IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Superconducting sampling measurement system for characterization of electronic packaging
Masahiro Aoyagi, Hiroshi Sato, Hiroshi Nakagawa, Hiroshi Akoh, Hannes Toepfer
Abstract
A superconducting sampling measurement system is a highly useful tool for analyzing ultrahigh speed electrical signals in cryogenic environments, due to a time resolution at ps levels with low current levels of /spl mu/A. The digitizing sampling system is composed of a Josephson sampling circuit, digital delay line, feedback signal detection circuit and a computer. The Josephson sampling circuit is designed for ETL's Nb-AlO/sub x/-Nb junction technology. A TDR measurement method using a CPW flip-chip bonding technique is proposed. The theoretical spatial resolution is estimated to reach around a hundred /spl mu/m.