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IEEE Transactions on Magnetics

Submicron area NbN/MgO/NbN tunnel junctions for SIS mixer applications

Henry George LeDuc, A. Judas, S.R. Cypher, B. Bumble, B. D. Hunt, Jeff A. Stern

Published Mar 1, 1991• 22 citations
Publisher

Abstract

The development of submicron area mixer elements for operation in the submillimeter wave range is discussed. High-current-density NbN/MgO/NbN tunnel junctions with areas down to 0.1 mu m/sup 2/ have been fabricated in both planar and edge geometries. The planar junctions were fabricated from in situ deposited trilayers using electron-beam lithography to pattern submicron area mesas. Modifications of fabrication techniques used in larger-area NbN tunnel junctions are required and are discussed. The NbN/MgO/NbN edge junction process using sapphire substrates has been transferred to technologically important quartz substrates using MgO buffer layers to minimize substrate interactions. The two junction geometries are compared and contrasted in the context of submillimeter wave mixer applications.

DOI
10.1109/20.133890

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The authors report on the fabrication and testing of all-refractory NbN/MgO/NbN SIS (superconductor-insulator-superconductor) tunnel junctions for use as high-frequency mixers. Progress in the development of techniques for the fabrication of submicron-area tunnel junctions is described. Junction structures which have been investigated include mesa, crossline, and edge geometries. Using reactive sputtering techniques, NbN tunnel junctions with critical currents in excess of 10/sup 4/ A/cm/sup 2/ have been fabricated with V/sub m/ values as high as 65 mV and areas down to 0.1 mu m/sup 2/. Specific capacitance measurements on NbN/MgO/NbN mesa-type tunnel junctions give values in the range 60-90 fF/ mu m/sup 2/. These SIS tunnel junctions have been integrated with antennas and coupling structures for mixer tests in a waveguide receiver at 207 GHz. Preliminary mixer results are reported.>

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Processing and characterization of high Jc NbN superconducting tunnel junctions for THz analog circuits and RSFQ

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A generic NbN Superconducting Tunnel Junctions (STJ) technology has been developed using conventional substrates (Si and SOI-SIMOX) for making THz spectrometers including SIS receivers and RSFQ logic gates. NbN/MgO/NbN junctions with area of 1 /spl mu/m/sup 2/, Jc of 10 kA/cm/sup 2/ and low sub-gap leakage current (Vm>25 mV) are currently obtained from room temperature sputtered multilayers followed by a post-annealing at 250/spl deg/C. Using a thin MgO buffer layer deposited underneath the NbN electrodes, ensures lower NbN surface resistance values (Rs=7 /spl mu//spl Omega/) at 10 GHz and 4 K. Epitaxial NbN [100] films on MgO [100] with high gap frequency (1.4 THz) have also been achieved under the same deposition conditions at room temperature. The NbN SIS has shown good I-V photon induced steps when LO pumped at 300 GHz. We have developed an 8 levels Al/NbN multilayer process for making 1.5 THz SIS mixers (including Al antennas) on Si membranes patterned in SOI-SIMOX. Using the planarization techniques developed at the Si-MOS CEA-LETI Facility, we have also demonstrated on the possibility of extending our NbN technology to high level RSFQ circuit integration with 0.5 /spl mu/m/sup 2/ junction area, made on large area substrates (up to 8 inches).

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The development of submicron area mixer elements for operation in the submillimeter wave range is discussed. High-current-density NbN/MgO/NbN tunnel junctions with areas down to 0.1 mu m/sup 2/ have been fabricated in both planar and edge geometries. The planar junctions were fabricated from in situ deposited trilayers using electron-beam lithography to pattern submicron area mesas. Modifications of fabrication techniques used in larger-area NbN tunnel junctions are required and are discussed. The NbN/MgO/NbN edge junction process using sapphire substrates has been transferred to technologically important quartz substrates using MgO buffer layers to minimize substrate interactions. The two junction geometries are compared and contrasted in the context of submillimeter wave mixer applications.
The authors report on the fabrication and testing of all-refractory NbN/MgO/NbN SIS (superconductor-insulator-superconductor) tunnel junctions for use as high-frequency mixers. Progress in the development of techniques for the fabrication of submicron-area tunnel junctions is described. Junction structures which have been investigated include mesa, crossline, and edge geometries. Using reactive sputtering techniques, NbN tunnel junctions with critical currents in excess of 10/sup 4/ A/cm/sup 2/ have been fabricated with V/sub m/ values as high as 65 mV and areas down to 0.1 mu m/sup 2/. Specific capacitance measurements on NbN/MgO/NbN mesa-type tunnel junctions give values in the range 60-90 fF/ mu m/sup 2/. These SIS tunnel junctions have been integrated with antennas and coupling structures for mixer tests in a waveguide receiver at 207 GHz. Preliminary mixer results are reported.>
At near-millimeter wavelengths, heterodyne receivers based on SIS tunnel junctions are the most sensitive available. However, in order to scale these results to submillimeter wavelengths, certain device properties should be scaled. The tunnel-junction's current density should be increased to reduce the RC product. The device's area should be reduced to efficiently couple power from the antenna to the mixer. Finally, the superconductor used should have a large energy gap to minimize RF losses. Most SIS mixers use Nb or Pb-alloy tunnel junctions; the gap frequency for these materials is approximately 725 GHz. Above the gap frequency, these materials exhibit losses similar to those in a normal metal. The gap frequency in NbN films is as-large-as 1440 GHz. Therefore, we have developed a process to fabricate small area (down to 0.13 sq microns), high current density, NbN/MgO/NbN tunnel junctions.
Small area (<or=1- mu m/sup 2/), high-current-density NbN-MgO-NbN tunnel junctions with I-V characteristics suitable for high-frequency mixers have been fabricated. Mesa-geometry junctions with an area of about 1 mu m/sup 2/ and critical current density of 5-10 kA/cm/sup 2/ are integrated with superconducting microstrip lines designed to resonate out the junction capacitance. Accurate values of junction capacitance and magnetic penetration depth are required for the proper design of the microstrip. A study was made of the mixer gain and noise performance near 205 GHz as a function of the inductance provided by the microstrip line. This has confirmed, at a high millimeter-wave frequency, values of junction capacitance of 85 fF/ mu m/sup 2/ and recently measured values of a magnetic penetration depth of 380 nm. Mixer noise temperatures as low as 134 K at 1.5 K have been obtained for properly tuned junctions. A significant improvement in mixer performance on cooling from 4.2 K to 1.5 K was observed. Edge-geometry junctions with an area of 0.3 mu m/sup 3/ and critical current density of 18-25 kA/cm/sup 2/ have also been fabricated. These junctions give a mixer noise temperature of 145 K at 4.2 K without the use of integrated tuning elements. These are the best results ever achieved for NbN-based SIS mixers.
This thesis describes the development and testing of NbN/MgO/NbN tunnel junctions for use as superconductor-insulator-superconductor (SIS) mixers. SIS mixers are the most sensitive heterodyne detectors in the millimeter wavelength region. Most SIS mixers use Pb alloy tunnel junction. These tunnel junctions have several problems associated with the soft nature of Pb and its low superconducting transition temperature. NbN-based tunnel junctions are being developed to overcome these difficulties. These devices are intended to be used as mixers at millimeter and submillimeter wavelengths. This thesis describes the fabrication process involved in making NbN junctions, and the results of measurements on these devices. The purpose of these measurements is to determine the future possibilities of NbN tunnel junctions as high-frequency mixers. The first chapter is an introduction to SIS mixers and explains how tunnel junction properties affect mixer performance. The basic theory of tunneling and mixing in SIS mixers is first presented. A description of quantum mixer theory is included in this presentation. This theory makes several interesting predictions that cannot be explained using classical theories. This is followed by a description of how real SIS tunnel junctions differ from ideal junctions. The physical origin of these differences is discussed, along with how they affect SIS mixer performance. Finally, the advantages and disadvantages of the various superconducting materials available are discussed. The decision to develop NbN devices is based on these material properties. The second chapter describes the methods used to fabricate small-area NbN/MgO/NbN tunnel junctions. The chapter begins with a description of the various methods that have been used to deposit NbN films. Reactive magnetron sputtering is chosen as the best method for tunnel junction fabrication. Details on the vacuum systems and the methods used for depositing superconducting NbN are discussed. Next, the process used for depositing junction trilayers (NbN/MgO/NbN) is described. The probable growth mode of MgO on NbN is presented. The importance of this growth mode to the junction quality is explained in some detail. Next, standard junction processing steps are reported. The details and limitations of each step are put forth. The standard process allows for the fabrication of 1 [square micron] tunnel junctions. Finally, this chapter discusses several methods of fabaricating submicron junctions that are being pursued. The status of this work is given. The third chapter describes the characterization of NbN films and NbN/Mg0/NbN tunnel junctions. Film properties are described first. The correlation of these properties to deposition conditions is discussed in some detail. Next, values for the various features of the I-V characteristic are given; typical and exceptional values are noted. How these features limit mixer results is described in detail. Several important device attributes were measured using superconducting-quantum-interference-devices (SQUIDs). These attributes are the junction's specific capacitance and the film's magnetic penetration depth. The theory and results of measuring specific capacitance and penetration depth are presented. Following the SQUID results is a large section on RP testing. Mixer tests were made at 205 GHz. The receiver design used, integral inductive tuning circuit used and results are discussed. These results are well understood, with the exception of the temperature dependence of the mixer performance. Finally, measurements of the uniformity of many junctions on a single wafer are presented. The importance of junction uniformity is also described. The final chapter discusses the ultimate limits on NbN mixers, and tells what future work must be done to achieve these limits. The primary high-frequency limit on NbN junctions is the capacitance of NbN/MgO/NbN junctions. The limit imposed by the junction capacitance and circuits used to tune out this capacitance are discussed. Also, the low-frequency limits on NbN junctions are discussed. The status of submicron devices is presented. Junction area is the most immediate limitation on NbN mixer results. The possibility of using other barrier materials to increase the RC speed of NbN junctions is presented. Finally, the possibility of operating NbN junctions at temperatures above 4.2 K is discussed.
A generic NbN Superconducting Tunnel Junctions (STJ) technology has been developed using conventional substrates (Si and SOI-SIMOX) for making THz spectrometers including SIS receivers and RSFQ logic gates. NbN/MgO/NbN junctions with area of 1 /spl mu/m/sup 2/, Jc of 10 kA/cm/sup 2/ and low sub-gap leakage current (Vm>25 mV) are currently obtained from room temperature sputtered multilayers followed by a post-annealing at 250/spl deg/C. Using a thin MgO buffer layer deposited underneath the NbN electrodes, ensures lower NbN surface resistance values (Rs=7 /spl mu//spl Omega/) at 10 GHz and 4 K. Epitaxial NbN [100] films on MgO [100] with high gap frequency (1.4 THz) have also been achieved under the same deposition conditions at room temperature. The NbN SIS has shown good I-V photon induced steps when LO pumped at 300 GHz. We have developed an 8 levels Al/NbN multilayer process for making 1.5 THz SIS mixers (including Al antennas) on Si membranes patterned in SOI-SIMOX. Using the planarization techniques developed at the Si-MOS CEA-LETI Facility, we have also demonstrated on the possibility of extending our NbN technology to high level RSFQ circuit integration with 0.5 /spl mu/m/sup 2/ junction area, made on large area substrates (up to 8 inches).