Quantum Electronic Design Automation (Q-EDA) is emerging as quantum chips move from laboratory prototypes to scalable engineering systems. This paper argues that superconducting quantum chip design is approaching a "SPICE moment" similar to early classical EDA, where growing qubit scale, control complexity, frequency planning, packaging, process variation, and cryogenic measurement feedback require a shift from experience-based design to model-driven engineering. We propose a Quantum Chip Paradigm Framework that treats Q-EDA not only as software, but as part of the quantum chip development paradigm. Unlike classical HDL-first design, quantum chip design must begin with physical structures such as Josephson junctions, resonators, couplers, readout elements, control lines, and packaging environments. The framework emphasizes PCell-based modeling, SPICE-Q simulation, Quantum PDKs, and design-technology-measurement co-optimization. We further outline a hierarchical Q-EDA system spanning physical structures, qubit PCells, logical qubits, quantum arithmetic, functional quantum IP, and Quantum SoC systems. The key goal is to turn physical models, layout rules, simulation results, fabrication data, and measurement feedback into reusable and auditable engineering objects for large-scale quantum processors and fault-tolerant quantum computing.
Quantum Electronic Design Automation (Q-EDA) is emerging as quantum chips move from laboratory prototypes to scalable engineering systems. This paper argues that superconducting quantum chip design is approaching a "SPICE moment" similar to early classical EDA, where growing qubit scale, control complexity, frequency planning, packaging, process variation, and cryogenic measurement feedback require a shift from experience-based design to model-driven engineering. We propose a Quantum Chip Paradigm Framework that treats Q-EDA not only as software, but as part of the quantum chip development paradigm. Unlike classical HDL-first design, quantum chip design must begin with physical structures such as Josephson junctions, resonators, couplers, readout elements, control lines, and packaging environments. The framework emphasizes PCell-based modeling, SPICE-Q simulation, Quantum PDKs, and design-technology-measurement co-optimization. We further outline a hierarchical Q-EDA system spanning physical structures, qubit PCells, logical qubits, quantum arithmetic, functional quantum IP, and Quantum SoC systems. The key goal is to turn physical models, layout rules, simulation results, fabrication data, and measurement feedback into reusable and auditable engineering objects for large-scale quantum processors and fault-tolerant quantum computing.
This paper proposes a fabless quantum-chip design and production architecture for superconducting quantum computing, centered on the SPICE-Q multiphysics simulation framework. The proposed ecosystem connects process-certified quantum PDKs, parameterized device cells, traceable model cards, SPICE-Q physical modeling languages, unified Q-EDA flows, foundry sign-off rules, cryogenic test feedback, and reusable quantum IP. In this model, design firms do not merely outsource fabrication; they prepare verified tape-outs under standardized process constraints and calibrated physical models. Its economic value lies in reducing repetitive device debugging, process exploration, and low-level layout effort, while its feasibility depends on PDK maturity, foundry yield, cryogenic test throughput, model-prediction accuracy, data-feedback mechanisms, and IP licensing boundaries. We argue that superconducting quantum chips can move from the current largely vertically integrated development model toward a fabless-foundry ecosystem only when hardware design is supported by standardized, verifiable, and reusable software and process interfaces. The required pillars are certified PDKs, PCell-based parameterized design, SPICE-Q cross-physics simulation, end-to-end Q-EDA automation, and a tradable quantum-IP market. By adapting lessons from the classical semiconductor industry to quantum hardware, this framework defines a path toward scalable, manufacturable, and commercially reusable superconducting quantum-chip design.
We propose SPICE-Q, a SPICE-inspired design-technology co-optimization framework for superconducting quantum processors. Rather than replacing tools such as HFSS, Qiskit Metal, pyEPR, SQcircuit, SQuADDS, scqubits, or QuTiP, SPICE-Q aims to connect them through a unified, traceable data chain spanning process rules, layout, electromagnetic simulation, energy-participation-ratio and circuit quantization, Hamiltonian extraction, noise analysis, cryogenic test, and manufacturing feedback. The central mapping is from process and PDK constraints to layout geometry, electromagnetic modes, equivalent circuit parameters, effective Hamiltonians, and finally metrics such as frequency, coupling, anharmonicity, decoherence, readout performance, and yield. This flow must capture Josephson-junction variability, transmon frequency allocation, resonator and Purcell constraints, coupler crosstalk, microwave routing, 3D interconnects, material/interface loss, package modes, and wafer-scale process statistics. By introducing standardized model interfaces, statistical parameter models, model cards, version governance, and closed-loop calibration from cryogenic and fabrication data, SPICE-Q frames superconducting quantum-chip design as an engineering workflow rather than a collection of isolated simulations. We argue that scalable and fault-tolerant quantum processors will require such a continuous model chain from device physics and electromagnetic fields to quantum dynamics, noise, manufacturability, and system-level yield.
Quantum computing is transitioning from laboratory research to industrial deployment, yet significant challenges persist: system scalability and performance, fabrication yields, and the advancement of algorithms and applications. We emphasize that in building quantum computers -- spanning quantum chips, system integration, instruction sets, algorithms, and middleware such as quantum error correction schemes -- design is everywhere. In this paper, we advocate for a holistic design perspective in quantum computing, a perspective we argue is pivotal to unlocking innovative co-design opportunities and addressing the aforementioned key challenges. To equip readers with sufficient background for exploring co-optimization opportunities, we detail how interconnected computational methods and tools collaborate to enable end-to-end quantum computer design. This coverage encompasses critical stages -- such as chip layout design automation, high-fidelity system-level simulation, Hamiltonian derivation for quantum system modeling, control pulse simulation, decoherence analysis, and physical verification and testing -- followed by quantum instruction set design. We then proceed to quantum system and software development, including quantum circuit synthesis, quantum error correction and fault tolerance, and logic verification and testing. Through these discussions, we illustrate with concrete examples -- including co-optimizing quantum instruction sets with algorithmic considerations, customizing error correction circuits to hardware-specific constraints, and streamlining quantum chip design through tailored code design, among others. We hope that the detailed end-to-end design workflow as well as these examples will foster dialogue between the hardware and software communities, ultimately facilitating the translation of meaningful research findings into future quantum hardware implementations.
Superconducting qubits represent a highly promising and scalable quantum hardware technology. The design of these qubits follows a typical microwave circuit design process, where the circuit encompasses multiple resonance frequencies associated with both the resonators and the qubits. Chip design involves the meticulous engineering of resonators and qubits to align the circuit’s various frequencies with predefined values. Additionally, adjusting the coupling between resonators and qubits is essential to meet specific quantum parameters. As the demand for scaling to thousands of qubits grows, it becomes imperative to incorporate systematic engineering and design automation. In this article, we will explore the present requirements for electronic design automation (EDA) that shall enable the design of future superconducting quantum computers.
This work presents a conceptual architecture and technological roadmap for a scalable superconducting quantum computing platform based on modular design principles. Rather than introducing a new qubit technology, the proposal focuses on addressing critical engineering bottlenecks that currently limit the large-scale deployment of quantum processors, including wiring complexity, electromagnetic crosstalk, fabrication yield, and latency in error-correction feedback loops.The proposed framework introduces a modular hybrid architecture (“Quantum Mesh”), where medium-scale quantum chiplets containing 25–50 superconducting transmon qubits are interconnected through advanced 3D packaging and cryogenic infrastructure. This approach aims to improve manufacturing yield, reduce wiring density, and enable rack-level integration of quantum processing units while maintaining high gate fidelities and manageable thermal loads.A second central element of the proposal is the integration of a high-fidelity digital twin environment capable of simulating qubit dynamics, noise sources, control latency, and thermal constraints at nanosecond resolution. This predictive framework is intended to support hardware iteration cycles prior to fabrication, potentially accelerating design optimization and system validation.The document outlines a three-year development pathway targeting 100–200 physical qubits and several logical qubits using surface code error correction, followed by a longer-term scaling strategy toward quantum fabrics exceeding one thousand qubits. By combining modular quantum chiplets, partial cryogenic electronics, and predictive digital twin modeling, the proposed architecture explores a plausible industrial pathway toward large-scale quantum computing systems.
The superconducting qubit quantum computer is one of the most promising quantum computing architectures for large-scale integration due to its maturity and close proximity to the well-established semiconductor manufacturing infrastructure. From an education perspective, it also bridges classical microwave electronics and quantum electrodynamics. In this paper, we will review the basics of quantum computers, superconductivity, and Josephson junctions. We then introduce important technologies and concepts related to DiVincenzo's criteria, which are the necessary conditions for the superconducting qubits to work as a useful quantum computer. Firstly, we will discuss various types of superconducting qubits formed with Josephson junctions, from which we will understand the trade-off across multiple design parameters, including their noise immunity. Secondly, we will discuss different schemes to achieve entanglement gate operations, which are a major bottleneck in achieving more efficient fault-tolerant quantum computing. Thirdly, we will review readout engineering, including the implementations of the Purcell filters and quantum-limited amplifiers. Finally, we will discuss the nature and review the studies of two-level system defects, which are currently the limiting factor of qubit coherence time. DiVincenzo's criteria are only the necessary conditions for a technology to be eligible for quantum computing. To have a useful quantum computer, large-scale integration is required. We will review proposals and developments for the large-scale integration of superconducting qubit devices. By comparing with the application of electronic design automation (EDA) in semiconductors, we will also review the use of EDA in superconducting qubit quantum computer design, which is necessary for its large-scale integration.