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Superconductor Science and Technology

Fabrication artifacts and parallel loss channels in metamorphic epitaxial aluminum superconducting resonators

Christopher J. K. Richardson, Nathan Paul Siwak, Justin C. Hackley, Z.K. Keane, J. E. Robinson, Bruce W. Arey, I. Arslan, B. S. Palmer

Published Apr 15, 2016• 46 citations
Publisher

Abstract

Abstract Fabrication of coplanar waveguide resonators with internal quality factors near 10 6 remains challenging. Here, high-purity superconductors are implemented through metamorphic epitaxial aluminum that is grown via molecular beam epitaxy on silicon and sapphire substrates. X-ray diffraction and scanning transmission electron microscopy indicate an abrupt highly ordered interface that results in crystal relaxation within a few monolayers of the substrate interface and no measurable interfacial contamination. Quarter-wave coplanar waveguide resonators are fabricated using optical lithography and measured at temperatures below 100 mK. Post measurement characterization with charge contrast imaging in a scanning electron microscope identifies processing artifacts at the waveguide sidewalls, on the exposed substrate area and on the exposed aluminum surface. Of primary importance are processing induced corrosion defects on aluminum sidewalls, nanoparticle contamination, and photoresist residue that is difficult to remove without affecting the superconductor material. Likely correlations between these artifacts and the measured quality factor are discussed in context of device to device variations in resonator performance.

DOI
10.1088/0953-2048/29/6/064003

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Abstract Fabrication of coplanar waveguide resonators with internal quality factors near 10 6 remains challenging. Here, high-purity superconductors are implemented through metamorphic epitaxial aluminum that is grown via molecular beam epitaxy on silicon and sapphire substrates. X-ray diffraction and scanning transmission electron microscopy indicate an abrupt highly ordered interface that results in crystal relaxation within a few monolayers of the substrate interface and no measurable interfacial contamination. Quarter-wave coplanar waveguide resonators are fabricated using optical lithography and measured at temperatures below 100 mK. Post measurement characterization with charge contrast imaging in a scanning electron microscope identifies processing artifacts at the waveguide sidewalls, on the exposed substrate area and on the exposed aluminum surface. Of primary importance are processing induced corrosion defects on aluminum sidewalls, nanoparticle contamination, and photoresist residue that is difficult to remove without affecting the superconductor material. Likely correlations between these artifacts and the measured quality factor are discussed in context of device to device variations in resonator performance.
We systematically investigate the influence of the fabrication process on dielectric loss in aluminum-on-silicon superconducting coplanar waveguide resonators with internal quality factors (Qi) of about one million at the single-photon level. These devices are essential components in superconducting quantum processors; they also serve as proxies for understanding the energy loss of superconducting qubits. By systematically varying several fabrication steps, we identify the relative importance of reducing loss at the substrate–metal and substrate–air interfaces. We find that it is essential to clean the silicon substrate in hydrogen fluoride (HF) prior to aluminum deposition. A post-fabrication removal of the oxides on the surface of the silicon substrate and the aluminum film by immersion in HF further improves the Qi. We observe a small, but noticeable, adverse effect on the loss by omitting either standard cleaning (SC1), pre-deposition heating of the substrate to 300 °C, or in situ post-deposition oxidation of the film’s top surface. We find no improvement due to excessive pumping meant to reach a background pressure below 6 × 10−8 mbar. We correlate the measured loss with microscopic properties of the substrate–metal interface through characterization with x-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, transmission electron microscopy, energy-dispersive x-ray spectroscopy, and atomic force microscopy.
Abstract Quantum bits (qubits) with long coherence times are an important element for the implementation of medium- and large-scale quantum computers. In the case of superconducting planar qubits, understanding and improving qubits’ quality can be achieved by studying superconducting planar resonators. In this paper, we fabricate and characterize coplanar waveguide resonators made from aluminum thin films deposited on silicon substrates. We perform three different substrate surface treatments prior to aluminum deposition: one chemical treatment based on a hydrofluoric acid clean; one physical treatment consisting of a thermal annealing at 880 °C in high vacuum; and one combined treatment comprising both the chemical and the physical treatments. The aim of these treatments is to remove the two-level state (TLS) defects hosted by the native oxides residing at the various samples’ interfaces. We first characterize the fabricated samples through cross-sectional tunneling electron microscopy, acquiring electron energy loss spectroscopy maps of the samples’ cross sections. These measurements show that both the chemical and the physical treatments almost entirely remove native silicon oxide from the substrate surface and that their combination results in the cleanest interface. Additionally, we analyze the effects of the various substrate treatments on the roughness of the silicon surface by means of atomic force microscopy surface morphology mapping. We then study the quality of the resonators by means of microwave measurements in the ‘quantum regime’, i.e., at a temperature T ∼ 10 mK and at a mean microwave photon number 〈 n ph 〉 ∼ 1 . In this regime, we find that both surface treatments independently improve the resonator’s intrinsic quality factor by ≈172%. The highest quality factor is obtained for the combined treatment, Q i ≈ 0.82 million, corresponding to an improvement by ≈256%. Finally, we find that the TLS quality factor averaged over a time period of 3 h is ∼3 million at 〈 n ph 〉 ∼ 10 , indicating that substrate surface engineering can potentially reduce the TLS loss below other losses such as quasiparticle loss and flux noise.
I hereby declare that I am the sole author of this thesis. This is a true copy of the thesis, including any required final revisions, as accepted by my examiners. I understand that my thesis may be made electronically available to the public. ii The growth of Aluminum (Al) on semiconductors and dielectrics is a cornerstone in the quest for scalable quantum computing systems. Indeed the electrical properties of Al make it an exceptional candidate for the realization of superconducting resonators, pivotal tools for understanding and operating superconducting qubits. Such resonators have been fabricated recently on Sapphire substrates, using Molecular Beam Epitaxy (MBE), and displayed quality factors above a million. Complementary studies of these resonators have demonstrated that the metal-substrate interface was the primary source of decoherence and losses, highlighting the importance of pristine interfaces (free of contaminants), and high quality epitaxial growth in order to minimize the native defects level. In this work we investigate different substrate materials in order to yield equivalent or higher qual-
Abstract Dielectric losses are one of the key factors limiting the coherence of superconducting qubits. The impact of materials and fabrication steps on dielectric losses can be evaluated using coplanar waveguide (CPW) microwave resonators. Here, we report on superconducting CPW microwave resonators with internal quality factors systematically exceeding 5 × 106 at high powers and 2 × 106 (with the best value of 4.4 × 106) at low power. Such performance is demonstrated for 100-nm-thick aluminum resonators with 7–10.5 um center trace on high-resistivity silicon substrates commonly used in Josephson-junction based quantum circuit. We investigate internal quality factors of the resonators with both dry and wet aluminum etching, as well as deep and isotropic reactive ion etching of silicon substrate. Josephson junction compatible CPW resonators fabrication process with both airbridges and silicon substrate etching is proposed. Finally, we demonstrate the effect of airbridges’ positions and extra process steps on the overall dielectric losses. The best quality factors are obtained for the wet etched aluminum resonators and isotropically removed substrate with the proposed ultrasonic metal edge microcutting.
Using molecular beam epitaxy, we have realized thin films of titanium nitride (TiN) on c-plane sapphire that exhibit the lowest observed full-width at half maximum X-ray rocking curve width of 18 arcsec. Though the (111) oriented TiN exhibits an abrupt and crystalline interface with sapphire, for the first time we observe sub-surface defects in the sapphire substrate, which nucleate structural defects in the epitaxial TiN layer. Using quarter-wavelength coplanar waveguide (CPW) resonators in a 3 \textmu m/6 \textmu m/3 \textmu m gap/strip/gap lines in a hanger geometry, we find the internal quality factor of the TiN resonators to be >106>10^{6}>106 in the single-photon ⟨n⟩∼1\langle n \rangle \sim 1⟨n⟩∼1 limit at 5.8 GHz and 10 mK, rising to >20×106>20 \times 10^{6}>20×106 at ⟨n⟩∼106\langle n \rangle \sim 10^{6}⟨n⟩∼106. The results are of high interest for applications of superconducting TiN in several areas, and provide a path towards epitaxial Josephson junctions with crystalline barriers in the future for high coherence qubits.
Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to the resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal–air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric etch and find that it reduced losses from the substrate–air interface, thereby improving the quality factor.