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The Japan Society of Applied Physics

Characterization of a cryogenic amplifier for higher bandwidth measurement of silicon quantum dots

Shimpei Nishiyama, Mizuki Kobayashi, Raisei Mizokuchi, Tetsuo Kodera

Published Jan 25, 2019• 0 citations
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A Multi-Module Silicon-On-Insulator Chip Assembly Containing Quantum Dots and Cryogenic Radio-Frequency Readout Electronics

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Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We integrate the chiplets into modules and show respectively, (i) a peak gain over 35 dB with a 3-dB bandwidth from 709 MHz to 827 MHz and an average noise temperature of 6.2 K (minimum 4.2 K), (ii) an insertion loss smaller than 1.1 dB and a noise temperature less than 1.1 K over the 0–2 GHz range, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all modules into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.

arXiv:2405.04104•IEEE International Conference on Electronics, Circuits and Systems (ICECS)•Nov 18, 2024•0 citations

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Evaluation of a physically defined silicon quantum dot for design of matching circuit for RF reflectometry charge sensing

Jun Kamioka, R. Matsuda, Raisei Mizokuchi +2 more

This paper reports on the extraction of the equivalent circuit model parameters of a physically defined silicon quantum dot at a cryogenic temperature and design of the impedance matching circuits to improve the performance of a charge sensor for radio-frequency (RF) reflectometry. The I-V characteristics and the S-parameters of the quantum dot device are measured around a Coulomb peak at 4.2 K. The measured results are modeled by an RC parallel circuit, and the model parameters for the quantum dot device were obtained. We consider three impedance matching circuits for RF reflectometry of a quantum dot: shunt capacitor-series inductor type, shunt inductor-series capacitor type, and shunt inductor-series inductor-type. We formulate and compare the sensitivity and bandwidth of RF reflectometry for the three types of circuits. The analysis should be useful for selecting the optimal matching circuit and the circuit parameters for given equivalent circuit parameters and working frequency. This procedure is demonstrated for a quantum dot with the characterized model circuit along with simulated performance. This design technique of matching circuit for RF reflectometry can be applied to any device that can be represented by an RC parallel circuit. These results will facilitate to realize fast semiconductor qubit readout in various quantum dot platforms.

AIP Advances•Mar 1, 2023•4 citations
Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We integrate the chiplets into modules and show respectively, (i) a peak gain over 35 dB with a 3-dB bandwidth from 709 MHz to 827 MHz and an average noise temperature of 6.2 K (minimum 4.2 K), (ii) an insertion loss smaller than 1.1 dB and a noise temperature less than 1.1 K over the 0–2 GHz range, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all modules into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.
This paper reports on the extraction of the equivalent circuit model parameters of a physically defined silicon quantum dot at a cryogenic temperature and design of the impedance matching circuits to improve the performance of a charge sensor for radio-frequency (RF) reflectometry. The I-V characteristics and the S-parameters of the quantum dot device are measured around a Coulomb peak at 4.2 K. The measured results are modeled by an RC parallel circuit, and the model parameters for the quantum dot device were obtained. We consider three impedance matching circuits for RF reflectometry of a quantum dot: shunt capacitor-series inductor type, shunt inductor-series capacitor type, and shunt inductor-series inductor-type. We formulate and compare the sensitivity and bandwidth of RF reflectometry for the three types of circuits. The analysis should be useful for selecting the optimal matching circuit and the circuit parameters for given equivalent circuit parameters and working frequency. This procedure is demonstrated for a quantum dot with the characterized model circuit along with simulated performance. This design technique of matching circuit for RF reflectometry can be applied to any device that can be represented by an RC parallel circuit. These results will facilitate to realize fast semiconductor qubit readout in various quantum dot platforms.