Abstract We report the design and test of reciprocal quantum logic shift-register yield vehicles consisting of up to 72 800 Josephson junction devices per die, the largest digital superconducting circuits ever reported. Multiple physical layout styles were matched to the MIT Lincoln Laboratory foundry, which supports processes with both four and eight metal layers and minimum feature size of 0.5 μ m. The largest individual circuits with 40 400 junctions indicate large operating margins of ±20% on ac clock amplitude. In one case the data were reproducible to the accuracy of the measurement, ±1% across five thermal cycles using only the rudimentary precautions of passive mu-metal magnetic shielding and a controlled cool-down rate of 3 mK s −1 in the test fixture. We conclude that with proper mitigation techniques, flux-trapping is no longer a limiting consideration for very-large-scale-integration of superconductor digital logic.
Abstract We report the design and test of reciprocal quantum logic shift-register yield vehicles consisting of up to 72 800 Josephson junction devices per die, the largest digital superconducting circuits ever reported. Multiple physical layout styles were matched to the MIT Lincoln Laboratory foundry, which supports processes with both four and eight metal layers and minimum feature size of 0.5 μ m. The largest individual circuits with 40 400 junctions indicate large operating margins of ±20% on ac clock amplitude. In one case the data were reproducible to the accuracy of the measurement, ±1% across five thermal cycles using only the rudimentary precautions of passive mu-metal magnetic shielding and a controlled cool-down rate of 3 mK s −1 in the test fixture. We conclude that with proper mitigation techniques, flux-trapping is no longer a limiting consideration for very-large-scale-integration of superconductor digital logic.
A variety of superconductor integrated circuits composed of six ac-powered SFQ shift registers with a total of 27078 bits and 108500 Josephson junctions (JJs) per 5 mm × 5 mm chip have been designed, fabricated, and tested to characterize flux trapping, fabrication process yield, and parameter spread. The six 4513-bit registers in the circuits have a common single-phase ac clock and individual input/output drivers, allowing for their parallel testing. We have investigated flux trapping in the circuits with various geometry, size, distance between moats in active ground planes (GPs), and containing up to three additional ‘dummy’ GPs, using multiple cooldowns through the critical temperature with various cooling rates and residual magnetic fields up to ∼ 1.2 µT. For the slit-type and square moats arrayed along the sides of the register cells, we have found a negligible effect of flux sequestered in the moats on the operating margins of the registers, and a negligible probability of detrimental flux trapping outside of the moats. Circuits with 0.3-µm-wide slit moats occupying less than 2% of the circuit area were fully operational in 100% of cooldowns, supporting the viability of a very large-scale integration of superconductor digital circuits. We have also found a strong enhancement of flux trapping outside the moats in circuits with closely spaced GPs and determined a critical distance,${{{\boldsymbol{t}}}_{\boldsymbol{c}}} \approx $0.6 µm, between them. The presence of two or more GPs spaced below thetcrendered the circuits nonoperational in 100% of cooldowns. We have measured 30 chips with over 3M JJs and determined individual cell operating margins in 138 registers to characterize the fabrication-related parameter spread and detect fabrication defects and flux-trapping events. By finding outlier bit-cells in the statistical distribution of the individual cell margins, we detected about one fabrication defect per million JJs, in most cases causing magnetic flux trapping in the affected cell.The circuits have been fabricated in the SFQ5ee fabrication process at MIT Lincoln Laboratory (MIT LL).
Abstract We review the existing fabrication processes for superconductor digital electronics and describe approaches to increasing the scale of integration of superconducting digital circuits from the current level of about one million Josephson junctions (JJs) on a 1-cm 2 chip toward ten million JJs per chip. We present designs of ac-clocked Single Flux Quantum (SFQ) shift registers, convenient benchmarking circuits, in a 250-nm-linewidth superconductor electronics fabrication process developed recently at MIT Lincoln Laboratory (MIT LL). For shift registers using resistively shunted JJs with Josephson critical current density, J c of 100 μA/μm 2 , we achieved a record-high circuit density of 4.2·10 6 JJs per cm 2 , a factor of three higher than the previous record obtained in the MIT LL 350-nm-linewidth SFQ5ee process. Using self-shunted JJs with J c of 600 μA/μm 2 , we increased this record circuit density to 7.4·10 6 JJs per cm 2 .
We develop an ac-biased shift register introduced in our previous work (V. K. Semenov et al., IEEE Trans. Appl. Supercond., vol. 25, no. 3, 1301507, June 2015) into a benchmark circuit for evaluation of superconductor electronics fabrication technology. The developed testing technique allows for extracting margins of all individual cells in the shift register, which in turn makes it possible to estimate statistical distribution of Josephson junctions (JJs) in the circuit. We applied this approach to successfully test registers having 8-, 16-, 36-, and 202 thousand cells and, respectively, about 33-, 65-, 144-, and 809 thousand JJs. The circuits were fabricated at MIT Lincoln Laboratory, using a fully planarized process, 0.4-μm inductor linewidth and 1.33 × 106cm-2junction density. They are presently the largest operational superconducting SFQ circuits ever made. The developed technique distinguishes between “hard” defects (fabrication-related) and “soft” defects (measurement-related) and locates them in the circuit. The “soft” defects are specific to superconducting circuits and caused by magnetic flux trapping either inside the active cells or in the dedicated flux-trapping moats near the cells. The number and distribution of “soft” defects depend on the ambient magnetic field and vary with thermal cycling even if done in the same magnetic environment.
I Abstract -- As the integration level of superconducting digital circuits increases, flux trapping in these devices becomes a serious problem. High resolution A/D converters and other high speed signal processing systems have been demonstrated with junction counts well into the lo3 range. Such large circuits require special testing techniques to prevent flux trapping within the gates, which can reduce bias margins and cause malfunctions of these devices. We discuss the results of experiments using single flux quantum shift registers in which we have varied the ground plane hole pattern and magnetic shield degaussing procedure to minimize flux trapping in these circuits. The operating bias margins of the shift registers have been measured as a function of different testing procedures and ground plane hole designs. In situ degaussing of the magnetic shields aids in the reduction of flux trapping and gave the best results. Measurements of the permeability of mu metal at 4.2 K are discussed.
As the integration level of superconducting digital circuits increases, flux trapping in these devices becomes a serious problem. High resolution A/D converters and other high speed signal processing systems have been demonstrated with junction counts well into the 10/sup 3/ range. Such large circuits require special testing techniques to prevent flux trapping within the gates, which can reduce bias margins and cause malfunctions of these devices. We discuss the results of experiments using single flux quantum shift registers in which we have varied the ground plane hole pattern and magnetic shield degaussing procedure to minimize flux trapping in these circuits. The operating bias margins of the shift registers have been measured as a function of different testing procedures and ground plane hole designs. In situ degaussing of the magnetic shields aids in the reduction of flux trapping and gave the best results. Measurements of the permeability of mu metal at 4.2 K are discussed.
Adiabatic quantum-flux-parametron (AQFP) superconductor logic is a proven energy-efficient digital technology for various applications. To address the scalability challenges of this technology, we investigated AQFP shift registers with the AQFP footprint area reduced by 25% with respect to prior work and with the >2× denser overall circuit designs obtained by eliminating the previously used free space between the AQFPs. We also investigated AQFP cells with different designs of flux trapping moats in the superconducting ground plane as well as compact AQFP cells that took advantage of the smaller feature sizes available in the new fabrication process, SFQ5ee+, at MIT Lincoln Laboratory (MIT LL). This new process features nine planarized Nb layers with a 0.25 μm minimum linewidth. The fabricated circuits were tested in a liquid He immersion probe and a commercial closed-cycle cryocooler using a controlled cooling rate through the superconducting critical temperature,Tc. Using multiple thermal cycles, we investigated flux trapping in the dense AQFP shift registers as well as in the registers using the old (sparse) AQFP designs at two levels of the residual magnetic field, about 0.53 μT and about 1.2 μT. The sparse designs demonstrated 95% to almost 100% probability of operation after the cooldown and very wide operation margins, although the flux trapping probability was increasing with circuit complexities. The margins were similarly wide in the newer dense designs, but flux trapping probability that rendered the registers nonoperational was significantly, by an order of magnitude, higher in these denser circuits and was also very sensitive to the moats' shape and location. Our findings indicate that AQFP circuits are amendable to increasing the scale of integration and further densification, but a careful moat design and optimization are required to reduce flux trapping effects in the dense AQFP circuits.