Overlap junctions for superconducting quantum electronics and amplifiers
Mustafa Bal, Junling Long, Ruichen Zhao, Haozhi Wang, Sungoh Park, Corey Rae McRae, Tongyu Zhao, Russell E. Lake, V. Yu. Monarkha, Slawomir Simbierowicz, Daniil Frolov, Roman Pilipenko, Silvia Zorzetti, Alexander Romanenko, Chuan-Hong Liu, Robert McDermott, David P. Pappas
Due to their unique properties as lossless, nonlinear circuit elements, Josephson junctions lie at the heart of superconducting quantum information processing. Previously, we demonstrated a two-layer, submicrometer-scale overlap junction fabrication process suitable for qubits with long coherence times. Here, we extend the overlap junction fabrication process to micrometer-scale junctions. This allows us to fabricate other superconducting quantum devices. For example, we demonstrate an overlap-junction-based Josephson parametric amplifier that uses only 2 layers. This efficient fabrication process yields frequency-tunable devices with negligible insertion loss and a gain of ~ 30 dB. Compared to other processes, the overlap junction allows for fabrication with minimal infrastructure, high yield, and state-of-the-art device performance.
Due to their unique properties as lossless, nonlinear circuit elements, Josephson junctions lie at the heart of superconducting quantum information processing. Previously, we demonstrated a two-layer, submicrometer-scale overlap junction fabrication process suitable for qubits with long coherence times. Here, we extend the overlap junction fabrication process to micrometer-scale junctions. This allows us to fabricate other superconducting quantum devices. For example, we demonstrate an overlap-junction-based Josephson parametric amplifier that uses only 2 layers. This efficient fabrication process yields frequency-tunable devices with negligible insertion loss and a gain of ~ 30 dB. Compared to other processes, the overlap junction allows for fabrication with minimal infrastructure, high yield, and state-of-the-art device performance.
Josephson tunnel junctions are the centerpiece of almost any superconducting electronic circuit, including qubits. Typically, the junctions for qubits are fabricated using shadow evaporation techniques to reduce dielectric loss contributions from the superconducting film interfaces. In recent years, however, sub-micrometer scale overlap junctions have started to attract attention. Compared to shadow mask techniques, neither an angle dependent deposition nor free-standing bridges or overlaps are needed, which are significant limitations for wafer-scale processing. This comes at the cost of breaking the vacuum during fabrication, but simplifies integration in multi-layered circuits and implementation of vastly different junction sizes and enables fabrication on a larger scale in an industrially standardized process. In this work, we demonstrate the feasibility of a subtractive process for the fabrication of overlap junctions. In an array of test contacts, we find low aging of the average normal state resistance of only 1.6% over 6 months. We evaluate the coherence properties of the junctions by employing them in superconducting transmon qubits. In time domain experiments, we find that both, the qubit life- and coherence time of our best device, are, on average, greater than 20 μs. Finally, we discuss potential improvements to our technique. This work paves the way toward a more standardized process flow with advanced materials and growth processes, and constitutes an important step for the large scale fabrication of superconducting quantum circuits.
The performance of superconducting electronic devices such as superconducting quantum bits (qubits) and superconducting quantum interference devices (SQUIDs) strongly relies on high-quality Josephson junctions (JJ) and their integration into surrounding circuit elements. Therefore, a corresponding fabrication technology should allow for the fabrication of all required elements including the JJs, inductances, capacitances and waveguides. For a long time, shadow evaporation technique was the state of the art for the implementation of sub-μ m sized JJs based on aluminum for qubits of high coherence times. Although, the use of a single lithographic step represents a major advantage of this technique. However, shadowing effects limit sample size, device complexity, and thus scalability of the circuitry. To overcome these limitations and to meet the demands of next generation scalable quantum circuits, in this work we introduce our cross -type JJ aluminum technology, where JJs are defined by the overlap of two narrow perpendicular stripes. We discuss the technological challenges, with a focus on our newly developed dry etching process for patterning of the aluminum thin film. Compared to a lift-off based process, this advanced wafer-scale fabrication technology offers a high integration density and the required design flexibility. We will present first results on cross -type aluminum JJs.
Superconducting circuits incorporating Josephson elements represent a promising hardware platform for quantum technologies. Potential applications include scalable quantum computing, microwave quantum networks, and quantum-limited amplifiers. However, progress in Josephson junction–based quantum technologies is facing the ongoing challenge of minimizing loss channels. This is also true for parametric superconducting devices based on nonlinear Josephson resonators. In this work, we report on the fabrication and characterization of low-loss Josephson parametric devices operated in the GHz frequency range, showing record internal quality factors. Specifically, we achieve internal quality factors Q int significantly exceeding 10 5 for both Josephson parametric converters and Josephson parametric amplifiers in the single-photon regime by fitting the scattering data. We confirm the extracted Q int values by analyzing purity of squeezed vacuum states generated by these devices. These low-loss devices mark a significant step forward in realizing high-performance quantum circuits, enabling further advancements in superconducting quantum technologies.
Abstract As the superconducting qubit platform matures towards ever-larger scales in the race towards a practical quantum computer, limitations due to qubit inhomogeneity through lack of process control become apparent. To benefit from the advanced process control in industry-scale CMOS fabrication facilities, different processing methods will be required. In particular, the double-angle evaporation and lift-off techniques used for current, state-of-the-art superconducting qubits are generally incompatible with modern-day manufacturable processes. Here, we demonstrate a fully CMOS compatible qubit fabrication method, and show results from overlap Josephson junction devices with long coherence and relaxation times, on par with the state-of-the-art. We experimentally verify that Argon milling—the critical step during junction fabrication—and a subtractive-etch process nevertheless result in qubits with average qubit energy relaxation times T 1 reaching 70 µs, with maximum values exceeding 100 µs. Furthermore, we show that our results are still limited by surface losses and not, crucially, by junction losses. The presented fabrication process, therefore, heralds an important milestone towards a manufacturable 300 mm CMOS process for high-coherence superconducting qubits and has the potential to advance the scaling of superconducting device architectures.
The key components in superconducting quantum computing architectures are qubits, couplers, microwave elements and low-noise amplifiers among others. In a variety of these subsystems, nonlinear circuit elements are an essential ingredient which enables their functionality. In this thesis, we study two different superconducting elements used to implement nonlinear capacitors. First we simulated a novel Josephson-junction-based tuneable nonlinear capacitor to couple flux qubits. Such a device implements a YY interaction, which has the potential to enhance the performance and extend the capabilities of current generation quantum annealers. We show that the interaction strength of the YY coupling is on the order of MHz and tuneable across zero. We discuss experimental realisations of this device to verify its function. Next, we present our study of a low temperature parametric amplifier utilizing the nonlinear capacitance of quantum phase-slip nanowires. We have fabricated a single-nanowire and two-nanowire variants which shunt a quarter-wavelength superconducting coplanar waveguide resonator. We characterised the nonlinear properties of the first variant such as the power-dependent resonance frequency, idler generation and signal gain, while in the second variant we developed a lock-in detection method to investigate the gate voltage response and demonstrate that the device acts as a gate-voltage-tuneable resonator. We also report on the progress towards a fabrication process for sputtered Al overlap junctions in the LCN cleanroom. Back-sputter and in-situ oxide growth techniques are developed as an alternative to shadow evaporation. These techniques are better suited for large-scale integration as they do not rely on angular deposition, but they require better control over the interfaces due to patterning the two electrodes separately. We characterised the processes using resistance measurements and characterised their low temperature properties. We show that our junctions exhibit overdamped dynamics and the critical current is suppressed with RF radiation.
A minimal method to fabricate Al/AlOx/Al Josephson junctions (JJs) using photolithography and argon etching, before metallization and oxidation, is demonstrated. JJs with areas ranging from 1 to 6 μm2 can be fabricated and, with the appropriate oxidation conditions, the junction resistance can be varied by $\sim$2 orders of magnitude. Transmission electron microscopy reveals the successful fabrication of JJs with few grain boundaries suggesting reduced energy loss from two-level-systems. Superconducting QUantum Interference Devices (SQUIDs) fabricated from this methodology exhibit reduced resistance variation over multiple chips, compared with electron beam lithography, and the devices can sustain repeated thermal cycles to 10 mK with the excellent flux response remaining unchanged. The quantum applications of this technology are demonstrated by embedding a SQUID resonator into a 3D cavity and parametrically amplifying low photon numbers with gains of $\sim$40 dB. This work establishes the simplest approach to fabricating JJs to date, and it could prove pivotal to the widespread utilization of superconducting circuit-based quantum technologies.