Scalable interconnection using a superconducting flux qubit
Daisuke Saida, Kazumasa Makise, Mutsuo Hidaka
Superconducting quantum computers are rapidly reaching scales where bottlenecks to scaling arise from the practical aspects of the fabrication process. To improve quantum computer performance, implementation technology that guarantees the scalability of the number of qubits is essential. Increasing the degrees of freedom in routing by 2.5-dimensional implementation is important for realizing circuit scalability. We report an implementation technology to overcome the scaling bottlenecks using a reliable connection qubit with a demonstration of quantum annealing. The method comprises interconnection based on quantum annealing using a superconducting flux qubit, precise coupling status control, and flip-chip bonding. We perform experiments and simulations with a proof-of-concept demonstration of qubit coupling via interconnection using a flux qubit. The coupling status is strictly controllable by quantum annealing. A low-temperature flip-chip bonding technology is introduced for the 2.5-dimensional interconnection. The superconducting flux qubit, formed across two different chips via bumps, is demonstrated for the first time to show a state transition like that in a conventional qubit. The quantum annealing flux qubit and flip-chip bonding enable new interconnections between qubits. A perspective on the possibility of applying this technology to the connection between gate-type qubits is described.
Scientific Reports•Jul 16, 2024•2 citations