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Suspended Trace Air-Gap Resonators for Low Loss Superconducting Circuits

Fang, Michael Tianyu

Published Jun 1, 2020• 0 citations
Publisher

Abstract

Quantum memories and networks for distributed quantum information processing require links between the microwave, mechanical, and optical domains. Coherent integration of long-lived superconducting qubits (SCQs) with optomechanical and photonic devices (OMPDs) remains an outstanding challenge. We present a step towards coherent integration using a suspended trace air-gap resonator (STAR): a superconducting resonator on a silicon-on-insulator (SOI) substrate with the signal trace suspended by silicon tethers above and between galvanically connected ground metal planes. As a result, the electric field energy is closely confined within the microwave structure, yielding lower crosstalk compared to conventional coplanar waveguides (CPW). An order of magnitude improvement in the quality factors for STAR over previous work on SOI is achieved, in a transverse cross-sectional area that is an order of magnitude more compact. Electric field participation in lossy bulk dielectrics, a dominant source of energy leakage in previous measurements of aluminum CPW resonators on SOI, is virtually eliminated in STAR. The loss from the metal-air interface now dominates, but can be reduced by several factors using superconductors with better surface properties. Most importantly, STAR fabrication is compatible with Josephson junction and air-bridge deposition for highly coherent integration of SCQs and OMPDs to realize proposals for quantum information storage and networking.

DOI
10.7907/6teq-md72

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Quantum memories and networks for distributed quantum information processing require links between the microwave, mechanical, and optical domains. Coherent integration of long-lived superconducting qubits (SCQs) with optomechanical and photonic devices (OMPDs) remains an outstanding challenge. We present a step towards coherent integration using a suspended trace air-gap resonator (STAR): a superconducting resonator on a silicon-on-insulator (SOI) substrate with the signal trace suspended by silicon tethers above and between galvanically connected ground metal planes. As a result, the electric field energy is closely confined within the microwave structure, yielding lower crosstalk compared to conventional coplanar waveguides (CPW). An order of magnitude improvement in the quality factors for STAR over previous work on SOI is achieved, in a transverse cross-sectional area that is an order of magnitude more compact. Electric field participation in lossy bulk dielectrics, a dominant source of energy leakage in previous measurements of aluminum CPW resonators on SOI, is virtually eliminated in STAR. The loss from the metal-air interface now dominates, but can be reduced by several factors using superconductors with better surface properties. Most importantly, STAR fabrication is compatible with Josephson junction and air-bridge deposition for highly coherent integration of SCQs and OMPDs to realize proposals for quantum information storage and networking.
Superconducting quantum computing systems, including coplanar waveguide (CPW) resonators and qubits, are highly susceptible to energy dissipation from two-level systems (TLS) within bulk and interfacial dielectrics. CPW resonators serve as an ideal platform for characterizing these material losses at the single-photon excitation level. Building on recent experimental evidence that interface engineering can mitigate TLS losses, this study employs simulations to evaluate resonator quality factors across various interface modifications. Our results demonstrate that reducing losses at the substrate–air (SA) interface can increase the internal quality factor Qi by up to three orders of magnitude. While etching the SA interface also enhances Qi, material loss remains the dominant dissipation mechanism. Furthermore, we find that other lossy interfaces have a significantly smaller impact on the quality factor compared to the SA interface. These simulation results align with established experimental findings, providing a robust framework for refining resonator design. This work offers precise guidelines for TLS mitigation, essential for enhancing coherence times and developing more reliable superconducting quantum processors.
© 2020 Author(s). Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to the resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal-air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric etch and find that it reduced losses from the substrate-air interface, thereby improving the quality factor.
Superconducting coplanar waveguide (CPW) microwave resonators are crucial elements in Photon detectors, Quantum-limited parametric amplifiers, Narrow-band filters, Read-out, interconnect in quantum processors and Hybrid devices, connecting solid-state spins with superconducting circuits [1-3]. In the quantum regime, the dominant loss mechanism for high-Q superconducting resonators can be attributed to parasitic two-level systems (TLSs) in the dielectrics. Interface TLSs are common by products of the fabrication process, often introduced by impurities associated with Si surfaces [3]. To reduce intrinsic losses, we employ isotropic deep reactive-ion etching (DRIE) of Si substrate to create suspended NbN superconducting resonators (SSR).In this study, thin films of niobium (Nb) and niobium nitride (NbN) are deposited on Si substrate by a DC magnetron sputtering system. The influence of the N2/Ar gas ratio, the deposition current, the substrate bias potential on the superconducting critical temperature of the films are investigated. Plasma etching of Nb and NbN in a SF6 and Cl2-BCl3 gas plasma is studied using an inductively coupled plasma (icp) reactor. Parametric studies on the effects of total gas flow rate and chamber pressure on the edge angles and etch rates are reported. Finally, the suspended NbN superconducting resonator is fabricated and will be tested. This could be applied to the fabrication of superconducting qubits in integrated circuits, offering a path towards longer qubit coherence times.Reference:[1] Landig et al. Coherent spin–photon coupling using a resonant exchange qubit. Nature 560, 179–184 (2018)[2] Tosi et al. Silicon quantum processor with robust long-distance qubit couplings. Nat Commun 8, 450 (2017)[3] Bruno et al. Reducing intrinsic loss in superconducting resonators by surface treatment and deep etching of silicon substrates, Appl. Phys. Lett. 106, 182601 (2015)[4] Kennedy et al. Tunable Nb Superconducting Resonator Based on a Constriction Nano-SQUID Fabricated with a Ne Focused Ion Beam, Phys. Rev. Applied 11, 014006 (2019).
Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to the resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal–air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric etch and find that it reduced losses from the substrate–air interface, thereby improving the quality factor.
Abstract Dielectric losses are one of the key factors limiting the coherence of superconducting qubits. The impact of materials and fabrication steps on dielectric losses can be evaluated using coplanar waveguide (CPW) microwave resonators. Here, we report on superconducting CPW microwave resonators with internal quality factors systematically exceeding 5 × 106 at high powers and 2 × 106 (with the best value of 4.4 × 106) at low power. Such performance is demonstrated for 100-nm-thick aluminum resonators with 7–10.5 um center trace on high-resistivity silicon substrates commonly used in Josephson-junction based quantum circuit. We investigate internal quality factors of the resonators with both dry and wet aluminum etching, as well as deep and isotropic reactive ion etching of silicon substrate. Josephson junction compatible CPW resonators fabrication process with both airbridges and silicon substrate etching is proposed. Finally, we demonstrate the effect of airbridges’ positions and extra process steps on the overall dielectric losses. The best quality factors are obtained for the wet etched aluminum resonators and isotropically removed substrate with the proposed ultrasonic metal edge microcutting.
Silicon-on-insulator technology is widely used to fabricate silicon based devices, from advanced transistors to photonic circuits or nanomechanical systems. Integrating low loss superconducting quantum circuits with silicon-on-insulator substrates enables to couple the advantages offered by the mature silicon technology to the exquisite sensitivity of superconducting circuits. The natural approach, inherited from research in superconducting microwave devices, is to use a substrate made with highly resistive silicon, known for its low level of microwave losses. In this work, using superconducting microwave resonators, we show that counterintuitively, standard resistivity silicon-on-insulator substrates perform better than high resistivity silicon-on-insulator substrates at cryogenic temperatures. In the latter case, the presence of a parasitic sheet conduction at the interface between bulk silicon and silicon oxide acts as the dominant loss mechanism. This parasitic sheet can be suppressed using substrates with intentionally induced traps. In such substrates, losses are ultimately limited by the dielectric losses of the silicon oxide layer. These substrates offer interesting perspectives for the development of superconducting nanoelectromechanical systems. First, the release, i.e. the removal of the silicon oxide, could be limited to the moving parts, thereby maintaining the mechanical integrity of the rest of the device. Additionally, such structure would enhance heat evacuation into the bulk of the substrate which is an issue in current devices such as microwave-to-optics converters.