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APL Materials

Epitaxial Al2O3 capacitors for low microwave loss superconducting quantum circuits

Kyung‐Hoon Cho, U. Patel, Jacob P. Podkaminer, Yvonne Y. Gao, C. M. Folkman, Chung Wung Bark, Sanghan Lee, Yang Zhang, Xiaoqing Q. Pan, R. McDermott, Chang‐Beom Eom

Published Oct 1, 2013• 15 citations
Publisher

Abstract

We have characterized the microwave loss of high-Q parallel plate capacitors fabricated from thin-film Al/Al2O3/Re heterostructures on (0001) Al2O3 substrates. The superconductor-insulator-superconductor trilayers were grown in situ in a hybrid deposition system: the epitaxial Re base and polycrystalline Al counterelectrode layers were grown by sputtering, while the epitaxial Al2O3 layer was grown by pulsed laser deposition. Structural analysis indicates a highly crystalline epitaxial Al2O3 layer and sharp interfaces. The measured intrinsic (low-power, low-temperature) quality factor of the resonators is as high as 3 × 104. These results indicate that low-loss grown Al2O3 is an attractive candidate dielectric for high-fidelity superconducting qubit circuits.

DOI
10.1063/1.4822436

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We have characterized the microwave loss of high-Q parallel plate capacitors fabricated from thin-film Al/Al2O3/Re heterostructures on (0001) Al2O3 substrates. The superconductor-insulator-superconductor trilayers were grown in situ in a hybrid deposition system: the epitaxial Re base and polycrystalline Al counterelectrode layers were grown by sputtering, while the epitaxial Al2O3 layer was grown by pulsed laser deposition. Structural analysis indicates a highly crystalline epitaxial Al2O3 layer and sharp interfaces. The measured intrinsic (low-power, low-temperature) quality factor of the resonators is as high as 3 × 104. These results indicate that low-loss grown Al2O3 is an attractive candidate dielectric for high-fidelity superconducting qubit circuits.
Superconducting qubits show great promise for the realization of fault-tolerant quantum computing, but lossy, amorphous dielectrics limit current technology. Identifying highly crystalline and stoichiometric dielectrics with intrinsically low microwave loss is therefore a central materials challenge, yet experimentally validated platforms remain scarce. This work integrates a crystalline dielectric into a heteroepitaxial TiN/γγγ-Al2_22​O3_33​/TiN trilayer grown via pulsed laser deposition. Correlative high-resolution imaging, diffraction, and spectroscopy measurements confirm the single-crystal quality and chemical integrity of all layers, with minimal defects and limited anion interdiffusion across the oxide-nitride interfaces. Using microwave lumped-element resonators with parallel-plate capacitors, this work establishes an experimentally-measured upper bound for the dielectric loss of γγγ-Al2_22​O3_33​, which has a low intrinsic two-level system loss of δTLS0=(2.8±0.1)×10−5δ_{\text{TLS}}^0 = (2.8 \pm 0.1) \times 10^{-5}δTLS0​=(2.8±0.1)×10−5. These results establish heteroepitaxial oxides on transition metal nitrides as an attractive materials platform for superconducting quantum circuits, particularly for integration into compact device architectures such as merged-element transmons and microwave kinetic inductance detectors.
Epitaxially grown superconductor/dielectric/superconductor trilayers have the potential to form high-performance superconducting quantum devices and may even allow scalable superconducting quantum computing with low-surface-area qubits such as the merged-element transmon. In this work, we measure the power-independent loss and two-level-state (TLS) loss of epitaxial, wafer-bonded, and substrate-removed Al/GaAs/Al trilayers by measuring lumped element superconducting microwave resonators at millikelvin temperatures and down to single-photon powers. The power-independent loss of the device is (4.8±0.1)×10−5, and the resonator-induced intrinsic TLS loss is (6.4±0.2)×10−5. Dielectric loss extraction is used to determine a lower bound of the intrinsic TLS loss of the trilayer of 7.2×10−5. The unusually high power-independent loss is attributed to GaAs’s intrinsic piezoelectricity.
Achieving high material perfection in aluminum (Al) films and their associated Al/AlOx heterostructures is essential for enhancing the coherence time in superconducting quantum circuits. We grew Al films with thicknesses ranging from 3 to 30 nanometers (nm) epitaxially on sapphire substrates using molecular beam epitaxy (MBE). An integral aspect of our work involved electron-beam (e-beam) evaporation to directly deposit aluminum oxide (Al2O3) films on the freshly grown ultrathin epitaxial Al films in an ultra-high-vacuum (UHV) environment. This in situ oxide deposition is critical for preventing the oxidation of parts of the Al films, avoiding the formation of undesired native oxides, and thereby preserving the nm-thick Al films in their pristine conditions. The thicknesses of our Al films in the study were accurately determined; for example, coherence lengths of 3.0 and 20.2 nm were measured in the nominal 3.0 and 20 nm thick Al films, respectively. These Al films were epitaxially grown on sapphire substrates, showing an orientational relationship, denoted as Al(111)⟨21¯1¯⟩∥sapphire(0001)[21¯1¯0]. The Al/sapphire interface was atomically ordered without any interfacial layers, as confirmed by in situ reflection high-energy electron diffraction (RHEED) and cross-sectional scanning transmission electron microscopy (STEM). All sample surfaces exhibited smoothness with a roughness in the range of 0.1–0.2 nm. The Al films are superconducting with critical temperatures ranging from 1.23 to around 2 K, depending on the film thickness.
Abstract Increasing the density of superconducting circuits requires compact components, however, superconductor-based capacitors typically perform worse as dimensions are reduced due to loss at surfaces and interfaces. Here, parallel plate capacitors composed of aluminum-contacted, crystalline silicon fins are shown to be a promising technology for use in superconducting circuits by evaluating the performance of lumped element resonators and transmon qubits. High aspect ratio Si-fin capacitors having widths below 300 nm with an approximate total height of 3 μm are fabricated using anisotropic wet etching of Si(110) substrates followed by aluminum metallization. The single-crystal Si capacitors are incorporated in lumped element resonators and transmons by shunting them with lithographically patterned aluminum inductors and conventional A l/A l O x /A l Josephson junctions respectively. Microwave characterization of these devices suggests state-of-the-art performance for superconducting parallel plate capacitors with low power internal quality factor of lumped element resonators greater than 500 k and qubit T 1 times greater than 25 μs. These results suggest that Si-Fins are a promising technology for applications that require low-loss, compact, superconductor-based capacitors with minimal stray capacitance.
Titanium nitride is an attractive material for a range of superconducting quantum-circuit applications owing to its low microwave losses, high surface inductance, and chemical stability. The physical properties and device performance, nevertheless, depend strongly on the quality of the materials. In this paper, we focus on the highly crystalline and epitaxial titanium nitride thin films deposited on sapphire substrates using magnetron sputtering at an intermediate temperature (${300}^{\ensuremath{\circ}}\mathrm{C}$). We performed a set of systematic and comprehensive material characterizations to thoroughly understand the structural, chemical, and transport properties. Microwave losses at low temperatures were studied using patterned microwave resonators, where the best internal quality factor in the single-photon regime is measured to be $3.3\ifmmode\times\else\texttimes\fi{}{10}^{6}$ and that in the high-power regime $>1.0\ifmmode\times\else\texttimes\fi{}{10}^{7}$. Adjusted with the material filling factor of the resonators, the microwave loss-tangent here compares well with the previously reported best values for superconducting resonators. This work lays the foundation of using epitaxial titanium nitride for low-loss superconducting quantum circuits.
Low-loss lumped-element capacitors for superconductive circuits were fabricated using sputter-deposited Nb electrodes. The dielectric layer was formed by partially anodizing the Nb base electrode. The deposition technique for the counterelectrode strongly affected the parasitic shunt conductance of the capacitors. It was found that this conductance could be reduced by depositing the Nb counterelectrode films by DC magnetron sputtering at a low rate and at a high Ar pressure. By optimizing these process parameters, capacitors with breakdown voltages greater than 85% of the anodic oxide formation voltage and loss tangents less than 0.003 at 10 MHz were fabricated. These capacitors were integrated with Nb thin-film inductors to produce L-C resonators with quality factors greater than 400.>