Bulletin of the American Physical Society

Superconducting solder bumping technology for scalable quantum annealing machines

Kazumasa Makise, Masaaki Maezawa, Mutsuo Hidaka, Hiroshi Nakagawa, Katsuya Kikuchi

Published Mar 8, 2018• 0 citations

Related papers

Flip-chip bonding superconducting connections for scalable superconducting quantum annealing machines

Kazumasa Makise, Mutsuo Hidaka, Hiroshi Nakagawa +4 more

Scalable device structure for large-scale superconducting quantum annealing machines

Mutsuo Hidaka, Masaaki Maezawa, Kazumasa Makise +7 more

Design, Manufacturing, and Packaging Technology for Superconducting Quantum Annealing Machines

Shiro Kawabata, Mutsuo Hidaka, Kazumasa Makise +4 more

Development of superconducting connection by flip-chip bonding for a multilayer superconducting quantum annealing machine

Kazumasa Makise, Masaaki Maezawa, Mutsuo Hidaka +3 more

Engineering for Superconducting Quantum Annealing Machines: Design, Fabrication, and Packaging

Shiro Kawabata

Superconducting quantum annealing machines and quantum simulators: trends, perspectives, and challenges

Shiro Kawabata