As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFLN) photonic chips. The packaged fiber-to-chip interface shows a coupling efficiency of 15.7% ± 0.3%, with minimal variation of ±0.5% as the temperature cools down from 295 K to 1.5 K. Furthermore, the packaged chip exhibits outstanding stability over multiple thermal cycling, highlighting its potential for practical applications in cryogenic environments.
As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFLN) photonic chips. The packaged fiber-to-chip interface shows a coupling efficiency of 15.7% ± 0.3%, with minimal variation of ±0.5% as the temperature cools down from 295 K to 1.5 K. Furthermore, the packaged chip exhibits outstanding stability over multiple thermal cycling, highlighting its potential for practical applications in cryogenic environments.
Photonic integrated circuits operating at cryogenic temperatures are necessary for many quantum technologies such as quantum transduction, integrated single-photon emitters and detectors, as well as deep-space communication and sensing devices. Thin-film lithium niobate (TFLN) is an emerging platform that is a strong candidate for fully integrated quantum photonics, offering low loss, fast electro-optic reconfigurability, nonlinear quantum light sources, and the ability to host quantum emitters and single-photon detectors. To interface TFLN with technologies that require cryogenic operation, like superconducting single-photon detectors, microwave-to-optical transducers, and solid-state quantum emitters, it is important to study its optical and electrical properties from room temperature down to cryogenic temperatures. Here, we investigate linear and nonlinear photonic devices, including racetrack resonators, Mach-Zehnder modulators and periodically poled waveguides in TFLN using a cryogenic fiber probe station with full temperature control down to 5 K. We quantify a shift in resonances, a 22% increase in electro-optic modulator half-wave voltage, a blue shift of 18 nm for Type-0 phase-matching as well as a red shift of 64 nm for Type-II phase-matching as the sample temperature decreases. Our study of nonlinear processes in a cryogenic environment will contribute towards developing novel devices for inter-platform quantum information processing, secure communication, and enhanced sensing.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with < 3dB losses achievable from fiber to quantum memory.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.
- Cryogenic data transfer has numerous applications at 4.2 K for extracting data from supercomputers and quantum computers to address interface bottlenecks. The external modulation of data transmission across temperature zones is achieved through the use of electro-optic modulators. The performance of a thin-film lithium niobate (TFLN) Mach-Zehnder modulator was examined at cryogenic temperatures. Low-frequency measurements indicate that the Vπ (voltage needed for π phase shift) of the modulator increases as the temperature decreases from 298 K to 4.2 K. A comparison was conducted between the readout performance of the electrical wire link and the optical fiber link, spanning from 4.2 K to 298 K. Additionally, high-speed data transmission was successfully demonstrated in a 4.2 K environment without the need for cryogenic electric amplifiers, achieving signals of up to 30 Gbps. The proposed solution holds potential benefits for both classical and quantum computers in alleviating interface bottlenecks.
Diamond photonics has enabled efficient interfaces for quantum memories and is predicted to be a critical component of quantum networks. However, scalable network architectures require spatial, temporal, and spectral control of photons, which relies on nonlinear and electro-optic functionalities that diamond alone cannot provide. Here, we demonstrate heterogeneous integration of a thin-film lithium niobate (TFLN) platform, which has strong chi-2 nonlinearity and electro-optic effects, with thin diamond films. We demonstrate high-Q diamond photonic crystal cavities (Q factors exceeding 5x10^4 at 735 nm) that are lithographically aligned with TFLN photonic backbone and critically coupled to it. This allows us to realize low-loss diamond-TFLN "escalators" (loss ~1 dB/coupler) that support efficient light transfer between them. At cryogenic temperatures (5K), we can collect photons emitted from silicon vacancies (SiVs) embedded within the diamond structure via the TFLN photonic circuit. This approach establishes a scalable route toward integrated photonic circuits for practical quantum networking and other technologies.
Integrated thin-film lithium niobate (TFLN) photonics has emerged as a powerful platform for quantum information science, offering its outstanding nonlinear, electro-optic (EO), and integration capabilities. In this review, we present the latest advances in TFLN-based integrated photonics tailored to quantum technologies. We first explore state-of-the-art quantum light sources realized in both straight waveguide and resonator configuration, including high-brightness photon pair generations, squeezed light, and versatile entanglement schemes. Next, we detail progress in integrated photonic processors, with a focus on programmable interferometric networks, ultrafast EO modulators, and essential passive components for photonic qubit processing. We then address critical challenges in optical interfacing and detection technologies, discussing recent innovations in low-loss fiber-to-chip and grating coupler designs, as well as the integration of on-chip single photon detectors. This review provides a forward-looking perspective on scalable quantum photonic systems that could underpin future advances in quantum communication, computing, and sensing.