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Bulletin of the American Physical Society

Development of integrated, on-chip microwave amplifiers for superconducting qubit measurement

D.M. Toyli, Andrew Eddins, Eli M. Levenson-Falk, Saeed I. Khan, Aashish A. Clerk, Rajamani Vijay, Irfan A. Siddiqi

Published Mar 5, 2014• 0 citations
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This paper describes a novel multi-metal layered interconnect-based heterogeneous integration approach for developing a reworkable superconducting qubit package. Various microbump options, including gold, tin, indium, and tin indium, were used to achieve the desired flip-chip configurations. As a case study, we demonstrate a reworkable cryogenic superconducting qubit package capable of interconnecting up to 32 microwave lines. The flip-chip package configurations show low (below 30 dB @ RT) nearest-neighbor crosstalk up to 10 GHz. Initial qubit measurements at low temperatures (~10 mK) show qubit lifetime T1> 100 μs (Q > 2M), which is comparable to the planar versions measured in our standard Al wirebonded package. Keywords—qubit, heterogeneous integration, interconnect, flip-chip, crosstalk.