Electronic Design Automation (EDA) plays a crucial role in classical chip design and significantly influences the development of quantum chip design. However, traditional EDA tools cannot be directly applied to quantum chip design due to vast differences compared to the classical realm. Several EDA products tailored for quantum chip design currently exist, yet they only cover partial stages of the quantum chip design process instead of offering a fully comprehensive solution. Additionally, they often encounter issues such as limited automation, steep learning curves, challenges in integrating with actual fabrication processes, and difficulties in expanding functionality. To address these issues, we developed a full-stack EDA tool specifically for quantum chip design, called EDA-Q. The design workflow incorporates functionalities present in existing quantum EDA tools while supplementing critical design stages such as device mapping and fabrication process mapping, which users expect. EDA-Q utilizes a unique architecture to achieve exceptional scalability and flexibility. The integrated design mode guarantees algorithm compatibility with different chip components, while employing a specialized interactive processing mode to offer users a straightforward and adaptable command interface. Application examples demonstrate that EDA-Q significantly reduces chip design cycles, enhances automation levels, and decreases the time required for manual intervention. Multiple rounds of testing on the designed chip have validated the effectiveness of EDA-Q in practical applications.
Electronic Design Automation (EDA) plays a crucial role in classical chip design and significantly influences the development of quantum chip design. However, traditional EDA tools cannot be directly applied to quantum chip design due to vast differences compared to the classical realm. Several EDA products tailored for quantum chip design currently exist, yet they only cover partial stages of the quantum chip design process instead of offering a fully comprehensive solution. Additionally, they often encounter issues such as limited automation, steep learning curves, challenges in integrating with actual fabrication processes, and difficulties in expanding functionality. To address these issues, we developed a full-stack EDA tool specifically for quantum chip design, called EDA-Q. The design workflow incorporates functionalities present in existing quantum EDA tools while supplementing critical design stages such as device mapping and fabrication process mapping, which users expect. EDA-Q utilizes a unique architecture to achieve exceptional scalability and flexibility. The integrated design mode guarantees algorithm compatibility with different chip components, while employing a specialized interactive processing mode to offer users a straightforward and adaptable command interface. Application examples demonstrate that EDA-Q significantly reduces chip design cycles, enhances automation levels, and decreases the time required for manual intervention. Multiple rounds of testing on the designed chip have validated the effectiveness of EDA-Q in practical applications.
Design, simulation, analysis and verification methodologies are crucial for developing electronic circuits and systems at large. Whereas long-standing EDA software is used in the semiconductor technology, there is no counterpart for quantum computing systems yet. Although the quantum computing community started utilizing and adapting some of the already existing EDA tools, for instance, to design quantum processors and control electronics for driving the qubits, or even to solve some quantum computing design tasks, they do not fully use the expertise gained over the last decades in the field of design automation. Current intermediate-scale quantum computers have been designed in an ‘adhoc’ manner with heterogeneous methods and tools. As we are entering the large-scale era, it is timely and key to further adopt EDA methodologies and software for quantum computing. In this paper, we provide an overview on how full-stack quantum computing systems are being implemented nowadays and discuss which the main challenges are for transitioning from this current scenario to a comprehensive framework encompassing full automated system-wide architecting, design, simulation, verification, and test.
Superconducting quantum computing is advancing toward the thousand- and even million-qubit regime, making wafer-scale fabrication an essential pathway for achieving large-scale, cost-effective quantum processors. This manufacturing paradigm imposes new requirements on quantum-chip electronic design automation (Q-EDA): design tools must not only generate layouts (GDSII files) that satisfy quantum-circuit physical constraints but also ensure that the design data can be seamlessly converted into a complete set of manufacturing files executable by a wafer foundry, thereby enabling reliable translation from design intent to physical chip. This paper focuses on this critical data-conversion pipeline and presents a systematic treatment of the Q-EDA technology stack for wafer-scale fabrication. Starting from GDSII as the single authoritative data source, we analyze the key stages including process-design-kit (PDK)-based design rule checking (DRC), layout-versus-schematic (LVS) verification, design for manufacturability (DFM) optimization, wafer layout planning, and mask data preparation (MDP). We describe the concrete architecture of a Q-EDA system, present nine quantum-specific DRC rules together with their physical underpinnings and a multi-layer process stack model, and benchmark the manufacturing data-flow coverage of mainstream Q-EDA tools. Finally, we discuss the core challenges and future directions in this field.
Superconducting qubits represent a highly promising and scalable quantum hardware technology. The design of these qubits follows a typical microwave circuit design process, where the circuit encompasses multiple resonance frequencies associated with both the resonators and the qubits. Chip design involves the meticulous engineering of resonators and qubits to align the circuit’s various frequencies with predefined values. Additionally, adjusting the coupling between resonators and qubits is essential to meet specific quantum parameters. As the demand for scaling to thousands of qubits grows, it becomes imperative to incorporate systematic engineering and design automation. In this article, we will explore the present requirements for electronic design automation (EDA) that shall enable the design of future superconducting quantum computers.
Quantum Electronic Design Automation (Q-EDA) is emerging as quantum chips move from laboratory prototypes to scalable engineering systems. This paper argues that superconducting quantum chip design is approaching a "SPICE moment" similar to early classical EDA, where growing qubit scale, control complexity, frequency planning, packaging, process variation, and cryogenic measurement feedback require a shift from experience-based design to model-driven engineering. We propose a Quantum Chip Paradigm Framework that treats Q-EDA not only as software, but as part of the quantum chip development paradigm. Unlike classical HDL-first design, quantum chip design must begin with physical structures such as Josephson junctions, resonators, couplers, readout elements, control lines, and packaging environments. The framework emphasizes PCell-based modeling, SPICE-Q simulation, Quantum PDKs, and design-technology-measurement co-optimization. We further outline a hierarchical Q-EDA system spanning physical structures, qubit PCells, logical qubits, quantum arithmetic, functional quantum IP, and Quantum SoC systems. The key goal is to turn physical models, layout rules, simulation results, fabrication data, and measurement feedback into reusable and auditable engineering objects for large-scale quantum processors and fault-tolerant quantum computing.
This paper proposes a fabless quantum-chip design and production architecture for superconducting quantum computing, centered on the SPICE-Q multiphysics simulation framework. The proposed ecosystem connects process-certified quantum PDKs, parameterized device cells, traceable model cards, SPICE-Q physical modeling languages, unified Q-EDA flows, foundry sign-off rules, cryogenic test feedback, and reusable quantum IP. In this model, design firms do not merely outsource fabrication; they prepare verified tape-outs under standardized process constraints and calibrated physical models. Its economic value lies in reducing repetitive device debugging, process exploration, and low-level layout effort, while its feasibility depends on PDK maturity, foundry yield, cryogenic test throughput, model-prediction accuracy, data-feedback mechanisms, and IP licensing boundaries. We argue that superconducting quantum chips can move from the current largely vertically integrated development model toward a fabless-foundry ecosystem only when hardware design is supported by standardized, verifiable, and reusable software and process interfaces. The required pillars are certified PDKs, PCell-based parameterized design, SPICE-Q cross-physics simulation, end-to-end Q-EDA automation, and a tradable quantum-IP market. By adapting lessons from the classical semiconductor industry to quantum hardware, this framework defines a path toward scalable, manufacturable, and commercially reusable superconducting quantum-chip design.
Superconducting circuits have emerged as one of the most promising and scalable platforms for quantum com- puting, with substantial industrial adoption driving qubit counts steadily upward. Yet the layout of the corresponding chips is still primarily performed manually, consuming multiple days or weeks of expert effort, even for moderately sized designs. Existing automation approaches sidestep this bottleneck by simplifying the underlying problem and relaxing physical constraints. Therefore, they fall short of fabrication-ready results. To overcome this scalability wall without such compromises, we first introduce a formal abstraction that translates physical device characteristics into a rigorous geometric problem formulation. This abstraction bridges physical realization and design automation. Building upon this abstraction, we then propose a three-stage design automation flow comprising geometry-aware global partitioning, ILP-based port assignment, and a hierarchical routing pipeline. Evaluations conducted by our interdisciplinary team of design au- tomation researchers and superconducting hardware experts con- firm that the resulting flow produces complete, manufacturing- ready layouts that comply with the physical design rules at the push of a button. That is, it operates fully automatically within seconds to a few minutes, and solves complex instances up to 25x faster than the state of the art. All methods are released as the fully open-source tool mqt-scpd as part of the Munich Quantum Toolkit, providing the first readily usable, end- to-end design flow for planar superconducting quantum chips that explicitly addresses the underlying physical characteristics and requirements.