Superinductances are superconducting circuit elements that combine a large inductance with a low parasitic capacitance to ground, resulting in a characteristic impedance exceeding the resistance quantum RQ=h/(2e)2≃6.45kΩ. In recent years, these components have become key enablers for emerging quantum circuit architectures. However, achieving high characteristic impedance while maintaining scalability and fabrication robustness remains a major challenge. In this work, we present two fabrication techniques for realizing superinductances based on vertically stacked Josephson junctions. Using a multi-angle Manhattan (MAM) process and a zero-angle (ZA) evaporation technique -- in which junction stacks are connected pairwise using airbridges -- we fabricate one-dimensional chains of stacks that act as high-impedance superconducting transmission lines. Two-tone microwave spectroscopy reveals the expected n scaling of the impedance with the number of junctions per stack. The chain fabricated using the ZA process, with nine junctions per stack, achieves a characteristic impedance of ∼16kΩ, a total inductance of 5.9μH, and a maximum frequency-dependent impedance of 50kΩ at 1.4 GHz. Our results establish junction stacking as a scalable, robust, and flexible platform for next-generation quantum circuits requiring ultra-high impedance environments.
We present Josephson junctions fabricated from high transition temperature superconductor YBa2Cu3O7coupled to spiral THz antennas. The fabrication process involves creating a Josephson junction at the center of a superconducting bridge embedded into a THz spiral antenna using irradiation from a focused helium ion beam. For low doses of helium irradiation, the junctions have metallic barriers and operate at temperatures as high as 67 K. For higher doses of irradiation, insulator barriers are created. These devices have higher resistance but require cooling to lower temperatures (~10 K) due to smaller critical currents. Through optimization of the dose and by trimming the width of the junctions, we have created high resistance devices to improve the impedance match to a spiral antenna. Under 90-GHz radiation, we observe up to 17 Shapiro steps in the I-V curve out to approximately 3 mV at a temperature of 10 K.
Sub-μm Josephson Junctions for Superconducting Quantum Devices
For high-performance superconducting quantum devices based on Josephson junctions (JJs), decreasing lateral sizes is of great importance. Fabrication of sub-μm JJs is challenging, due to nonflat surfaces with step heights of up to several 100 nm generated during the fabrication process. We have refined a fabrication process with significantly decreased film thicknesses, resulting in almost flat surfaces at intermediate steps during the JJ definition. In combination with a mix-and-match process, combining electron-beam lithography and conventional photolithography, we can fabricate JJs with lateral dimensions down to 0.023 μm2. We propose this refined process as an alternative to the commonly used chemical-mechanical polishing procedure. Transport measurements of JJs, having critical-current densities ranging from 50 to 104A/cm2, are presented at 4.2 K. Our JJ process yields excellent quality parameters, Rsg/RNup to ~ 50, Vmfrom 15 to 80 mV and Vgapup to 2.81 mV, and also allows the fabrication of high-quality, sub-μm wide, long JJs (LJJs) for the study of Josephson vortex behavior. The developed technique can also be used for similar multilayer processes and is very promising for fabricating sub- μm JJs for quantum devices such as SQUIDs, qubits, and SIS mixers.