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Scientific Reports

Scalable interconnection using a superconducting flux qubit

Daisuke Saida, Kazumasa Makise, Mutsuo Hidaka

Published Jul 16, 2024• 2 citations
Publisher

Abstract

Superconducting quantum computers are rapidly reaching scales where bottlenecks to scaling arise from the practical aspects of the fabrication process. To improve quantum computer performance, implementation technology that guarantees the scalability of the number of qubits is essential. Increasing the degrees of freedom in routing by 2.5-dimensional implementation is important for realizing circuit scalability. We report an implementation technology to overcome the scaling bottlenecks using a reliable connection qubit with a demonstration of quantum annealing. The method comprises interconnection based on quantum annealing using a superconducting flux qubit, precise coupling status control, and flip-chip bonding. We perform experiments and simulations with a proof-of-concept demonstration of qubit coupling via interconnection using a flux qubit. The coupling status is strictly controllable by quantum annealing. A low-temperature flip-chip bonding technology is introduced for the 2.5-dimensional interconnection. The superconducting flux qubit, formed across two different chips via bumps, is demonstrated for the first time to show a state transition like that in a conventional qubit. The quantum annealing flux qubit and flip-chip bonding enable new interconnections between qubits. A perspective on the possibility of applying this technology to the connection between gate-type qubits is described.

DOI
10.1038/s41598-024-65086-1

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Superconducting quantum computers are rapidly reaching scales where bottlenecks to scaling arise from the practical aspects of the fabrication process. To improve quantum computer performance, implementation technology that guarantees the scalability of the number of qubits is essential. Increasing the degrees of freedom in routing by 2.5-dimensional implementation is important for realizing circuit scalability. We report an implementation technology to overcome the scaling bottlenecks using a reliable connection qubit with a demonstration of quantum annealing. The method comprises interconnection based on quantum annealing using a superconducting flux qubit, precise coupling status control, and flip-chip bonding. We perform experiments and simulations with a proof-of-concept demonstration of qubit coupling via interconnection using a flux qubit. The coupling status is strictly controllable by quantum annealing. A low-temperature flip-chip bonding technology is introduced for the 2.5-dimensional interconnection. The superconducting flux qubit, formed across two different chips via bumps, is demonstrated for the first time to show a state transition like that in a conventional qubit. The quantum annealing flux qubit and flip-chip bonding enable new interconnections between qubits. A perspective on the possibility of applying this technology to the connection between gate-type qubits is described.
Flip-chip architectures have recently enabled significant scaling-up of multi-qubit circuits and have been used to assemble hybrid quantum systems that combine different substrates, for example, for quantum acoustics experiments. The standard flip-chip method uses superconducting galvanic connections between two substrates, typically implemented using sophisticated indium wafer-bonding systems, which give highly reliable and temperature-cyclable assemblies, but are expensive, somewhat inflexible in design, and require robust substrates that can sustain the large compressive forces required to cold-weld the indium bonds. A much simpler method is to assemble dies using very low-force contacts and air-dried adhesives, although this does not provide a galvanic contact between the dies. Here, we demonstrate that the latter technique can be used to reliably couple superconducting qubit circuits, in which the qubits are on separate dies, without the need for a galvanic connection. We demonstrate full vector qubit control of each qubit on each of the two dies, with high-fidelity single-shot readout, and further demonstrate entanglement-generating excitation swaps as well as benchmark a controlled-Z entangling gate between the two qubits on the two dies. This exemplifies a simple and inexpensive assembly method for two-plus-one-dimensional quantum circuit integration that supports the use of delicate or unusually shaped substrates.
We have demonstrated superconducting interconnect technologies that enable a variety of flip-chip 3D integrated structures and packages compatible with high-coherence superconducting qubits. Superconducting indium micro-bumps and underbump metal (UBM) were used to join superconducting qubit chips to superconducting readout and control modules while maintaining high qubit coherence (T1, T2,echo> 20 μs) in the presence of capacitive and inductive coupling between the chips. Scanning electron microscope, X-ray, infrared and confocal microscopy were used to investigate the micro-structure, alignment accuracy, and parallelism of flip-chip qubits. The superconducting readout and control modules can accommodate both niobium and aluminum-based circuit and amplifier fabrication processes, including shadow-evaporated aluminum or Nb/Al-AlOx/Nb trilayer Josephson junctions (JJs). We present results for up to 16 active superconducting chips having trilayer junctions bonded to a passive superconducting module. The I-V characteristics and switching behavior were measured for flip-chip-connected JJ arrays with 40-20,000 JJs. Our approach maintained chip-level junction critical current and qubit coherence, demonstrating it to be a viable approach to building larger quantum computing systems. This paper also discusses packaging approaches to developing a quantum-to-classical interface in a cryogenic environment with multiple temperature stages.
Flip-chip integration offers a promising route toward scalable superconducting quantum processors and hybrid semiconductor-superconductor quantum devices. We develop a three-dimensional transmon architecture using electroplated indium in which the qubit electric field is shared nearly equally between two bump-bonded substrates while maintaining low participation at the indium-bump interface. The resulting geometry is well suited for future hybrid qubits, enabling the integration of distinct material platforms while minimizing sensitivity to bump-interface loss. Using this platform, we evaluate electroplated indium interconnects for superconducting quantum circuits. Flip-chip transmons incorporating electroplated indium bumps exhibit qubit quality factors around 10610^6106. In addition, a systematic study of coplanar-waveguide resonators is used to identify losses associated with the electroplating process. In particular, we find that surface losses associated with the gold-layer, used to enable good electric contact with the indium, is likely the primary contributor to the qubit decay rate. These results demonstrate the compatibility of electroplated indium technology with high-coherence superconducting circuits and establish a promising platform for three-dimensional hybrid quantum integration.
Superconducting single flux quantum (SFQ) circuit can operate at very low temperature. This is suitable for controlling a quantum computing system with Josephson junctions. However, it is difficult to integrate both SFQ circuits and qubits into a single-chip, because of the dissipative characteristics of SFQ circuits. Therefore, we have developed a multi-chip packaging technology for a qubit control module. The module consists of SFQ circuit chips, qubit chips, and a substrate all of which are fabricated with Nb and Al technology. The chips are flip-chip bonded with superconducting solder bumps. We also investigated SFQ control circuits for superconducting qubits and circuit parameter optimization for sub-Kelvin temperature operation. Using both multi-chip packaging and optimized SFQ control circuit makes the design of qubit control module more flexible.
Abstract We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips—one quantum chip and one control chip—that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 μs, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.
The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump bonded to the quantum chip, forming a multichip module. The modular approach allows for improved connectivity between the qubits and control and readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high-fidelity single-qubit gates with 6-ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.