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arXiv:2302.12919

A fully packaged multi-channel cryogenic module for optical quantum memories

David J. Starling, Katia Shtyrkova, Ian Christen, Ryan P. Murphy, Linsen Li, Kevin C. Chen, Dave Kharas, Xingyu Zhang, Cummings, John, W. John Nowak, Eric A. Bersin, Robert Niffenegger, Madison Sutula, Dirk Englund, Scott A. Hamilton, P. Ben Dixon

Published Feb 24, 2023• 0 citations
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Abstract

Realizing a quantum network will require long-lived quantum memories with optical interfaces incorporated into a scalable architecture. Color centers quantum emitters in diamond have emerged as a promising memory modality due to their optical properties and compatibility with scalable integration. However, developing a scalable color center emitter module requires significant advances in the areas of heterogeneous integration and cryogenically compatible packaging. Here we report on a cryogenically stable and network compatible quantum-emitter module for memory use. This quantum-emitter module is a significant development towards advanced quantum networking applications such as distributed sensing and processing.

DOI
10.48550/arxiv.2302.12919

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Realizing a quantum network will require long-lived quantum memories with optical interfaces incorporated into a scalable architecture. Color centers quantum emitters in diamond have emerged as a promising memory modality due to their optical properties and compatibility with scalable integration. However, developing a scalable color center emitter module requires significant advances in the areas of heterogeneous integration and cryogenically compatible packaging. Here we report on a cryogenically stable and network compatible quantum-emitter module for memory use. This quantum-emitter module is a significant development towards advanced quantum networking applications such as distributed sensing and processing.
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Chip integration of quantum emitters is a crucial milestone for scalable quantum photonic information processing. Among optically active defect centers for quantum photonics, diamond color centers are promising because of their long spin coherence times and high photon emission rates. However, for a coherent-photon emission, they typically require a cryogenic environment to protect optical coherence from thermal phonons, which makes chip integration challenging. In this paper, we develop a chip-integrated diamond photonic crystal cavity embedding an ensemble of nitrogen-vacancy (NV) centers. We confirm cryogenic operation by observing Purcell enhancement of NV-center emission via an edge-coupled optical fiber. This result demonstrates successful integration of diamond color centers, a photonic crystal cavity, and an optical waveguide-fiber package, representing a key step toward scalable diamond-based quantum communication platforms.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with < 3dB losses achievable from fiber to quantum memory.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.
Large-scale quantum networks will enable entirely new applications of quantum information science in fields such as quantum communication, distributed quantum computing, sensing, and metrology. To build nodes of such networks, diamond color defects are one of the promising candidates. Their excellent optical properties, fast spin-qubit control, and long spin coherence times make them well-suited for quantum information processing and quantum memory applications. Additionally, recent advances in the heterogeneous integration of diamond nanophotonic structures with photonic integrated circuits have made these systems more efficient and well-suited for scalable quantum processor architectures. In this comprehensive review, we discuss the optical and spin properties of these systems, recent progress in the building blocks of quantum networks, and demonstrations of metropolitan-scale quantum networks, as well as the challenges associated with these systems at both the fundamental and experimental levels, along with potential solutions.