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IEEE Transactions on Applied Superconductivity

Monte Carlo and thermal noise analysis of ultra-high-speed high temperature superconductor digital circuits

Mark Jeffery, P.Y. Xie, Stephen R. Whiteley, T. Van Duzer

Published Jun 1, 1999• 50 citations
Publisher

Abstract

We model the high temperature superconductor (HTS) rapid single flux quantum (RSFQ) toggle (T) flip-flop including process variations and thermal noise. A Monte Carlo method is used to calculate the theoretical yield of the circuit at speeds ranging from 1-83 GHz and for various process parameter spreads. Thermal noise is also included in the simulations and we calculate bit error rates at 1-150 GHz as a function of temperature. Our results demonstrate quantitatively the difference between HTS layouts with and without parasitic inductance. Furthermore, our simulations suggest that using the existing HTS process with a 250 /spl mu/V I/sub c/R/sub n/ product the T flip-flop operating temperature should be below 40 K in order to obtain bit error rates less than 10/sup -6/ at gigahertz speeds.

DOI
10.1109/77.783926

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We model the high temperature superconductor (HTS) rapid single flux quantum (RSFQ) toggle (T) flip-flop including process variations and thermal noise. A Monte Carlo method is used to calculate the theoretical yield of the circuit at speeds ranging from 1-83 GHz and for various process parameter spreads. Thermal noise is also included in the simulations and we calculate bit error rates at 1-150 GHz as a function of temperature. Our results demonstrate quantitatively the difference between HTS layouts with and without parasitic inductance. Furthermore, our simulations suggest that using the existing HTS process with a 250 /spl mu/V I/sub c/R/sub n/ product the T flip-flop operating temperature should be below 40 K in order to obtain bit error rates less than 10/sup -6/ at gigahertz speeds.
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A major restriction in the development of a working Rapid Single Flux Quantum (RSFQ) logic circuit with high-Tc superconductors is given by the influence of thermal noise. This gives reason to ask for a general determination of the digital bit error rate. As other approaches, our method of calculating the switching probability is based on the Fokker-Planck equation. In the past few years the bit error rates for a single Josephson junction, SQUIDs and the comparator were calculated by using this theory. We demonstrate numerical solution of the multidimensional Fokker-Planck equation to calculate bit error rates due to thermal noise for a Toggle Flip Flop circuit. In the present work, we combine thermal noise analysis with the effects of process variations in order to derive rules for designing high-Tc RSFQ logic circuits.
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The application of high temperature superconductor (HTS) Josephson junctions in digital rapid single flux quantum circuits requires a careful study of the influence of thermal noise on the bit error rate (BER). We have determined experimentally, for the first time, the BER of a HTS rapid single flux quantum circuit. A comparator, formed by two Josephson junctions, was integrated in a Josephson transmission line ring oscillator, allowing us to perform high speed testing of the comparator at GHz frequencies. For fabrication, focused-electron-beam-irradiated junctions have been used because of their small parameter spread and excellent alignment possibilities. A BER of less than 10−11 was obtained at 39 K.
Thermal noise strongly influences the operation of RSFQ (rapid single flux quantum) logic circuits made of high-temperature superconductors (HTS). In the past, the circuit design was based on fabrication yield optimization. A new theoretical study using a method of general determination of the digital bit-error rate (BER) gives hope to develop such devices with a large immunity against noise. With regard to this study the design parameters of a circuit optimized with respect to fabrication yield are far from its minimum bit-error rate. Only for temperatures close to 4 K the parameters determined for fabrication yield match the parameters obtained with BER optimization. For this reason, a new reliable technology for fabrication of HTS circuits is required. We have developed a new fabrication process to serve as a basis for a proof of this new design approach. We have calculated the bit-error rate of a newly designed RSFQ chip with realistic values derived from a test chip which has been fabricated with this new multilayer technology. The new technology contains three superconductor thin films. An inductance smaller than 0.5 pH per square has been reached by using a ground plane.