Tantalum (Ta) has recently received considerable attention in manufacturing robust superconducting quantum circuits. Ta offers low microwave loss, high kinetic inductance compared to aluminium (Al) and niobium (Nb), and good compatibility with complementary metal-oxide-semiconductor (CMOS) technology, which is essential for quantum computing applications. Here, we demonstrate the fabrication engineering of thickness-dependent high quality factor (high-Q_i) Ta superconducting microwave coplanar waveguide resonators. All films are deposited on high-resistivity silicon substrates at room temperature without additional substrate heating. Before Ta deposition, a niobium (Nb) seed layer is used to ensure a body-centred cubic lattice (α-Ta) formation. We further engineer the kinetic inductance (L_K) resonators by varying Ta film thicknesses. High L_K is a key advantage for applications because it facilitates the realisation of high-impedance, compact quantum circuits with enhanced coupling to qubits. The maximum internal quality factor Q_i of ~ 3.6 * 10^6 is achieved at the high power regime for 100 nm Ta, while the highest kinetic inductance is obtained to be 0.6 pH/sq for the thinnest film, which is 40 nm. This combination of high Q_i and high L_K highlights the potential of Ta microwave circuits for high-fidelity operations of compact quantum circuits.
Tantalum (Ta) has recently received considerable attention in manufacturing robust superconducting quantum circuits. Ta offers low microwave loss, high kinetic inductance compared to aluminium (Al) and niobium (Nb), and good compatibility with complementary metal-oxide-semiconductor (CMOS) technology, which is essential for quantum computing applications. Here, we demonstrate the fabrication engineering of thickness-dependent high quality factor (high-Q_i) Ta superconducting microwave coplanar waveguide resonators. All films are deposited on high-resistivity silicon substrates at room temperature without additional substrate heating. Before Ta deposition, a niobium (Nb) seed layer is used to ensure a body-centred cubic lattice (α-Ta) formation. We further engineer the kinetic inductance (L_K) resonators by varying Ta film thicknesses. High L_K is a key advantage for applications because it facilitates the realisation of high-impedance, compact quantum circuits with enhanced coupling to qubits. The maximum internal quality factor Q_i of ~ 3.6 * 10^6 is achieved at the high power regime for 100 nm Ta, while the highest kinetic inductance is obtained to be 0.6 pH/sq for the thinnest film, which is 40 nm. This combination of high Q_i and high L_K highlights the potential of Ta microwave circuits for high-fidelity operations of compact quantum circuits.
Abstract Tantalum (Ta) has recently received considerable attention in manufacturing robust superconducting quantum circuits. Ta offers low microwave loss, high kinetic inductance compared to aluminium (Al) and niobium (Nb), and good compatibility with complementary metal-oxide-semiconductor (CMOS) technology, which is essential for quantum computing applications. Here we demonstrate the fabrication engineering of thickness-dependent high-quality-factor (high- Qi ) Ta superconducting microwave coplanar waveguide resonators. All films are deposited on high-resistivity silicon substrates at room temperature without additional substrate heating. Before Ta deposition, a niobium (Nb) seed layer is used to promote a body-centred cubic lattice ( α -Ta) formation. We further engineer the kinetic inductance ( LK ) of the resonators by varying Ta film thicknesses. High LK is a key advantage for applications because it facilitates the realisation of high-impedance, compact quantum circuits with enhanced coupling to qubits. The maximum internal quality factor Qi of ∼ 3.6 × 10 6 in the high power regime and Qi of ∼ 4.5 × 10 5 in the single-photon regime is achieved for 100 nm Ta which represents an improvement over previous room-temperature deposited Ta resonators on silicon substrates in the single photon regime, while the highest kinetic inductance of 0.6 pH/sq is obtained for the thinnest film, which is 40 nm. This combination of high Qi and high LK highlights the potential of Ta microwave circuits for high-fidelity operation of compact quantum circuits.
Superconducting coplanar waveguide resonators are essential components in quantum processors, where their internal quality factor (Qi) constrains qubit coherence and readout fidelity. In niobium devices, microwave losses at millikelvin temperatures are strongly influenced by two-level systems (TLS) associated with the complex NbOx surface oxide. To mitigate these losses, we investigate a surface-engineering approach in which Nb films are capped in situ with a thin tantalum layer to suppress Nb2O5 formation and replace the native NbOx interface with a Ta-based oxide.
We fabricate Nb/Ta bilayer and reference Nb resonators on high-resistivity silicon using identical DC sputtering and wet etching conditions, and characterize their performance at millikelvin temperatures. Fresh Ta-encapsulated devices exhibit internal quality factors up to 2.4 x 10^6 in the near-single-photon regime, with power dependence consistent with reduced TLS-related loss at the metal-air interface. A control Nb device fabricated under the same process shows comparatively lower Q_TLS, consistent with the beneficial effect of the Ta capping layer. Furthermore, ageing tests performed on Nb/Ta resonators after six months reveal a moderate reduction in Q_TLS relative to their initial values, yet the performance remains superior to newly fabricated Nb-only devices. These results suggest that thin Ta encapsulation enhances interface quality and contributes to improved temporal stability while remaining compatible with Nb-based fabrication workflows.
The promise of tantalum for realizing superconducting quantum devices has generated interest in its compound films, particularly nitrides. Among these, cubic-phase tantalum carbonitride (TaCxN1−x) offers reduced susceptibility to oxidation and a high critical temperature, yet its microwave properties remain largely unexplored. Here, we investigate plasma-enhanced atomic layer deposition of cubic-phase TaCxN1−x thin films for superconducting microwave circuits. Structural and transport measurements reveal nanocrystalline morphology with sub-10 nm grains and superconductivity in the dirty limit. Coplanar waveguide resonators exhibit moderately high kinetic inductance (16.8 pH/sq for 30 nm films) with potential for enhancement through dimensional scaling. The films also support high internal quality factors exceeding 105 at 50 mK in the single-photon regime, comparable to granular aluminum. Loss analysis identifies the two-level systems as the dominant limiting mechanism, with potential for further reduction through interface engineering. These results establish atomic layer deposited TaCxN1−x as a promising material for scalable, low-loss, high-inductance superconducting circuits.
Tantalum thin films sputtered on unheated silicon substrates are characterized with microwaves at around 10 GHz in a 10 mK environment. We show that the phase of tantalum with a body-centered cubic lattice (α-Ta) can be grown selectively by depositing a niobium buffer layer prior to a tantalum film. The physical properties of the films, such as superconducting transition temperature and crystallinity, change markedly with the addition of the buffer layer. Coplanar waveguide resonators based on the composite film exhibit significantly enhanced internal quality factors compared with a film without the buffer layer. The internal quality factor approaches 2 × 107 at a large-photon-number limit. While the quality factor decreases at the single-photon level owing to two-level system (TLS) loss, we have deduced that one of the causes of TLS loss is the amorphous silicon layer at the film–substrate interface, which originates from the substrate cleaning before the film deposition rather than the film itself. The temperature dependence of the internal quality factors shows a marked rise below 200 mK, suggesting the presence of TLS–TLS interactions. The present low-loss tantalum films can be deposited without substrate heating and thus have various potential applications in superconducting quantum electronics.
Advancements in the fabrication of superconducting quantum devices have highlighted tantalum as a promising material, owing to its low surface oxidation microwave loss at low temperatures. However, tantalum films exhibit significantly larger kinetic inductances compared to materials such as aluminum or niobium. Given the inevitable variations in film thickness, this increased kinetic inductance leads to considerable, uncontrolled frequency variances and shifts in components like superconducting coplanar waveguide (SCPW) resonators. Achieving high precision in resonator frequencies is crucial, particularly when multiple resonators share a common Purcell filter with limited bandwidth in superconducting quantum information processors. Here, we tackle this challenge from both fabrication and design perspectives, achieving a reduction in resonator frequency fluctuation by a factor of more than 100. Concurrently, the internal quality factor of the SCPW resonator remains at high level. Our findings open up new avenues for the enhanced utilization of tantalum in large-scale superconducting chips.
Superconducting qubits based on tantalum (Ta) thin films have demonstrated the highest-performing microwave resonators and qubits. This makes Ta an attractive material for superconducting quantum computing applications, but, so far, direct deposition has largely relied on high substrate temperatures exceeding \SI{400}{\celsius} to achieve the body-centered cubic phase, BCC (\textalpha-Ta). This leads to compatibility issues for scalable fabrication leveraging standard semiconductor fabrication lines. Here, we show that changing the sputter gas from argon (Ar) to krypton (Kr) promotes BCC Ta synthesis on silicon (Si) at temperatures as low as \SI{200}{\celsius}, providing a wide process window compatible with back-end-of-the-line fabrication standards. Furthermore, we find these films to have substantially higher electronic conductivity, consistent with clean-limit superconductivity. We validated the microwave performance through coplanar waveguide resonator measurements, finding that films deposited at \SI{250}{\celsius} and \SI{350}{\celsius} exhibit a tight performance distribution at the state of the art. Higher temperature-grown films exhibit higher losses, in correlation with the degree of Ta/Si intermixing revealed by cross-sectional transmission electron microscopy. Finally, with these films, we demonstrate transmon qubits with a relatively compact, \SI{20}{\micro\meter} capacitor gap, achieving a median quality factor up to 14 million.