Development of practical quantum computers would require 1000's of qubits and equally large number of read-out, bias and drive lines. New materials that combine low passive loss and good RF properties are needed. Here we report performance of signal interconnects comprised of high-temperature YBCO films that are exfoliated from a metal substrate and transferred to a E-Kapton tape. The technology offers low-loss transition between 60 K to sub-mK environments and interfacing with off-shelf flexible silicon electronics. We demonstrate <; 1 dB/m attenuation at 6 GHz at 77 K. The microstrip assemblies demonstrated no degradation upon multiple cycling to liquid Nitrogen and conduction cooling down to 18 K. We discuss the design of a practical high-density signal cable with passive loss well below 1 μW per line. The YBCO-on-Kapton technology offers a practical pathway to large error-corrected quantum computing systems.
Development of practical quantum computers would require 1000's of qubits and equally large number of read-out, bias and drive lines. New materials that combine low passive loss and good RF properties are needed. Here we report performance of signal interconnects comprised of high-temperature YBCO films that are exfoliated from a metal substrate and transferred to a E-Kapton tape. The technology offers low-loss transition between 60 K to sub-mK environments and interfacing with off-shelf flexible silicon electronics. We demonstrate <; 1 dB/m attenuation at 6 GHz at 77 K. The microstrip assemblies demonstrated no degradation upon multiple cycling to liquid Nitrogen and conduction cooling down to 18 K. We discuss the design of a practical high-density signal cable with passive loss well below 1 μW per line. The YBCO-on-Kapton technology offers a practical pathway to large error-corrected quantum computing systems.
Since superconducting quantum computers use microwave signals to control and readout their qubits, microwave transmission lines and circuits that can be used under cryogenic conditions are required. For microwave transmission lines, thermal insulation is essential to enhance wiring density and to prevent parasitic heating that can lead to increased computational errors. Thus, here we design and characterize a scalable, thermally insulated microwave transmission line. The transmission line designed for superconducting qubit readout at 5 GHz band achieves both thermal insulation and low loss, by employing resonator-based impedance matching in a microstripline structure. A flexible cable including eight planar transmission lines was designed, fabricated and characterized using S-parameter measurement, demonstrating low crosstalk below 40dB and signal attenuation of -23.5±0.07dB; this coincides with electromagnetic simulations. These microwave properties remained stable across a wide temperature range from room temperature down to 4 K, including steep gradients. The integration of chip attenuators further reduces thermal noise and protects sensitive cryogenic components. Our approach offers a promising solution for compact, high-density microwave wiring using flat cables under thermal gradients, necessary for large scale quantum computing.
Coplanar (with the ground) and stripline 25 cm long waveguides are manufactured from the YBCO-Kapton material. The waveguides are intended as the key components of a scalable signal delivery for large quantum computing systems and detectors. The waveguide is coupled with an integrated power divider that replaces the standard attenuator. The divider is designed to return most of the power to the previous thermalization stage. The method is projected to reduce the active dissipation by ≈10. We investigate the effect of internal strain in YBCO layer on the device's mechanical stability. We show that adhesives with high stiffness are essential for the reliability of YBCO-Kapton devices.
We describe progress and initial results achieved towards the goal of developing integrated multi-conductor arrays of shielded controlled-impedance flexible superconducting transmission lines with ultra-miniature cross sections and wide bandwidths (dc to >10 GHz) over meter-scale lengths. Intended primarily for use in future scaled-up quantum computing systems, such flexible thin-film niobium/polyimide ribbon cables could provide a physically compact and ultra-low thermal conductance alternative to the rapidly increasing number of discrete coaxial cables that are currently used by quantum computing experimentalists to transmit signals between the several low-temperature stages (from ∼4 K down to ∼20 mK) of a dilution refrigerator. We have concluded that these structures are technically feasible to fabricate, and so far they have exhibited acceptable thermo-mechanical reliability. S -parameter results are presented for individual 2-metal layer Nb microstrip structures having 50 Ω characteristic impedance; lengths ranging from 50 to 550 mm were successfully fabricated. Solderable pads at the end terminations allowed testing using conventional rf connectors. Weakly coupled open-circuit microstrip resonators provided a sensitive measure of the overall transmission line loss as a function of frequency, temperature, and power. Two common microelectronic-grade polyimide dielectrics, one conventional and the other photo-definable (PI-2611 and HD-4100, respectively) were compared. Our most striking result, not previously reported to our knowledge, was that the dielectric loss tangents of both polyimides, over frequencies from 1 to 20 GHz, are remarkably low at deep cryogenic temperatures, typically 100 × smaller than corresponding room temperature values. This enables fairly long-distance (meter-scale) transmission of microwave signals without excessive attenuation, and also permits usefully high rf power levels to be transmitted without creating excessive dielectric heating. We observed loss tangents as low as 2.2 × 10 −5 at 20 mK, although losses increased somewhat at very low rf power levels, similar to the well-known behavior of amorphous inorganic dielectrics such as SiO 2 . Our fabrication techniques could be extended to more complex structures such as multiconductor cables, embedded microstrip, 3-metal layer stripline or rectangular coax, and integrated attenuators and thermalization structures.
Superconducting electronics often require high-density microwave interconnects capable of transporting signals between temperature stages with minimal loss, cross talk, and heat conduction. We report the design and fabrication of superconducting 53 wt% Nb-47 wt% Ti (Nb47Ti) FLexible coAXial ribbon cables (FLAX). The ten traces each consist of a ø0.076 mm NbTi inner conductor insulated with PFA (ø0.28 mm) and sheathed in a shared 0.025 mm thick Nb47Ti outer conductor. The cable is terminated with G3PO coaxial push-on connectors via stainless steel capillary tubing (ø1.6 mm, 0.13 mm thick) soldered to a coplanar wave guide transition board. The 30 cm long cable has 1 dB of loss at 8 GHz with -60 dB nearest neighbor forward cross talk. The loss is 0.5 dB more than commercially available superconducting coax likely due to impedance mismatches caused by manufacturing imperfections in the cable. The reported cross talk is 30 dB lower than previously developed laminated NbTi-on-Kapton microstrip cables. We estimate the heat load from 1 K to 90 mK to be 20 nW per trace, approximately half the computed load from the smallest commercially available superconducting coax from CryoCoax.
Quantum computing promises an exponential speed-up of computation compared to what is nowadays achievable with classical computers. In this way, it enables the evaluation of more complex models and the breaching of current security algorithms. For the operation of a quantum system, many questions remain to be answered. Currently, there are several quantum technologies that promise to be both reliable and scalable, two features required for large scale quantum operations. Common to all technologies is the operating temperature that needs to be close to absolute zero, i.e. below 100 mK, to suppress environment noise and allow the quantum properties to become 'visible'. In order for any quantum processor to be operated, a so-called quantum-classical interface is required for the quantum bit (qubit) read-out and control. This interface consists of various electronic blocks, such as analog-to-digital converters, digital-to-analog converters, mixers, amplifiers and a digital controller. Especially the analog blocks require effort to meet the noise and stability constraints as not to disturb the very sensitive qubits and allow reading of the tiny signals. As the qubits live in extremely deep-cryogenic temperatures, long wires interface the cryogenic with the room temperature environment, where most of the electronics is situated. However, for a scalable system, heat injection becomes a serious problem, with many wires between 300 K and sub-Kelvin. Furthermore, such amount of interconnects is challenging to mechanically place in a dilution refrigerator. Therefore, in this work, we propose to implement the electronics not at room temperature, but at a temperature much closer to the qubits, for example at 4 K. This not only reduces significantly the wiring between room temperature and the qubits, but we can also benefit from lower electronic noise at such a temperature. The operation of conventional electronics almost 200°C below its normal temperature range is not trivial as device properties alter significantly and most circuits no longer operate as intended. In CMOS processes, the main technology in the integrated electronics world, the behaviour of the transistors, required for the implementation of any circuit, deviates considerably at low temperatures. The transistor's threshold voltage goes up, the mobility increases and the subthreshold slope becomes steeper, to name just a few of these deviations. Although there are improvements in performance, there are also some counter effects, and characterization of the transistors is needed to observe the changes. Once devices are characterized at such low temperatures, new models can be built and circuits can be simulated and adapted to operate properly at cryogenic temperatures. Luckily, there are various commercially available devices that can already withstand the chills of cold. We demonstrated various commercially available devices, such as a field-programmable gate array (FPGA) implemented in a 28 nm CMOS process, to be operating without major concerns at 4~K. Its properties alter only slightly, within 5 to 10%, and all tested circuit implementations, working at 300~K, also worked at 4 K. We combined both commercially available devices, that operate 200 K below their specified temperature range, with custom designed CMOS circuits to implement a cryogenic read-out platform for spin qubits. This system comprises amplifiers, an ADC, an FPGA, voltage regulators and a clock generator. It allows to amplify the tiny signal from the qubits and digitize it directly in the FPGA in order to process the data locally at 4~K. This system is one of the first systematic attempts at operating a part of the quantum-classical interface at cryogenic temperatures and forms the basis for future systems comprising the complete electronic interface for qubits to operate at such low temperatures. One of the main problems to tackle for cryogenic electronic systems is their power consumption. Power budgets are simply limited to roughly 1 or 2 Watts at 4 K and exponentially lower at deeper cryogenic temperatures, thus limiting the size of large-scale electronic systems. Our approach of combined commercial and custom circuits will have to be steadily replaced by a single (custom) technology that meets both power and scalability constraints. One of the best candidates is CMOS, a technology that the industry has relied upon for several decades and benefits from many optimizations thanks to Moore's law.
Large-scale quantum computers with more than 105 qubits will likely be built within the next decade. Trapped ions, semiconductor devices, and superconducting qubits among other physical implementations are still confined in the realm of medium-scale quantum integration (∼100 qubits); however, they show promise toward large-scale quantum integration. Building large-scale quantum processing units will require truly scalable control and measurement classical coprocessors as well as suitable wiring methods. In this blue paper, we introduce a fully vertical interconnect that will make it possible to address ∼105 superconducting qubits fabricated on a single silicon or sapphire chip: Pin-chip bonding. This method permits signal transmission from DC to ∼10 GHz, both at room temperature and at cryogenic temperatures down to ∼10 mK. At temperatures below ∼1 K, the on-chip wiring contact resistance is close to zero and all signal lines are in the superconducting state. High-density wiring is achieved by means of a fully vertical interconnect that interfaces the qubit array with a network of rectangular coaxial ribbon cables. Pin-chip bonding is fully compatible with classical high-density test board applications as well as with other qubit implementations.