We present two possible methods for the fabrication of sub-micron sized Josephson junctions, namely the shadow-evaporation technique and the cross-type technology. Their importance for the field of modern super-conducting technology is discussed. As examples we present measurement results of a two-qubit sample and a prototype of a microwave detector fabricated each by one of the described methods. We review potential applications of superconducting quantum circuits based on the developed methods.We present two possible methods for the fabrication of sub-micron sized Josephson junctions, namely the shadow-evaporation technique and the cross-type technology. Their importance for the field of modern super-conducting technology is discussed. As examples we present measurement results of a two-qubit sample and a prototype of a microwave detector fabricated each by one of the described methods. We review potential applications of superconducting quantum circuits based on the developed methods.

Low Temperature PhysicsJul 1, 20176 citations

Sub- $\mu\hbox{m}$ Josephson Junctions for Superconducting Quantum DevicesSub-$\mu\hbox{m}$ Josephson Junctions for Superconducting Quantum Devices

J. M. Meckbach, Michael Merker, Simon J. Buehler +7 more

For high-performance superconducting quantum devices based on Josephson junctions (JJs), decreasing lateral sizes is of great importance. Fabrication of sub-μm JJs is challenging, due to nonflat surfaces with step heights of up to several 100 nm generated during the fabrication process. We have refined a fabrication process with significantly decreased film thicknesses, resulting in almost flat surfaces at intermediate steps during the JJ definition. In combination with a mix-and-match process, combining electron-beam lithography and conventional photolithography, we can fabricate JJs with lateral dimensions down to 0.023 μm2. We propose this refined process as an alternative to the commonly used chemical-mechanical polishing procedure. Transport measurements of JJs, having critical-current densities ranging from 50 to 104A/cm2, are presented at 4.2 K. Our JJ process yields excellent quality parameters, Rsg/RNup to ~ 50, Vmfrom 15 to 80 mV and Vgapup to 2.81 mV, and also allows the fabrication of high-quality, sub-μm wide, long JJs (LJJs) for the study of Josephson vortex behavior. The developed technique can also be used for similar multilayer processes and is very promising for fabricating sub- μm JJs for quantum devices such as SQUIDs, qubits, and SIS mixers.For high-performance superconducting quantum devices based on Josephson junctions (JJs), decreasing lateral sizes is of great importance. Fabrication of sub-μm JJs is challenging, due to nonflat surfaces with step heights of up to several 100 nm generated during the fabrication process. We have refined a fabrication process with significantly decreased film thicknesses, resulting in almost flat surfaces at intermediate steps during the JJ definition. In combination with a mix-and-match process, combining electron-beam lithography and conventional photolithography, we can fabricate JJs with lateral dimensions down to 0.023 μm2. We propose this refined process as an alternative to the commonly used chemical-mechanical polishing procedure. Transport measurements of JJs, having critical-current densities ranging from 50 to 104A/cm2, are presented at 4.2 K. Our JJ process yields excellent quality parameters, Rsg/RNup to ~ 50, Vmfrom 15 to 80 mV and Vgapup to 2.81 mV, and also allows the fabrication of high-quality, sub-μm wide, long JJs (LJJs) for the study of Josephson vortex behavior. The developed technique can also be used for similar multilayer processes and is very promising for fabricating sub- μm JJs for quantum devices such as SQUIDs, qubits, and SIS mixers.

arXiv:1210.1012IEEE Transactions on Applied SuperconductivityDec 4, 201211 citations

High-T c Josephson junctions for electronic applications

S. Pagano, Sandro Barbanera, Vincenzo Boffa +6 more

Il Nuovo Cimento DDec 1, 19940 citations

Stress accommodation in nanoscale dolan bridges designed for superconducting qubits

Sueli Skinner Ramos, Matthew Freeman, Douglas V. Pete +3 more

Josephson junctions are the principal circuit element in numerous superconducting quantum information devices and can be readily integrated into large-scale electronics. However, device integration at the wafer scale necessarily depends on having a reliable, high-fidelity, and high-yield fabrication method for creating Josephson junctions. When creating Al/AlO x based superconducting qubits, the standard Josephson junction fabrication method relies on a sub-micron suspended resist bridge, known as a Dolan bridge, which tends to be particularly fragile and can often times fracture during the resist development process, ultimately resulting in device failure. In this work, we demonstrate a unique Josephson junction lithography mask design that incorporates stress-relief channels. Our simulation results show that the addition of stress-relief channels reduces the lateral stress in the Dolan bridge by more than 70% for all the bridge geometries investigated. In practice, our novel mask design significantly increased the survivability of the bridge during device processing, resulting in 100% yield for over 100 Josephson junctions fabricated.Josephson junctions are the principal circuit element in numerous superconducting quantum information devices and can be readily integrated into large-scale electronics. However, device integration at the wafer scale necessarily depends on having a reliable, high-fidelity, and high-yield fabrication method for creating Josephson junctions. When creating Al/AlO x based superconducting qubits, the standard Josephson junction fabrication method relies on a sub-micron suspended resist bridge, known as a Dolan bridge, which tends to be particularly fragile and can often times fracture during the resist development process, ultimately resulting in device failure. In this work, we demonstrate a unique Josephson junction lithography mask design that incorporates stress-relief channels. Our simulation results show that the addition of stress-relief channels reduces the lateral stress in the Dolan bridge by more than 70% for all the bridge geometries investigated. In practice, our novel mask design significantly increased the survivability of the bridge during device processing, resulting in 100% yield for over 100 Josephson junctions fabricated.

arXiv:2502.00255SuperconductivityMar 18, 20252 citations

Sub-

\mu\hbox{m}

Josephson Junctions for Superconducting Quantum Devices