Coplanar (with the ground) and stripline 25 cm long waveguides are manufactured from the YBCO-Kapton material. The waveguides are intended as the key components of a scalable signal delivery for large quantum computing systems and detectors. The waveguide is coupled with an integrated power divider that replaces the standard attenuator. The divider is designed to return most of the power to the previous thermalization stage. The method is projected to reduce the active dissipation by ≈10. We investigate the effect of internal strain in YBCO layer on the device's mechanical stability. We show that adhesives with high stiffness are essential for the reliability of YBCO-Kapton devices.
Coplanar (with the ground) and stripline 25 cm long waveguides are manufactured from the YBCO-Kapton material. The waveguides are intended as the key components of a scalable signal delivery for large quantum computing systems and detectors. The waveguide is coupled with an integrated power divider that replaces the standard attenuator. The divider is designed to return most of the power to the previous thermalization stage. The method is projected to reduce the active dissipation by ≈10. We investigate the effect of internal strain in YBCO layer on the device's mechanical stability. We show that adhesives with high stiffness are essential for the reliability of YBCO-Kapton devices.
Development of practical quantum computers would require 1000's of qubits and equally large number of read-out, bias and drive lines. New materials that combine low passive loss and good RF properties are needed. Here we report performance of signal interconnects comprised of high-temperature YBCO films that are exfoliated from a metal substrate and transferred to a E-Kapton tape. The technology offers low-loss transition between 60 K to sub-mK environments and interfacing with off-shelf flexible silicon electronics. We demonstrate <; 1 dB/m attenuation at 6 GHz at 77 K. The microstrip assemblies demonstrated no degradation upon multiple cycling to liquid Nitrogen and conduction cooling down to 18 K. We discuss the design of a practical high-density signal cable with passive loss well below 1 μW per line. The YBCO-on-Kapton technology offers a practical pathway to large error-corrected quantum computing systems.
Power divider is a useful device that divides the power of signal into different subpowers at a certain ratio. The superconducting power divider plays an important role in various superconducting quantum computing circuits and superconducting microwave photon detectors. Therefore, in this paper we investigate how to design and prepare a typical coplanar waveguide superconducting microwave power divider. The parameters are designed by using the odd-even mode method to analyze the transport features of a three-port microwave network. Specifically, the microwave transport properties of the device with a center frequency of 5 GHz and 3 dB power division ratio are simulated. Then, the designed aluminum coplanar waveguide superconducting power divider on silicon is prepared by micro-processing technology and experimentally tested at low temperature. It is shown that the measurement results are consistent with the design parameters. It is noted that the center frequency of the actually prepared power divider is measured to be about 5.25 GHz, which is slightly different from the result of the design and simulation. This difference is probably due to the following main reasons. Firstly, the limited precision of the micromachining process is caused by the fact that the fabricated quarter-wave impedance matching line is etched incompletely, leading the length of the impedance matching line to be shortened. As a consequence, the frequency of the prepared power divider is slightly higher. Secondly, the simulation software is not designed specially for superconducting device simulations, thereby yielding the design parameters slightly different from those of the fabricated superconducting devices. Additionally, a series of attenuations has been used in the experimental test system of the superconducting microwave power dividers for reducing the various noises. This causes the input test signal to weaken, thus the reflected signal turns significantly small. Therefore, none of the S11 parameters of the device can be effectively measured. Finally, neither of S21 and S31 parameters measured in the experiment is the predicted –3 dB, which is mainly due to the imperfections in the welding between SMA connectors and high-frequency transmission lines, and the spot welding between high-frequency transmission lines and power divider samples, and also due to the discontinuities of the high-frequency transmission line and the power divider and so on. All these factors can yield the tested insertion loss of the device. Hopefully, the method in this work can be extended to designing and preparing other passive superconducting microwave devices.
Since superconducting quantum computers use microwave signals to control and readout their qubits, microwave transmission lines and circuits that can be used under cryogenic conditions are required. For microwave transmission lines, thermal insulation is essential to enhance wiring density and to prevent parasitic heating that can lead to increased computational errors. Thus, here we design and characterize a scalable, thermally insulated microwave transmission line. The transmission line designed for superconducting qubit readout at 5 GHz band achieves both thermal insulation and low loss, by employing resonator-based impedance matching in a microstripline structure. A flexible cable including eight planar transmission lines was designed, fabricated and characterized using S-parameter measurement, demonstrating low crosstalk below 40dB and signal attenuation of -23.5±0.07dB; this coincides with electromagnetic simulations. These microwave properties remained stable across a wide temperature range from room temperature down to 4 K, including steep gradients. The integration of chip attenuators further reduces thermal noise and protects sensitive cryogenic components. Our approach offers a promising solution for compact, high-density microwave wiring using flat cables under thermal gradients, necessary for large scale quantum computing.
Superconducting circuit devices require electrical interconnects between different circuit elements on the chip, for which conventional device architectures use a combination of two structural elements: \textit{airbridges} to connect non-adjacent elements in the base layer, and \textit{bandages} to connect the electrodes forming the Josephson junctions to the base layer. Bandages introduce unwanted parasitic material interfaces and increase the manufacturing complexity. Here, we overcome the limitations imposed by \emph{bandages} by establishing \textit{all} electrical interconnects with airbridges of varying size fabricated in a single step. The airbridges show a high yield and mechanical stability over a wide range of sizes from 0.5μm to 4μm in width and from 5μm to 40μm in length, and show low loss when integrated in coplanar waveguide resonators and transmon qubits. Measured relaxation times up to more than 250μs in standard transmon geometries show that the process achieves high coherence while substantially easing and accelerating device fabrication.
We describe progress and initial results achieved towards the goal of developing integrated multi-conductor arrays of shielded controlled-impedance flexible superconducting transmission lines with ultra-miniature cross sections and wide bandwidths (dc to >10 GHz) over meter-scale lengths. Intended primarily for use in future scaled-up quantum computing systems, such flexible thin-film niobium/polyimide ribbon cables could provide a physically compact and ultra-low thermal conductance alternative to the rapidly increasing number of discrete coaxial cables that are currently used by quantum computing experimentalists to transmit signals between the several low-temperature stages (from ∼4 K down to ∼20 mK) of a dilution refrigerator. We have concluded that these structures are technically feasible to fabricate, and so far they have exhibited acceptable thermo-mechanical reliability. S -parameter results are presented for individual 2-metal layer Nb microstrip structures having 50 Ω characteristic impedance; lengths ranging from 50 to 550 mm were successfully fabricated. Solderable pads at the end terminations allowed testing using conventional rf connectors. Weakly coupled open-circuit microstrip resonators provided a sensitive measure of the overall transmission line loss as a function of frequency, temperature, and power. Two common microelectronic-grade polyimide dielectrics, one conventional and the other photo-definable (PI-2611 and HD-4100, respectively) were compared. Our most striking result, not previously reported to our knowledge, was that the dielectric loss tangents of both polyimides, over frequencies from 1 to 20 GHz, are remarkably low at deep cryogenic temperatures, typically 100 × smaller than corresponding room temperature values. This enables fairly long-distance (meter-scale) transmission of microwave signals without excessive attenuation, and also permits usefully high rf power levels to be transmitted without creating excessive dielectric heating. We observed loss tangents as low as 2.2 × 10 −5 at 20 mK, although losses increased somewhat at very low rf power levels, similar to the well-known behavior of amorphous inorganic dielectrics such as SiO 2 . Our fabrication techniques could be extended to more complex structures such as multiconductor cables, embedded microstrip, 3-metal layer stripline or rectangular coax, and integrated attenuators and thermalization structures.
In this paper, we present a novel design of a compact, double-fold half-wave superconducting coplanar waveguide resonator, specifically optimized for quantum readout. The geometry offers advantages in terms of scalability and allows for a more compact integration of qubits per unit area. The superconducting resonators are designed to operate within a fundamental frequency range of 1.9 GHz$-1.95GHz,utilizingbothgapandfingercouplingschemes.Thedevicesarefabricatedusingthinaluminumfilmsdepositedonhigh−resistivitysapphiresubstrates.Theproposedresonatorsexhibitqualityfactor(Q_{L})of2.9× 10^{5}$and 1.58 ×103for gap coupled and finger coupled, respectively, during experimental measurements. The simulated QLof single-folded meander line resonators are found to be 4.65 ×105and 258.42, for gap coupled and finger coupled, respectively, for comparison purpose at similar operating frequency. A comprehensive analysis of the microwave transmission spectra was conducted at cryogenic temperatures near 10 mK, across very high input drive powers ($-30dBmto-10dBm).Experimentalresultsshowagoodagreementwithsimulationsandtheequivalentlumpedcircuitmodel.Notably,theproposeddesignreducesthephysicalfootprintoftheresonatordevicesupto28.2\%comparedtoconventionalsingle−foldmeanderedstructures.TheresonatorsdemonstratestrongpotentialforintegratingqubitswithreadoutandcontrolbusesinquantuminformationprocessingwhichrequireaQ_{L}$between104−105. They also being well-suited for cryogenic detector applications that utilize microwave kinetic inductance detector (MKID) arrays in frequency multiplexing for different coupling schemes.