Superconducting quantum computing is advancing toward the thousand- and even million-qubit regime, making wafer-scale fabrication an essential pathway for achieving large-scale, cost-effective quantum processors. This manufacturing paradigm imposes new requirements on quantum-chip electronic design automation (Q-EDA): design tools must not only generate layouts (GDSII files) that satisfy quantum-circuit physical constraints but also ensure that the design data can be seamlessly converted into a complete set of manufacturing files executable by a wafer foundry, thereby enabling reliable translation from design intent to physical chip. This paper focuses on this critical data-conversion pipeline and presents a systematic treatment of the Q-EDA technology stack for wafer-scale fabrication. Starting from GDSII as the single authoritative data source, we analyze the key stages including process-design-kit (PDK)-based design rule checking (DRC), layout-versus-schematic (LVS) verification, design for manufacturability (DFM) optimization, wafer layout planning, and mask data preparation (MDP). We describe the concrete architecture of a Q-EDA system, present nine quantum-specific DRC rules together with their physical underpinnings and a multi-layer process stack model, and benchmark the manufacturing data-flow coverage of mainstream Q-EDA tools. Finally, we discuss the core challenges and future directions in this field.
Superconducting quantum computing is advancing toward the thousand- and even million-qubit regime, making wafer-scale fabrication an essential pathway for achieving large-scale, cost-effective quantum processors. This manufacturing paradigm imposes new requirements on quantum-chip electronic design automation (Q-EDA): design tools must not only generate layouts (GDSII files) that satisfy quantum-circuit physical constraints but also ensure that the design data can be seamlessly converted into a complete set of manufacturing files executable by a wafer foundry, thereby enabling reliable translation from design intent to physical chip. This paper focuses on this critical data-conversion pipeline and presents a systematic treatment of the Q-EDA technology stack for wafer-scale fabrication. Starting from GDSII as the single authoritative data source, we analyze the key stages including process-design-kit (PDK)-based design rule checking (DRC), layout-versus-schematic (LVS) verification, design for manufacturability (DFM) optimization, wafer layout planning, and mask data preparation (MDP). We describe the concrete architecture of a Q-EDA system, present nine quantum-specific DRC rules together with their physical underpinnings and a multi-layer process stack model, and benchmark the manufacturing data-flow coverage of mainstream Q-EDA tools. Finally, we discuss the core challenges and future directions in this field.
Electronic Design Automation (EDA) plays a crucial role in classical chip design and significantly influences the development of quantum chip design. However, traditional EDA tools cannot be directly applied to quantum chip design due to vast differences compared to the classical realm. Several EDA products tailored for quantum chip design currently exist, yet they only cover partial stages of the quantum chip design process instead of offering a fully comprehensive solution. Additionally, they often encounter issues such as limited automation, steep learning curves, challenges in integrating with actual fabrication processes, and difficulties in expanding functionality. To address these issues, we developed a full-stack EDA tool specifically for quantum chip design, called EDA-Q. The design workflow incorporates functionalities present in existing quantum EDA tools while supplementing critical design stages such as device mapping and fabrication process mapping, which users expect. EDA-Q utilizes a unique architecture to achieve exceptional scalability and flexibility. The integrated design mode guarantees algorithm compatibility with different chip components, while employing a specialized interactive processing mode to offer users a straightforward and adaptable command interface. Application examples demonstrate that EDA-Q significantly reduces chip design cycles, enhances automation levels, and decreases the time required for manual intervention. Multiple rounds of testing on the designed chip have validated the effectiveness of EDA-Q in practical applications.
Quantum Electronic Design Automation (Q-EDA) is emerging as quantum chips move from laboratory prototypes to scalable engineering systems. This paper argues that superconducting quantum chip design is approaching a "SPICE moment" similar to early classical EDA, where growing qubit scale, control complexity, frequency planning, packaging, process variation, and cryogenic measurement feedback require a shift from experience-based design to model-driven engineering. We propose a Quantum Chip Paradigm Framework that treats Q-EDA not only as software, but as part of the quantum chip development paradigm. Unlike classical HDL-first design, quantum chip design must begin with physical structures such as Josephson junctions, resonators, couplers, readout elements, control lines, and packaging environments. The framework emphasizes PCell-based modeling, SPICE-Q simulation, Quantum PDKs, and design-technology-measurement co-optimization. We further outline a hierarchical Q-EDA system spanning physical structures, qubit PCells, logical qubits, quantum arithmetic, functional quantum IP, and Quantum SoC systems. The key goal is to turn physical models, layout rules, simulation results, fabrication data, and measurement feedback into reusable and auditable engineering objects for large-scale quantum processors and fault-tolerant quantum computing.
We propose SPICE-Q, a SPICE-inspired design-technology co-optimization framework for superconducting quantum processors. Rather than replacing tools such as HFSS, Qiskit Metal, pyEPR, SQcircuit, SQuADDS, scqubits, or QuTiP, SPICE-Q aims to connect them through a unified, traceable data chain spanning process rules, layout, electromagnetic simulation, energy-participation-ratio and circuit quantization, Hamiltonian extraction, noise analysis, cryogenic test, and manufacturing feedback. The central mapping is from process and PDK constraints to layout geometry, electromagnetic modes, equivalent circuit parameters, effective Hamiltonians, and finally metrics such as frequency, coupling, anharmonicity, decoherence, readout performance, and yield. This flow must capture Josephson-junction variability, transmon frequency allocation, resonator and Purcell constraints, coupler crosstalk, microwave routing, 3D interconnects, material/interface loss, package modes, and wafer-scale process statistics. By introducing standardized model interfaces, statistical parameter models, model cards, version governance, and closed-loop calibration from cryogenic and fabrication data, SPICE-Q frames superconducting quantum-chip design as an engineering workflow rather than a collection of isolated simulations. We argue that scalable and fault-tolerant quantum processors will require such a continuous model chain from device physics and electromagnetic fields to quantum dynamics, noise, manufacturability, and system-level yield.
This paper proposes a fabless quantum-chip design and production architecture for superconducting quantum computing, centered on the SPICE-Q multiphysics simulation framework. The proposed ecosystem connects process-certified quantum PDKs, parameterized device cells, traceable model cards, SPICE-Q physical modeling languages, unified Q-EDA flows, foundry sign-off rules, cryogenic test feedback, and reusable quantum IP. In this model, design firms do not merely outsource fabrication; they prepare verified tape-outs under standardized process constraints and calibrated physical models. Its economic value lies in reducing repetitive device debugging, process exploration, and low-level layout effort, while its feasibility depends on PDK maturity, foundry yield, cryogenic test throughput, model-prediction accuracy, data-feedback mechanisms, and IP licensing boundaries. We argue that superconducting quantum chips can move from the current largely vertically integrated development model toward a fabless-foundry ecosystem only when hardware design is supported by standardized, verifiable, and reusable software and process interfaces. The required pillars are certified PDKs, PCell-based parameterized design, SPICE-Q cross-physics simulation, end-to-end Q-EDA automation, and a tradable quantum-IP market. By adapting lessons from the classical semiconductor industry to quantum hardware, this framework defines a path toward scalable, manufacturable, and commercially reusable superconducting quantum-chip design.
Superconducting circuits have emerged as one of the most promising and scalable platforms for quantum com- puting, with substantial industrial adoption driving qubit counts steadily upward. Yet the layout of the corresponding chips is still primarily performed manually, consuming multiple days or weeks of expert effort, even for moderately sized designs. Existing automation approaches sidestep this bottleneck by simplifying the underlying problem and relaxing physical constraints. Therefore, they fall short of fabrication-ready results. To overcome this scalability wall without such compromises, we first introduce a formal abstraction that translates physical device characteristics into a rigorous geometric problem formulation. This abstraction bridges physical realization and design automation. Building upon this abstraction, we then propose a three-stage design automation flow comprising geometry-aware global partitioning, ILP-based port assignment, and a hierarchical routing pipeline. Evaluations conducted by our interdisciplinary team of design au- tomation researchers and superconducting hardware experts con- firm that the resulting flow produces complete, manufacturing- ready layouts that comply with the physical design rules at the push of a button. That is, it operates fully automatically within seconds to a few minutes, and solves complex instances up to 25x faster than the state of the art. All methods are released as the fully open-source tool mqt-scpd as part of the Munich Quantum Toolkit, providing the first readily usable, end- to-end design flow for planar superconducting quantum chips that explicitly addresses the underlying physical characteristics and requirements.
Quantum computing is transitioning from laboratory research to industrial deployment, yet significant challenges persist: system scalability and performance, fabrication yields, and the advancement of algorithms and applications. We emphasize that in building quantum computers -- spanning quantum chips, system integration, instruction sets, algorithms, and middleware such as quantum error correction schemes -- design is everywhere. In this paper, we advocate for a holistic design perspective in quantum computing, a perspective we argue is pivotal to unlocking innovative co-design opportunities and addressing the aforementioned key challenges. To equip readers with sufficient background for exploring co-optimization opportunities, we detail how interconnected computational methods and tools collaborate to enable end-to-end quantum computer design. This coverage encompasses critical stages -- such as chip layout design automation, high-fidelity system-level simulation, Hamiltonian derivation for quantum system modeling, control pulse simulation, decoherence analysis, and physical verification and testing -- followed by quantum instruction set design. We then proceed to quantum system and software development, including quantum circuit synthesis, quantum error correction and fault tolerance, and logic verification and testing. Through these discussions, we illustrate with concrete examples -- including co-optimizing quantum instruction sets with algorithmic considerations, customizing error correction circuits to hardware-specific constraints, and streamlining quantum chip design through tailored code design, among others. We hope that the detailed end-to-end design workflow as well as these examples will foster dialogue between the hardware and software communities, ultimately facilitating the translation of meaningful research findings into future quantum hardware implementations.