocooler. These low-maintenance systems are ideal for prolonged operation of a single chip, which is invaluable for superconductor electronics system developers and end-users. The integrated cryoelectronics testbed (ICE-T) combines the advantages of the liquid He cryoprobe and the cryocooled digital-RF product. By using a more powerful, commercially available, electrically powered closed-cycle refrigerator (7 kW), ICE-T alleviates the thermal constraints on wiring while maintaining very low operating cost. By separating the electrical and thermal subsystems, it maintains modularity without sacrificing the universality of the cryoprobe. A set of universal and custom electrical modules can be independently built and inserted in ICE-T. Universal inserts with 40 and 80 coaxial cables accommodate all chips with standard I/O pads like the familiar liquid He cryoprobes. Custom inserts for different classes of chips and MCMs are designed and built according to user requirements and specifications. The utility of the ICE-T was successfully demonstrated by testing a benchmark superconducting digital circuit at low frequency and an analog-to-digital converter chip clocked above 20 GHz.
Abstract Temperature sensing and control are essential in experiments running in cryocooled systems, as with the case of liquid helium-free superconducting devices. A Josephson junction as on-chip temperature sensor operated in ac provides the highest sensitivity and minimal power loading to the cryogenic environment, thanks to the noise rejection of lock-in detection. To demonstrate the advantages of on-chip sensing, we tested it with a Josephson voltage standard array in cryocooler and compared with the conventional case of a sensor on the cold surface of the refrigerator, showing that the power dissipated within the chip may further increment the device temperature up to some tenths of kelvin. An ac Josephson junction sensor is proven to be capable of directly stabilizing the temperature of the superconductive circuit from fluctuations of dissipated power during operation. Reliability issues related to flux trapping are discussed and solutions are proposed suited to different applications. Overall, on-chip control with ac Josephson temperature sensing has the advantage of avoiding the complexities in minimization of cryogenic thermal links, virtually reducing to zero the contact resistance and keeping the operating temperature of the superconductor constant, independently of instantaneous operating power.
Low energy dissipation and ability to operate at low temperatures provide for Josephson junction circuits a niche as a support for low temperature devices. With high speed operation (Chen W. et al., 1999) capability the Josephson junction circuits make a prime candidate for applications which are difficult to engineer with existing CMOS technology. The development of Josephson junction technology took a major turn for the better with the invention of the Rapid-Single-Flux-Quantum (RSFQ) devices (Likharev K.K. et al., 1991), an improvement over voltage biased Josephson Junctions logic which were plagued with the junction switching and reset problems. The modern applications of SFQ circuits extend to a larger range of temperature operation and the applications vary from low temperature magnetic sensor, to high speed mixed signal circuits, voltage and current standards (Turner C.W. et al., 1998), and auxiliary components for quantum computing circuits. Most of the SFQ circuits are fabricated with Niobium, but Aluminum based circuits are being used for quantum gates (Nielsen M.A. et al., 2000) and qubit operations. SFQ circuits based on Magnesium di-Boride junctions are being developed for higher temperature operations (Tahara S. et al., 2004). Predominantly most of the Josephson junction circuits today are operated at around 4K. All the circuits are optimized usually for liquid helium temperatures, so the circuits operated in helium bath Dewars or cryostat's do not experience any temperature gradients or drift effects which can affect the operating margins. With the improvement in the fabrication technology and soft-wares for SFQ circuit technology, the designing complex circuits have become easier. Complex Circuits with over 20K junctions such digital synthesizer and digital RF Trans-receiver have already been demonstrated (Oleg M.A. et al., 2011). Development of circuits over 100K junctions are actively under progress. However, with enormously large circuits, power requirements also increase. Looking at the range of applications and complexity of the problems of energy minimization, we try to look at the problem in two approaches. One for large complex circuits, we try to reduce the power bias itself, or the overall load of current that is supplied
Niobium based rapid-single-flux-quantum (RSFQ) digital circuits generally operate at temperature 4 K. It is desirable to develop RSFQ circuits for operation at much lower temperatures, in particular to use as control and interface circuitry for superconducting qubits, and eventually for a full scale quantum computer. The total heat load is moderate - current designs generate 0.5 /spl mu/W per bias resistor, so simple RSFQ integrated circuits are easily compatible with commercial helium dilution refrigerators, and this power can readily be reduced by several orders of magnitude for complex future designs - but thermal conductivity will be a bottleneck. We present a simple model of heat flow through standard RSFQ structures. We find that circuits designed for 4 K operation can be used with little or no modification below one Kelvin. At lower temperatures however the heat generated on chip cannot be removed, and the temperature of a working circuit will rise. We suggest fabrication design rule changes to address this problem.
Rapid single flux quantum (RSFQ) electronics is based on the Josephson junction as an active switching element. In standard RSFQ circuits its switching energy is much lower than the static power consumption caused by the resistive current distribution network. Due to this thermal heating of the chip, the maximum number of junctions on a single chip is limited to about 1 million. The frequency-dependent contribution to power dissipation from junction switchings is only about 2 percent of the static one. This fact limits the direct construction of VLSI systems for high-performance computing as well as small-scale circuit applications in the vicinity of ultra-sensitive detectors or even quantum circuits. We present an assessment of different approaches for reducing the static power consumption by investigating the potential of inductive bias distribution networks as well as reduced critical currents. We analyse the operation stability of simple digital circuits with 5 times smaller critical currents at 4.2 K. The combination of the reduced critical currents and inductive biasing can provide digital superconductive circuits with significantly reduced static power consumption.