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IEEE Transactions on Applied Superconductivity

Design issues for interconnects in densely packaged RSFQ structures

Boyko Dimov, Thomas Ortlepp, Hannes Toepfer, Hermann F. Uhlmann

Published Jun 1, 2003• 7 citations
Publisher

Abstract

The manufacturing process of LTS RSFQ circuits is quite similar to that of the semiconductor chips, thus providing the possibility of an ultra high-density packaging similar to the modern semiconductor logic circuits. However, the miniaturization of the interconnects does not enhance their performance. The present work highlights the impact of the parasitic interactions between the superconductive interconnects on the correct logical functionality and the upper bias current margins of the LTS RSFQ circuits.

DOI
10.1109/tasc.2003.813916

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The manufacturing process of LTS RSFQ circuits is quite similar to that of the semiconductor chips, thus providing the possibility of an ultra high-density packaging similar to the modern semiconductor logic circuits. However, the miniaturization of the interconnects does not enhance their performance. The present work highlights the impact of the parasitic interactions between the superconductive interconnects on the correct logical functionality and the upper bias current margins of the LTS RSFQ circuits.
The Rapid Single Flux Quantum (RSFQ) technique is regarded as one of the most promising electronics due to its extremely high operating speed and low power consumption. Middle-scale RSFQ applications operating at multigigahertz frequency have recently been reported on. At such high operating frequencies, the on-chip interconnects start to play a limiting role for the performance of the densely packaged digital circuits. Our previous studies have theoretically investigated the parasitic coupling effects between superconductive microstrip transmission lines and conclusions have been drawn about the critical coupling levels of several typical microstrip geometries. Here, basic RSFQ structures are investigated experimentally, which contain a Josephson transmission line stage with large inductance and can either trap or pass SFQ pulses. These structures are incorporated in critical microstrip layouts, thus being subjected to parasitic coupling. The bias levels are monitored at which the structures start to pass the SFQ pulses with and without coupling influences. Thus, the conclusions of our previous theoretical investigations are verified experimentally.
Superconducting digital RSFQ technology offers unique digital processing solutions for the telecommunication that allows more than three times increasing capacity of the 3G networks, makes telecommunication receivers reconfigurable and adjustable for different services, and significantly enhances security level of the data transfer over the fibers.Key features of RSFQ technology are high speed, low power and high integration density. In the current international semiconductor roadmap, RSFQ technology is listed as the least risky emerging digital technology. Over two years, the integration density of the RSFQ circuits has been increased more than twice reaching the limit of 12000 active elements per chip. The highest demonstrated clock frequency for large circuits is 60~GHz. The conventional benchmark of a static digital divider is on the limit of 360~GHz frequency. RSFQ design allows full use of commercial CAD tools and supports normal design flows with digital time/delay optimization and complete verification. RSFQ technology also gains a lot from Multi-Chip-Module (MCM) packaging. The lossless superconducting passive interconnects allow implementation of a high speed System-in-Chip (SiP). Record figures with up to 100~Gbit/s transmission for chip-to-chip communication have recently been demonstrated in the USA and Japan.The goal of the research presented in this thesis is to simulate, optimize and design of the superconducting passive interconnects for high integration density RSFQ circuits and superconducting MCM SiP. The novelty of the results is in accurate simulation of the impedance discontinuities that allowed to reduce coupling and return losses for bandwidth of 300~GHz below -20~dB limit and derivation of the general relation between passive interconnects design and fabrication process parameters.The thesis covers all required topics: models of the superconductors for electromagnetic frequency domain simulations, extraction of the equivalent circuits for time-domain simulations, optimization of the general passive structures for on-chip and inter-chip MCM high speed data links, design of the drivers and receivers for matching with active circuits, design of the high voltage driver for communication with room temperature electronics and high speed experimental verification.
Complex RSFQ circuits are typically dc-biased with one or more current bias trees, with current returning through a superconducting ground plane. As the bias currents become larger in more complex circuits, it is increasingly critical to pay attention to the distribution of these return currents, and the effects of the resulting magnetic fields on the performance of the RSFQ circuits. We have modeled the current and field distributions, and found that magnetic field and flux are indeed significant. This has been confirmed by direct measurement using a distribution of SQUIDs. Furthermore, we have measured the performance of several RSFQ circuits, and have found that currents in the ground plane can significantly affect performance margins. Approaches to circuit and system designs that can reduce these problems are discussed.
Rapid Single-Flux-Quantum (RSFQ) logic is a superconductor IC technology that, with only a modest number of researchers worldwide, has produced some of the world's highest performance digital and mixed-signal circuits. This achievement is due, in part, to a constellation of characteristics that manifest themselves at the circuit level – namely, high-speed digital logic at low-power, ideal interconnects, quantum accuracy, scalability, and simplicity of fabrication. A necessary key to translating these advantages to the system-level involves understanding the I/O, synchronization, and packaging issues associated with a cryogenic technology. The objective of this paper is to review the status of current RSFQ circuit-level infrastructure components and their potential impact on system-level applications.