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Journal of Physics Conference Series

Nb-based overdamped junctions with improved performance for measurement applications

V. Lacquaniti, Domenico Andreone, Cristina Cassiago, Natascia De Leo, Matteo Fretto, Sabino Maggi, A. Sosso, Mikhail A. Belogolovskii

Published Feb 1, 2008• 1 citation
Publisher

Abstract

Optimization of the performance of Nb-based overdamped Josephson junctions for applications to superconducting electronics is a major issue today. The use of cryocoolers, thus avoiding liquid helium refrigeration, with junctions working at temperatures higher than 4.2 K, could greatly increase the use of these devices in applications such as fundamental metrology and measurement sensors. The question we address here is how to maximize the characteristic voltage and minimize the temperature influence on the current-voltage curves of overdamped junctions enabling their use at T > 4.2K. To optimize the properties of a single Josephson heterostructure, we propose a type of overdamped junction that consists of a relatively thin insulating layer and a thick (tens of nm) normal-metal film between two superconducting electrodes. Measurements of the dependence of the critical current and characteristic voltage as function of temperature for dierent electrodes configurations show how it is possible to improve the design of these junctions.

DOI
10.1088/1742-6596/97/1/012174

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Optimization of the performance of Nb-based overdamped Josephson junctions for applications to superconducting electronics is a major issue today. The use of cryocoolers, thus avoiding liquid helium refrigeration, with junctions working at temperatures higher than 4.2 K, could greatly increase the use of these devices in applications such as fundamental metrology and measurement sensors. The question we address here is how to maximize the characteristic voltage and minimize the temperature influence on the current-voltage curves of overdamped junctions enabling their use at T > 4.2K. To optimize the properties of a single Josephson heterostructure, we propose a type of overdamped junction that consists of a relatively thin insulating layer and a thick (tens of nm) normal-metal film between two superconducting electrodes. Measurements of the dependence of the critical current and characteristic voltage as function of temperature for dierent electrodes configurations show how it is possible to improve the design of these junctions.
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Niobium-based junctions are still the best candidates for many small-scale applications of superconductivity and in particular, for the design and the fabrication of programmable voltage standards and D/A converters of fundamental accuracy. Non-hysteretic junctions with a large current density JC, and a reasonable characteristic voltage Vc are required, while, in order to make these circuits available to a wider market, operation at temperatures above 4.2 K would be important. In this work we report our results achieved on Nb/Al-AlOX/Nb junctions whose properties are studied in order to optimize the aforementioned features. Their behavior is analyzed showing how the overdamped characteristic is obtained with a less critical structure compared to other type of junctions. Moreover, using the scattering matrix approach, we have calculated a deviation of superconducting current-phase relation in such a SNIS Josephson junction from sinusoidal one and its effect on the current amplitudes of Shapiro steps as function of temperature. Measurement of the step dependence on temperature are also reported, where we considered the possibility of using bothn= 1 andn= 2 RF step above 4.2 K, for a possible reduction of the number of junctions in array circuits.
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Overdamped NbTiN Josephson junctions with Ti–TiN bilayered normal-metal barrier are proposed for metrological applications. Binary arrays consisting of 32 768 NbTiN/Ti–TiN/NbTiN junctions were fabricated for quantum voltage standards, and a Shapiro step at 1 V with the step height of about 0.5 mA was generated at around 8 K. The Ti layer was added to protect the base NbTiN electrode from nitrogen plasma during the deposition of the TiN layer. While the critical current Ic and the junction resistance Rn are mainly dominated by the thickness of the TiN barrier, Ic can be also adjusted by changing the thickness of the Ti barrier to maximize the operating margin for voltage standard circuits. An optimization of the NbTiN film in terms of film stress is also described for fabrication of circuits containing such a large number of junctions.
Improved Characteristics of Intrinsically Shunted Nb/Al−AlOx−Nb{\rm Nb/Al}-{\rm AlO}_{x}-{\rm Nb}Nb/Al−AlOx​−Nb Josephson Junctions
Josephson junctions with non-hysteretic current-voltage characteristics form the basis of most superconducting electronic circuits including RSFQ logic and programmable Josephson voltage standards. In contrast to conventional SIS devices, Nb/Al-AlOx-Nb (SNIS) junctions with an additional comparatively thick Al interlayer and a comparatively thin barrier AlOxare intrinsically shunted at T ≥ 4.2 K . In this contribution, we provide experimental and theoretical arguments proving that this finding is mainly explained by a broad distribution of highly-conductive barrier transparencies with a significant effect from nearly ballistic modes. An additional advantage of the proposed SNIS junctions is possibility to tune the critical voltage value by modifying Nb and/or Al film thicknesses. With observations of wide Shapiro steps up to 1.25 V at 6.3 K we show that this type of Josephson junctions can be successfully used at temperatures above 4.2 K. The presence of well-developed quantized voltage features even at 7.2 K means that Nb/Al-AlOx-Nb devices can successfully operate far above the liquid helium temperature and, in principle, are compatible with two-stage cryocoolers.
The overdamped Nb/Al-AlOx/Nb superconductor-normal metal-insulator-superconductor SNIS Josephson junctions recently developed at INRIM exhibit high values of critical current density and characteristic voltage, making these devices appealing both for metrology and digital electronics. High current densities could allow reduction of junction size, increasing the integration level. In this work authors present first results concerning the realization of sub-μm SNIS including a nanolithographic technique (Electron Beam Lithography, EBL) into the conventional process, to reduce junction dimensions. Fabrication and electrical parameters have been evaluated considering the scaling of the areas of junctions, furthermore RF and temperature behaviour have been studied.