IEICE Transactions on Electronics
Advances in High-Tc Single Flux Quantum Device Technologies
K. TANABE, H. Wakana, Koji Tsubone, Y. Tarutani, S. ADACHI, Yoshihiro Ishimaru, Michitaka Maruyama, Tsunehiro Hato, Akira Yoshida, Hideo Suzuki
Abstract
We have developed the fabrication process, the circuit design technology, and the cryopackaging technology for high-Tc single flux quantum (SFQ) devices with the aim of application to an analog-to-digital (A/D) converter circuit for future wireless communication and a sampler system for high-speed measurements. Reproducibility of fabricating rampedge Josephson junctions with IcRn products above 1mV at 40K and small Ic spreads on a superconducting groundplane was much improved by employing smooth multilayer structures and optimizing the junction fabrication process. The separated base-electrode layout (SBL) method that suppresses the Jc spread for interface-modified junctions in circuits was developed. This method enabled low-frequency logic operations of various elementary SFQ circuits with relatively wide bias current margins and operation of a toggle-flip-flop (T-FF) above 200GHz at 40K. Operation of a 1:2 demultiplexer, one of main elements of a hybrid-type Σ-Δ A/D converter circuit, was also demonstrated. We developed a sampler system in which a sampler circuit with a potential bandwidth over 100GHz was cooled by a compact stirling cooler, and waveform observation experiments confirmed the actual system bandwidth well over 50GHz.