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arXiv:2604.09050

Tantalum-Encapsulated Niobium Superconducting Resonators: High Internal Quality Factor and Improved Temporal Stability via Surface Passivation

Anas Alkhazaleh, Juan Villegas, Florent Ravaux, Alexey Zharinov

quant-phcond-mat.mtrl-sciSubmitted Apr 10, 2026• Announced Apr 13, 2026• 0 citations
arXivHTMLPDF

Abstract

Superconducting coplanar waveguide resonators are essential components in quantum processors, where their internal quality factor (Qi) constrains qubit coherence and readout fidelity. In niobium devices, microwave losses at millikelvin temperatures are strongly influenced by two-level systems (TLS) associated with the complex NbOx surface oxide. To mitigate these losses, we investigate a surface-engineering approach in which Nb films are capped in situ with a thin tantalum layer to suppress Nb2O5 formation and replace the native NbOx interface with a Ta-based oxide. We fabricate Nb/Ta bilayer and reference Nb resonators on high-resistivity silicon using identical DC sputtering and wet etching conditions, and characterize their performance at millikelvin temperatures. Fresh Ta-encapsulated devices exhibit internal quality factors up to 2.4 x 10^6 in the near-single-photon regime, with power dependence consistent with reduced TLS-related loss at the metal-air interface. A control Nb device fabricated under the same process shows comparatively lower Q_TLS, consistent with the beneficial effect of the Ta capping layer. Furthermore, ageing tests performed on Nb/Ta resonators after six months reveal a moderate reduction in Q_TLS relative to their initial values, yet the performance remains superior to newly fabricated Nb-only devices. These results suggest that thin Ta encapsulation enhances interface quality and contributes to improved temporal stability while remaining compatible with Nb-based fabrication workflows.

Comments
11 pages, 14 figures

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Superconducting coplanar waveguide resonators are essential components in quantum processors, where their internal quality factor (Qi) constrains qubit coherence and readout fidelity. In niobium devices, microwave losses at millikelvin temperatures are strongly influenced by two-level systems (TLS) associated with the complex NbOx surface oxide. To mitigate these losses, we investigate a surface-engineering approach in which Nb films are capped in situ with a thin tantalum layer to suppress Nb2O5 formation and replace the native NbOx interface with a Ta-based oxide.
We fabricate Nb/Ta bilayer and reference Nb resonators on high-resistivity silicon using identical DC sputtering and wet etching conditions, and characterize their performance at millikelvin temperatures. Fresh Ta-encapsulated devices exhibit internal quality factors up to 2.4 x 10^6 in the near-single-photon regime, with power dependence consistent with reduced TLS-related loss at the metal-air interface. A control Nb device fabricated under the same process shows comparatively lower Q_TLS, consistent with the beneficial effect of the Ta capping layer. Furthermore, ageing tests performed on Nb/Ta resonators after six months reveal a moderate reduction in Q_TLS relative to their initial values, yet the performance remains superior to newly fabricated Nb-only devices. These results suggest that thin Ta encapsulation enhances interface quality and contributes to improved temporal stability while remaining compatible with Nb-based fabrication workflows.
Niobium and aluminum have been widely used to realize superconducting resonators and qubits. However, the native oxide at the metal air interface limits the devices results. This layer is highly disordered, and it induces losses limiting the performances of the resonators or qubits. Recently, tantalum led to great improvement in qubit relaxation time. This improvement has been attributed to a thinner and less disordered oxide layer compared to Nb and Al. This study is aimed to limit the formation of the oxide layer, by the introduction of novel superconducting materials such as rhenium or by encapsulating the Nb surface with other superconducting materials such as Ta, Al, Re or other non-superconducting materials such as Au. To better understand the results, we are realizing these studies on coplanar waveguide resonators where the relation between surface losses and quality factor is clear. We are also analyzing different fabrication techniques to completely characterize our devices, linking material properties to the performances. In this work we are also varying the participation ratio of the devices in order to extract with higher fidelity and precision the losses introduced by the involved interfaces.
Tantalum is a promising platform for superconducting quantum circuits, yet coherence times remain limited by dielectric losses from interfacial two-level systems (TLS), exacerbated by native oxide regrowth. Here, we implement molecular surface passivation using self-assembled organic monolayers on freshly etched tantalum and silicon in coplanar waveguide resonators. Surface characterization by contact angle, XPS, FTIR and TEM confirm the formation of ordered, nanometer-thick films that suppress oxide formation. Microwave measurements in the ~5-9 GHz range reveal internal quality factors up to 1.8x10^6 in the single-photon regime at 100 mK, representing a ~140% improvement over untreated devices with native oxide. Power and temperature dependent measurements attribute this enhancement to reduced TLS-induced losses. These results demonstrate that molecular passivation effectively engineers low-loss interfaces and provides a scalable route toward high-coherence superconducting quantum devices.
Tantalum (Ta) has recently received considerable attention in manufacturing robust superconducting quantum circuits. Ta offers low microwave loss, high kinetic inductance compared to aluminium (Al) and niobium (Nb), and good compatibility with complementary metal-oxide-semiconductor (CMOS) technology, which is essential for quantum computing applications. Here, we demonstrate the fabrication engineering of thickness-dependent high quality factor (high-Q_i) Ta superconducting microwave coplanar waveguide resonators. All films are deposited on high-resistivity silicon substrates at room temperature without additional substrate heating. Before Ta deposition, a niobium (Nb) seed layer is used to ensure a body-centred cubic lattice (α-Ta) formation. We further engineer the kinetic inductance (L_K) resonators by varying Ta film thicknesses. High L_K is a key advantage for applications because it facilitates the realisation of high-impedance, compact quantum circuits with enhanced coupling to qubits. The maximum internal quality factor Q_i of ~ 3.6 * 10^6 is achieved at the high power regime for 100 nm Ta, while the highest kinetic inductance is obtained to be 0.6 pH/sq for the thinnest film, which is 40 nm. This combination of high Q_i and high L_K highlights the potential of Ta microwave circuits for high-fidelity operations of compact quantum circuits.
We demonstrate a substantial reduction in two-level system loss in tantalum coplanar waveguide resonators fabricated on high-resistivity silicon substrates through the use of an ultrathin titanium sacrificial layer. A 0.2nm titanium film, deposited atop pre-sputtered α-tantalum, acts as a solid-state oxygen getter that chemically modifies the native Ta oxide at the metal-air interface. After device fabrication, the titanium layer is removed using buffered oxide etchant, leaving behind a chemically reduced Ta oxide surface. Subsequent high-vacuum annealing further suppresses two-level system loss. Resonators treated with this process exhibit internal quality factors Qi exceeding an average of 1.5 million in the single-photon regime across ten devices, over three times higher than otherwise identical devices lacking the titanium layer. These results highlight the critical role of interfacial oxide chemistry in superconducting loss and reinforce atomic-scale surface engineering as an effective approach to improving coherence in tantalum-based quantum circuits. The method is compatible with existing fabrication workflows applicable to tantalum films, offering a practical route to further extending T1 lifetimes in superconducting qubits.
Abstract One main limiting factor towards achieving high coherence times in superconducting circuits is two-level system (TLS) losses. Mitigating such losses requires controlling the formation of native oxides at the metal-air interface. Here, we report the growth of alkyl-phosphonate self-assembled monolayers (SAMs) on Nb thin films following oxide removal. The impact of passivation was evaluated via the performance of coplanar waveguide resonators at 10 mK, in terms of quality factor and resonant frequency, over six days of air exposure. Un-passivated resonators exhibited an ~80% increase in loss at single-photon power levels, whereas SAM-passivated resonators maintained excellent temporal stability, attributed to suppressed oxide regrowth. By employing a two-component TLS model, we discern distinct prominent loss channels for each resonator type and quantified the characteristic TLS loss of the SAMs to be ~5×10 -7 . We anticipate our passivation methodology to offer a promising route toward industrial-scale qubit fabrication, particularly where long-term device stability is critical.
Tantalum thin films sputtered on unheated silicon substrates are characterized with microwaves at around 10 GHz in a 10 mK environment. We show that the phase of tantalum with a body-centered cubic lattice (α-Ta) can be grown selectively by depositing a niobium buffer layer prior to a tantalum film. The physical properties of the films, such as superconducting transition temperature and crystallinity, change markedly with the addition of the buffer layer. Coplanar waveguide resonators based on the composite film exhibit significantly enhanced internal quality factors compared with a film without the buffer layer. The internal quality factor approaches 2 × 107 at a large-photon-number limit. While the quality factor decreases at the single-photon level owing to two-level system (TLS) loss, we have deduced that one of the causes of TLS loss is the amorphous silicon layer at the film–substrate interface, which originates from the substrate cleaning before the film deposition rather than the film itself. The temperature dependence of the internal quality factors shows a marked rise below 200 mK, suggesting the presence of TLS–TLS interactions. The present low-loss tantalum films can be deposited without substrate heating and thus have various potential applications in superconducting quantum electronics.