Low-loss inductors are essential components in various superconducting circuits, such as qubits or digital electronics. In this study, we investigate highly compact inductors formed by vertically stacking Josephson junctions. Our implementation employs several layers of aluminum separated by tunnel barriers. Individual stacks are connected by suspended superconducting bridges, which are free of additional dielectric materials and, therefore, should not contribute significantly to losses. We present implementation details, fabrication results, and device characterization measurements.
Superinductances are superconducting circuit elements that combine a large inductance with a low parasitic capacitance to ground, resulting in a characteristic impedance exceeding the resistance quantum RQ=h/(2e)2≃6.45kΩ. In recent years, these components have become key enablers for emerging quantum circuit architectures. However, achieving high characteristic impedance while maintaining scalability and fabrication robustness remains a major challenge. In this work, we present two fabrication techniques for realizing superinductances based on vertically stacked Josephson junctions. Using a multi-angle Manhattan (MAM) process and a zero-angle (ZA) evaporation technique -- in which junction stacks are connected pairwise using airbridges -- we fabricate one-dimensional chains of stacks that act as high-impedance superconducting transmission lines. Two-tone microwave spectroscopy reveals the expected n scaling of the impedance with the number of junctions per stack. The chain fabricated using the ZA process, with nine junctions per stack, achieves a characteristic impedance of ∼16kΩ, a total inductance of 5.9μH, and a maximum frequency-dependent impedance of 50kΩ at 1.4 GHz. Our results establish junction stacking as a scalable, robust, and flexible platform for next-generation quantum circuits requiring ultra-high impedance environments.