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Optica Quantum

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Robert Bernson, Alex Witte, Genevieve Clark, Kamil Gradkowski, Jeffrey Yang, Matthew Saha, Matthew Zimmermann, Andrew Jay Leenheer, Kevin C. Chen, Gerald N. Gilbert, Matt Eichenfield, Dirk Englund, Peter O’brien

Published Oct 23, 2025• 1 citation
Publisher

Abstract

Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.

DOI
10.1364/opticaq.562093

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Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with < 3dB losses achievable from fiber to quantum memory.
As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFLN) photonic chips. The packaged fiber-to-chip interface shows a coupling efficiency of 15.7% ± 0.3%, with minimal variation of ±0.5% as the temperature cools down from 295 K to 1.5 K. Furthermore, the packaged chip exhibits outstanding stability over multiple thermal cycling, highlighting its potential for practical applications in cryogenic environments.
Chip integration of quantum emitters is a crucial milestone for scalable quantum photonic information processing. Among optically active defect centers for quantum photonics, diamond color centers are promising because of their long spin coherence times and high photon emission rates. However, for a coherent-photon emission, they typically require a cryogenic environment to protect optical coherence from thermal phonons, which makes chip integration challenging. In this paper, we develop a chip-integrated diamond photonic crystal cavity embedding an ensemble of nitrogen-vacancy (NV) centers. We confirm cryogenic operation by observing Purcell enhancement of NV-center emission via an edge-coupled optical fiber. This result demonstrates successful integration of diamond color centers, a photonic crystal cavity, and an optical waveguide-fiber package, representing a key step toward scalable diamond-based quantum communication platforms.
A central goal in many quantum information processing applications is a network of quantum memories that can be entangled with each other while being individually controlled and measured with high fidelity. This goal has motivated the development of programmable photonic integrated circuits (PICs) with integrated spin quantum memories using diamond color center spin-photon interfaces. However, this approach introduces a challenge in the microwave control of individual spins within closely packed registers. Here, we present a quantum-memory-integrated photonics platform capable of (i) the integration of multiple diamond color center spins into a cryogenically compatible, high-speed programmable PIC platform; (ii) selective manipulation of individual spin qubits addressed via tunable magnetic field gradients; and (iii) simultaneous control of multiple qubits using numerically optimized microwave pulse shaping. The combination of localized optical control, enabled by the PIC platform, together with selective spin manipulation opens the path to scalable quantum networks on intra-chip and inter-chip platforms.
Realizing a quantum network will require long-lived quantum memories with optical interfaces incorporated into a scalable architecture. Color centers quantum emitters in diamond have emerged as a promising memory modality due to their optical properties and compatibility with scalable integration. However, developing a scalable color center emitter module requires significant advances in the areas of heterogeneous integration and cryogenically compatible packaging. Here we report on a cryogenically stable and network compatible quantum-emitter module for memory use. This quantum-emitter module is a significant development towards advanced quantum networking applications such as distributed sensing and processing.