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IEEE Transactions on Magnetics

Submicron NbN Josephson tunnel junctions for digital applications

Masahiro Aoyagi, Alexandre Shoji, S. Kosaka, Hiroshi Nakagawa, S. Takada

Published Mar 1, 1989• 9 citations
Publisher

Abstract

Submicron NbN/MgO/NbN Josephson tunnel junctions for Josephson integrated circuits were investigated. The junctions have been fabricated by the cross-line patterning (CLIP) method with an electron-beam (EB) direct-writing technique. The all-refractory fabrication process for logic circuits using the CLIP method is presented. This process is applied to the fabrication of a logic gate of 4JL containing 0.8- mu m-square junctions as an example of digital application. A logic gate has been fabricated by this process, and its characteristics are discussed.>

DOI
10.1109/20.92516

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IEEE Transactions on Magnetics•Mar 1, 1987•38 citations
Submicron NbN/MgO/NbN Josephson tunnel junctions for Josephson integrated circuits were investigated. The junctions have been fabricated by the cross-line patterning (CLIP) method with an electron-beam (EB) direct-writing technique. The all-refractory fabrication process for logic circuits using the CLIP method is presented. This process is applied to the fabrication of a logic gate of 4JL containing 0.8- mu m-square junctions as an example of digital application. A logic gate has been fabricated by this process, and its characteristics are discussed.>
For enhancing operating speed of a superconducting integrated circuit (IC), the device size must be reduced into the submicron level. For this purpose, we have introduced electron beam (EB) direct writing technique into the fabrication process of a Nb/AlOx/Nb Josephson IC. A two-layer (PMMA/(alpha) M-CMS) resist method called the portable conformable mask (PCM) method was utilized for having a high aspect ratio. The electron cyclotron resonance (ECR) plasma etching technique was utilized. We have fabricated micron or submicron-size Nb/AlOx/Nb Josephson junctions, where the size of the junction was varied from 2 micrometer to 0.5 micrometer at 0.1 micrometer intervals. These junctions were designed for evaluating the spread of the junction critical current. We achieved minimum-to-maximum Ic spread of plus or minus 13% for 0.81-micrometer-square (plus or minus 16% for 0.67-micrometer-square) 100 junctions spreading in 130- micrometer-square area. The size deviation of 0.05 micrometer was estimated from the spread values. We have successfully demonstrated a small-scale logic IC with 0.9-micrometer-square junctions having a 50 4JL OR-gate chain, where 4JL means four junctions logic family. The circuit was designed for measuring the gate delay. We obtained a preliminary result of the OR- gate logic delay, where the minimum delay was 8.6 ps/gate.
A novel process suitable for fabricating superconducting circuitry based on the all refractory material NbN is described. In this process, an in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 5mV have been achieved for high quality junctions. In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators.
The development of submicron area mixer elements for operation in the submillimeter wave range is discussed. High-current-density NbN/MgO/NbN tunnel junctions with areas down to 0.1 mu m/sup 2/ have been fabricated in both planar and edge geometries. The planar junctions were fabricated from in situ deposited trilayers using electron-beam lithography to pattern submicron area mesas. Modifications of fabrication techniques used in larger-area NbN tunnel junctions are required and are discussed. The NbN/MgO/NbN edge junction process using sapphire substrates has been transferred to technologically important quartz substrates using MgO buffer layers to minimize substrate interactions. The two junction geometries are compared and contrasted in the context of submillimeter wave mixer applications.
The authors report on the fabrication and testing of all-refractory NbN/MgO/NbN SIS (superconductor-insulator-superconductor) tunnel junctions for use as high-frequency mixers. Progress in the development of techniques for the fabrication of submicron-area tunnel junctions is described. Junction structures which have been investigated include mesa, crossline, and edge geometries. Using reactive sputtering techniques, NbN tunnel junctions with critical currents in excess of 10/sup 4/ A/cm/sup 2/ have been fabricated with V/sub m/ values as high as 65 mV and areas down to 0.1 mu m/sup 2/. Specific capacitance measurements on NbN/MgO/NbN mesa-type tunnel junctions give values in the range 60-90 fF/ mu m/sup 2/. These SIS tunnel junctions have been integrated with antennas and coupling structures for mixer tests in a waveguide receiver at 207 GHz. Preliminary mixer results are reported.>
We report the fabrication of all-refractory superconductor-insulator-superconductor tunnel junctions of the form NbN/MgO/NbN. The MgO insulating barrier was deposited by e-beam evaporation. High quality junctions were fabricated with sum gaps of 5.2 meV, and a small subgap leakage parameter (Vm=30 mV, measured at 3mV). These devices are for eventual use as quasiparticle mixer elements in millimeter/submiltimeter wave heterodyne receivers. Fabrication techniques and current-voltage characteristics are discussed. We also propose a new growth mode for MgO films on NbN.