Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We integrate the chiplets into modules and show respectively, (i) a peak gain over 35 dB with a 3-dB bandwidth from 709 MHz to 827 MHz and an average noise temperature of 6.2 K (minimum 4.2 K), (ii) an insertion loss smaller than 1.1 dB and a noise temperature less than 1.1 K over the 0–2 GHz range, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all modules into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.
Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We integrate the chiplets into modules and show respectively, (i) a peak gain over 35 dB with a 3-dB bandwidth from 709 MHz to 827 MHz and an average noise temperature of 6.2 K (minimum 4.2 K), (ii) an insertion loss smaller than 1.1 dB and a noise temperature less than 1.1 K over the 0–2 GHz range, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all modules into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.
Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state quantum processors operate best, may solve some major scaling challenges, such as system size and input/output (I/O) data management [5]. Spin qubits in silicon quantum dots (QDs) could be monolithically integrated with complementary metal-oxide-semiconductor (CMOS) electronics using very-large-scale integration (VLSI) and thus leveraging over wide manufacturing experience in the semiconductor industry [6]. However, experimental demonstrations of integration using industrial CMOS at mK temperatures are still in their infancy. Here we present a cryogenic integrated circuit (IC) fabricated using industrial CMOS technology that hosts three key ingredients of a silicon-based quantum processor: QD arrays (arranged here in a non-interacting 3x3 configuration), digital electronics to minimize control lines using row-column addressing and analog LC resonators for multiplexed readout, all operating at 50 mK. With the microwave resonators (6-8 GHz range), we show dispersive readout of the charge state of the QDs and perform combined time- and frequency-domain multiplexing, enabling scalable readout while reducing the overall chip footprint. This modular architecture probes the limits towards the realization of a large-scale silicon quantum computer integrating quantum and classical electronics using industrial CMOS technology.
Quantum computing promises to revolutionize our lives, achieving unprecedented computational powers and unlocking new possibilities in drug discovery, chemical simulations and cryptography. The fundamental unit of computation of a quantum computer is the quantum bit (qubit). It can be implemented in a number of technologies, such as superconducting qubits, spin qubits, photonic systems, trapped ions and NV-centers. Solid-state superconducting qubits and spin qubits seem to be the most promising ones, as shown by the recent demonstration of quantum supremacy with a superconducting qubit processor. Such quantum processors, to operate in the quantum regime, require very low temperatures around 10 mK, and they are hence kept inside dilution fridges. The electronics required to read out and control such processors is typically realized by discrete components or bulky scientific instruments at room temperature wired into the dilution fridge. Such approach is only feasible until few (< 100) qubits are handled, but it is not scalable for million-qubit processors required for fault-tolerant operation. In this thesis, readout and control electronics is proposed to be integrated and operated directly at cryogenic temperatures, in close proximity with the qubits and potentially even co-integrated. CMOS technology is advocated for its scalability, compactness and low prototyping cost, to create a comprehensive cryo-CMOS class of fully-integrated transceivers to read out and control solid-state qubits. In particular, the thesis focuses on cryo-CMOS radio-frequency integrated circuits for the readout of silicon quantum computers, looking to integrate the whole readout system, from the quantum layer to the room temperature user interface. Cryogenic CMOS devices are explored first, to lay the foundations of integrated circuit design. The realization of quantum dots in standard CMOS technology is explored as a platform to realize solid-state qubit arrays, demonstrating functionality at 50 mK and good reproducibility. Moreover, the operation of integrated transistors at 50 mK and 4.2 K is explored to understand their basic cryogenic functionality, through characterization and modeling. Then also integrated passives, such as capacitors, inductors and transformers, are studied and modeled at cryogenic temperatures. Then, a fully-integrated readout platform spanning across all the blocks needed for dispersive readout is proposed. A fully-integrated matrix of quantum dots with radio-frequency gate-based readout capabilities is demonstrated along with time- and frequency-multiplexing. This quantum-classical circuit shows all the features for a scalable approach and is the core of the platform following it. A cryogenic CMOS circulator based on a new all-pass filter architecture is demonstrated, to be used as integrated replacement for current bulky counterparts; it allows power reduction, insertion loss and bandwidth enhancement with respect to state-of-the-art integrated circulators. The rest of the front-end is also explored with dedicated test multiplexers, a low noise-amplifier and an oscillator, that are finally merged in a single fully-integrated low-noise receiver with frequency synthesizer operating at 3.5 K for scalable multiplexed readout of silicon qubits. The platform presented in this thesis, across temperature boundaries, carries all the features required for future scalable silicon quantum computing platforms and could therefore form their core.
Fast measurements of quantum devices is useful in areas such as quantum sensing, quantum computing, and nanodevice quality analysis. Here, we develop a superconductor-semiconductor multimodule microwave assembly to demonstrate charge-state readout at the state of the art. The assembly consist of a superconducting readout resonator interfaced to a silicon-on-insulator (SOI) chiplet containing quantum dots (QDs) in a high- κ nanowire transistor. The superconducting chiplet contains resonant and coupling elements as well as L C filters that, when interfaced with the silicon chip, result in a resonant frequency f = 2.12 GHz, a loaded quality factor Q = 850 , and a resonator impedance Z = 470 Ω . Combined with the large gate lever arms of SOI technology, we achieve a minimum integration time for single and double QD transitions of 2.77 and 13.5 ns, respectively. We utilize the assembly to measure charge noise over 9 decades of frequency up to 500 kHz and find a 1 / f dependence across the whole frequency spectrum as well as a charge-noise level of 4 μ eV / Hz at 1 Hz. The modular microwave circuitry presented here can be directly utilized in conjunction with other quantum devices to improve the readout performance as well as enable large bandwidth noise spectroscopy, all without the complexity of superconductor-semiconductor monolithic fabrication. Published by the American Physical Society 2024
Quantum computing holds the promise to solve many of today's intractable problems. A solid-state quantum computer (QC) is generally made of an array of qubits implemented in one of many solid-state technologies and operating at deep-cryogenic temperatures (10-to-20mK). Silicon spin qubits are a promising candidate for scalable QCs, due to their size, long coherence times and potential for co-integration with the required classical control and readout electronics. Recently, semiconductor spin qubits have been demonstrated to operate at ~1K, thus accelerating the achievement of a compact QC [1]. Classical qubit control electronics has also progressed, with the demonstration of fully-integrated control of spin qubits [2] and transmons [3] implemented in a cryo-CMOS technology. While a cryo-CMOS integrated circuit has been co-integrated with quantum dots [4], fully-integrated readout electronics has not yet been addressed in the literature.
Today’s quantum computing systems rely on commercial electronics operating at room temperature in order to perform control and readout operations for qubits [1] –[6]. The qubits operate at cryogenic temperatures; the signals that support control and readout of qubits therefore traverse multiple temperature stages in a dilution refrigerator to enable interaction with the qubits of a quantum computer. For many of the most advanced quantum computers built to date, the control of each individual qubit demands application of a radiofrequency pulse that is precisely calibrated in frequency, amplitude, and phase. Oubit readout demands the amplification of very low amplitude signals that are then post-processed to categorize the state of the qubit being measured. Oubit control electronics are implemented using arbitrary waveform generators (AWGs) of various types. The scalability of such systems is challenged by the need to scale the number of qubit control electronics units linearly with the number of qubits in the system. One approach to mitigating this challenge that is under active exploration is the use of multi-channel AWGs (tailored to the requirements of qubit control) that operate at the 4K stage of a quantum computing system [7] –[10]. Oubit readout electronics are typically implemented using multiple stages of amplification and then DSP-based readout performed at room temperature. In today’s systems, while readout electronics benefits from multiplexing of the readout signals (enabling a single cascade of moderately wideband amplifiers to support the delivery of multiple readout signals to the room-temperature electronics), again, the scalability of this approach is challenged much as is the case with control electronics. One approach to mitigating the readout challenge is the expanded use of cryogenic electronics in the readout chain. Success in the implementation of cryogenic control and readout solutions depends critically on multiple CMOS sub-components; in this paper we focus on SRAM and low noise amplifiers (LNAs). Note that SRAM is critical for both control and readout applications as a mixed-signal solution involving the combination of a custom processor and analog elements is highly desirable in both cases. Further, while the LNA is directly used as an element in the readout chain, a deep assessment of LNA performance and opportunities strongly benefits overall understanding of achievable noise performance in CMOS technologies at cryogenic temperatures and is therefore impoitant in both control and readout contexts.
This article presents a cryogenic quantum interface chipset at 3.5 K for superconducting transmon qubit operations. The chipset comprises a phase-detection readout and a phase-shifter-based polar-modulation controller with flexible scalability. With the proposed phase-detection readout scheme, a 9-bit time-to-digital converter (TDC)-based state detector is used to read out the qubit state by detecting the phase difference between the stimulus signal and the reflected signal. A low-IF N-path filter-based receiver and a multi-tone transmitter are co-designed to enable frequency-division multiplexing (FDM) dispersive readout of multiple qubits. A phase-shifter-based polar-modulation XY-driver is developed with support for fast phase quantum gate operation and derivative-removal-by-adiabatic-gate (DRAG) pulse generation. The Z-driver is realized using a static digital-to-analog converter (DAC) array and a 10-bit dynamic DAC for power efficiency. Fabricated in a 28-nm bulk CMOS process, the chipset occupies a die area of 4.6 mm2. The readout RX achieves a noise temperature of 40 K with a gain of 45–83 dB and a bandwidth of 1.2 GHz. The readout RX consumes 32% less power than state-of-the-art designs. The measured total readout power for simultaneous detection of two qubits is 12.2 mW, which is the lowest among readouts with a similar integration level. In addition, the controller achieves a spurious-free dynamic range (SFDR) of 49 dB for a 1-GS/s Z-driver and an SNR of 42 dB for a 1-GS/s XY-driver. The XY-driver consumes 4.3 mW per qubit under active control. Verified with practical transmon qubits, the readout fidelity exceeds 92.6%, approaching that of commercial instruments. A Rabi experiment at 5.61/6.36 MHz, a Ramsey experiment at 4.1 MHz, and a T1 experiment at9.98μs are also successfully observed using the proposed chipset at 3.5 K.