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IEEE International Superconductive Electronics Conference (ISEC)

Experimental Investigation of ERSFQ Circuit for Parallel Multibit Data Transmission

Timur V. Filippov, Denis Amparo, Michael Y. Kamkar, Jason Walter, Alex F. Kirichenko, Oleg A. Mukhanov, I. V. Vernik

Published Jun 1, 2017• 11 citations
Publisher

Abstract

We present test results for parallel data communication ERSFQ circuits with clock recovery. We experimentally study on-chip and chip-to-chip parallel data communication circuits with 4-, 8- and 16-bit word lengths. The largest circuit is a 16-bit chip-to-chip communication test circuit embedded into a testbed with clock distributed over a combination of active and passive transmission lines with transmitter/receiver pairs, and is comprised of 3464 Josephson junctions in total. All ERSFQ circuits are fabricated using MITLL 10-kA/cm2SFQ5ee process. For the chip-to-chip communication experiment, a multi-chip module (MCM) is assembled using Hypres' MCM flip-chip bonding process which connected the MIT-LL-made flip-chip to the Hypres-made MCM carrier using 220 signal bumps with 50 um pitch. We experimentally confirmed correct functionality of 4-, 8- and 16-bit circuits and measured their current bias margins. For the 16- bit chip-to-chip communication circuit mounted to a MCM, we measured ±12% dc bias margins similar to the margins measured for the on-chip version of the same circuit. The MCM circuit is also evaluated at high clock speed generated by an external source, while the data words are changed at low speed. The correct functionality is observed without significant reduction in the bias margins using average-voltage test approach.

DOI
10.1109/isec.2017.8314191

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We present test results for parallel data communication ERSFQ circuits with clock recovery. We experimentally study on-chip and chip-to-chip parallel data communication circuits with 4-, 8- and 16-bit word lengths. The largest circuit is a 16-bit chip-to-chip communication test circuit embedded into a testbed with clock distributed over a combination of active and passive transmission lines with transmitter/receiver pairs, and is comprised of 3464 Josephson junctions in total. All ERSFQ circuits are fabricated using MITLL 10-kA/cm2SFQ5ee process. For the chip-to-chip communication experiment, a multi-chip module (MCM) is assembled using Hypres' MCM flip-chip bonding process which connected the MIT-LL-made flip-chip to the Hypres-made MCM carrier using 220 signal bumps with 50 um pitch. We experimentally confirmed correct functionality of 4-, 8- and 16-bit circuits and measured their current bias margins. For the 16- bit chip-to-chip communication circuit mounted to a MCM, we measured ±12% dc bias margins similar to the margins measured for the on-chip version of the same circuit. The MCM circuit is also evaluated at high clock speed generated by an external source, while the data words are changed at low speed. The correct functionality is observed without significant reduction in the bias margins using average-voltage test approach.
We report experimental results on chip-to-chip transfer of single-flux-quantum (SFQ) pulses using an active multichip module (MCM). Josephson transmitters and receivers are integrated on both a chip and an MCM substrate. An MCM consisting of a 4.8-mm chip and an 8.2-mm MCM substrate was fabricated using a 1.6-kA/cm/sup 2/ Nb-trilayer process and a solder-bumped flip-chip bonding technology. The correct operation of the circuit was confirmed by low-speed testing. Bit-error rate (BER) of the circuit was measured down to 10/sup -5/, and extrapolation of the error-function fits suggested a very small BER, lower than 10/sup -200/, at the optimum bias point. Experimental margins on the bias voltage were as large as /spl plusmn/34%.
Abstract Superconducting digital circuits are a promising approach to build integrated systems with high energy-efficiency and computational density of the packaged chips. In such systems, performance of the data link between chips mounted on a multi-chip-module (MCM) is a critical driver of performance. In this work we report a synchronous data link using reciprocal quantum logic enabled by resonant clock distribution on-chip and on the MCM carrier. The simple physical link has only four Josephson junctions and 3 fJ/bit dissipation, including a 300 W/W cooling overhead. The driver produces a signal with 35 GHz analog bandwidth and connects to a single-ended receiver via 20 Ω Nb passive transmission line. To validate this link, we have designed, fabricated, and tested two 32 × 32 mm2 MCMs with eight 5 × 5 mm2 chips connected serially and powered by a traveling-wave clock, and with four 10 × 10 mm2 chips powered with a 2 GHz resonant clock. The traveling-wave clock MCM validates performance of the data link components and achieves a 5.4 dB AC bias margin with no degradation relative to individual chip tests. The resonator MCM validates synchronization between chips, with a measured AC bias margin up to 4.8 dB between two chips. The resonator MCM is capable of powering circuits of 4 million Josephson junctions across the four chips with a projected 10 Gbps serial data rate.
Superconducting single flux quantum (SFQ) circuits can process information at extremely high speeds, in the range of hundreds of GHz. SFQ circuits are based on Josephson junction cells for switching logic and ballistic transmission for transferring SFQ pulses. Multi-chip modules (MCMs) are often used to implement larger complex designs, which cannot be fit onto a single chip. We have optimized the design of wideband interconnects for transferring signals and SFQ pulses between chips in flip-chip MCMs and evaluated the importance of several design parameters such as the geometry of bump pads on chips, length of passive microstrip lines (MSLs) and number of corners in MSLs as well as flux trapping and fabrication effects on the operating margins of the MCMs. Several test circuits have been designed to evaluate the above mentioned features and fabricated in the framework of a 4.5 kA cm −2 HYPRES process. The MCM bumps for electrical connections have been deposited using a wafer-level electroplating process. We have found that, at the optimized configuration, the maximum operating frequency of the MCM test circuit, a ring oscillator with chip-to-chip connections, approaches 100 GHz and is not noticeably affected by the presence of MCM interconnects, decreasing by only about 3% with respect to the same circuit with no inter-chip connections.
This paper presents the results of theoretical optimization of the multi-chip-module (MCM) contact and driver circuitries for gigabit chip-to-chip communication. Optimization has been done using 3D electromagnetic (EM) simulations of MCM contacts and time domain simulations of drivers and receivers. A single optimized MCM contact has a signal reflection of less than −20 dB for more than 400 GHz bandwidth. The MCM data link with the optimized SFQ driver, receiver and two MCM contacts has operational margins on the global bias current of ± 30% at 30 Gbit s −1 speedand can operate above 100 Gbit s −1 speed. Wide bandwidth transmission requires the realization of an advanced flip–chip process with a small dimension of the MCM contact (less than 30 µm diameter of the contact pad) and small height of the flip–chip contact bumps of the order of 2 µm. Current processes with about 7 µm height of the bumps require the application of a double-flux-quantum (DFQ) driver. The data link with the DFQ driver was also simulated. It has operational margins on the global bias current of ± 30% at 30 Gbit s −1 ; however, the maximum speed of operation is 61 Gbit s −1 . Several test structures have been designed for measurements of signal reflection, bit error rate and operational margins of the data link.
We have designed and tested a parallel 8-bit ERSFQ binary shifter that is one of the essential circuits in the design of the energy-efficient superconducting CPU. The binary shifter performs a bidirectional SHIFT instruction of an 8-bit argument. It consists of a bidirectional triple-port shift register controlled by two (left and right) shift pulse generators asynchronously generating a set number of shift pulses. At first clock cycle, an 8-bit word is loaded into the binary shifter and a 3-bit shift argument is loaded into the desired shift-pulse generator. Next, the generator produces the required number of shift SFQ pulses (from 0 to 7) asynchronously, with a repetition rate set by the internal generator delay of ~ 30 ps. These SFQ pulses are applied to the left (positive) or the right (negative) input of the binary shifter. Finally, after the shift operation is completed, the resulting 8-bit word goes to the parallel output. The complete 8-bit ERSFQ binary shifter, consisting of 820 Josephson junctions, was simulated and optimized using PSCAN2. It was fabricated in MIT Lincoln Lab's 10-kA/cm2SFQ5ee fabrication process with a high-kinetic inductance layer. We have successfully tested the binary shifter at both the LSB-to-MSB and MSB-to-LSB propagation regimes for all eight shift arguments. A single shift operation on a single input word demonstrated operational margins of ±16% of the dc bias current. The correct functionality of the 8-bit ERSFQ binary shifter with the large, exhaustive data pattern was observed within ±10% margins of the dc bias current. In this paper, we describe the design and present the test results for the ERSFQ 8-bit parallel binary shifter.
Chip-to-chip propagation of a single flux quantum (SFQ) pulse has been demonstrated using an active multichip module (MCM) technique in which active transmitters and receivers are integrated on an MCM substrate as well as on a chip. A chip-to-chip SFQ transfer circuit has been designed and implemented by a standard Nb-trilayer process and solder-bumped flip-chip technology. The correct operation of the circuit has been confirmed by low-frequency testing. Experimental margins for the global factor for bias currents have been as large as /spl plusmn/33%.