Microscopic inhomogeneity within superconducting films is a critical bottleneck hindering the performance and scalability of quantum circuits. All-nitride Josephson Junctions (JJs) have attracted substantial attention for their potential to provide enhanced coherence times and enable higher temperature operation. However, their performance is often limited by local variations caused by polymorphism, impurities, and interface quality. This work diagnoses atomic-scale limitations preventing superconducting NbN/AlN/NbN JJs from reaching their full potential. Electrical measurements reveal suppressed critical current density and soft onset of quasiparticle current. However, inverse proportionality between resistance and junction area confirms homogenous barrier thickness. This isolates structural and chemical variations in electrodes and barrier as the source of performance limitation. The observed characteristics are attributed to complex materials problems: NbN polymorphism, phase coexistence, and oxygen impurities. Using advanced microscopy and machine learning integrated approach, nanoscale inclusions of epsilon-Nb2N2 are found to coexist within dominant delta-NbN electrodes. DC performance of JJs may be affected by these defects, leading to unresolved supercurrent and soft transition to normal state. By identifying specific atomic scale defects, tracing its origin to initial film nucleation, and linking to its detrimental electrical signature, this work establishes a material-to-device correlation and provides targeted strategy for phase engineering towards reproducible, high coherence and scalable quantum devices.
Microscopic inhomogeneity within superconducting films is a critical bottleneck hindering the performance and scalability of quantum circuits. All-nitride Josephson Junctions (JJs) have attracted substantial attention for their potential to provide enhanced coherence times and enable higher temperature operation. However, their performance is often limited by local variations caused by polymorphism, impurities, and interface quality. This work diagnoses atomic-scale limitations preventing superconducting NbN/AlN/NbN JJs from reaching their full potential. Electrical measurements reveal suppressed critical current density and soft onset of quasiparticle current. However, inverse proportionality between resistance and junction area confirms homogenous barrier thickness. This isolates structural and chemical variations in electrodes and barrier as the source of performance limitation. The observed characteristics are attributed to complex materials problems: NbN polymorphism, phase coexistence, and oxygen impurities. Using advanced microscopy and machine learning integrated approach, nanoscale inclusions of epsilon-Nb2N2 are found to coexist within dominant delta-NbN electrodes. DC performance of JJs may be affected by these defects, leading to unresolved supercurrent and soft transition to normal state. By identifying specific atomic scale defects, tracing its origin to initial film nucleation, and linking to its detrimental electrical signature, this work establishes a material-to-device correlation and provides targeted strategy for phase engineering towards reproducible, high coherence and scalable quantum devices.
The development of large-scale quantum processors benefits from superconducting qubits that can operate at elevated temperatures and be fabricated with scalable, foundry-compatible processes. Atomic layer deposition (ALD) is increasingly being adopted as an industrial standard for thin-film growth, particularly in applications requiring precise control over layer thickness and composition. Here, we report superconducting qubits based on NbN/AlN/NbN trilayers deposited entirely by ALD. By varying the number of ALD cycles used to form the AlN barrier, we achieve Josephson tunneling through barriers of different thicknesses, with critical current density spanning seven orders of magnitude, demonstrating the uniformity and versatility of the process. Owing to the high critical temperature of NbN, transmon qubits based on these all-nitride trilayers exhibit microsecond-scale relaxation times, even at temperatures above 300 mK. These results establish ALD as a viable low-temperature deposition technique for superconducting quantum circuits and position all-nitride ALD qubits as a promising platform for operation at elevated temperatures.
Abstract In this work, we report the electrical properties of NbN internally shunted Josephson junctions with NbN x barriers. Cross-sectional scanning transmission electron microscopy analysis shows that all layers have the same cubic structure; NbN/NbN x /NbN trilayers were epitaxially grown on MgO substrates. The resistivity of the NbN x films could be varied in the range of 1–104 mΩ cm by controlling both the N2 partial pressure and the deposition time during reactive sputtering. The temperature dependence of the critical current density (J c) and characteristic voltage (I c R n) of the junctions with different barrier resistivities were measured for various barrier thicknesses. For the 10 nm-thick NbN x layer with resistivities of 73.44, 385.72, and 711 mΩ cm, the coherence length of the barrier was determined to be 5.55 ± 0.07, 4.88 ± 0.06, and 1.40 ± 0.13 nm, respectively, corresponding to carrier diffusion rates of 2.741 ± 0.004, 1.211 ± 0.002, and 0.008 ± 0.001 cm2 s−1, respectively. Thus, the reduction in barrier resistivity leads to a larger coherence length and a faster diffusion rate, which will further increase the J c and I c R n of the junction. By adjusting the barrier resistivity and thickness, the J c of the junction can be easily tuned over more than four orders of magnitude, and an I c R n value of 0.97 ± 0.07 mV was obtained at 10 K. The results indicate that the all-NbN self-shunt junction is a promising candidate in high-speed and high-temperature applications.
Epitaxial NbN/AlN/NbN Josephson junctions are promising alternatives to conventional Al/AlOx/Al junctions for superconducting qubits due to their crystalline tunnel barriers and the high transition temperature of NbN. However, their integration into quantum circuits typically requires complex fabrication processes involving amorphous interlayer dielectrics, which can degrade qubit coherence times. To address these issues, we developed sidewall spacer passivated epitaxial NbN/AlN/NbN junctions using a fabrication process that reduces both the volume of amorphous dielectric material and fabrication complexity. The fabricated junctions exhibited a large gap voltage of approximately 5.6 mV and low subgap leakage currents. By varying the thickness of the AlN tunnel barrier, high-quality junctions were fabricated over a wide range of critical current densities Jc, from 0.3 to 104 A/cm2. In addition, the comparison of the current-voltage characteristics before and after buffered hydrofluoric acid treatment indicated that the wet etching process did not degrade the electrical characteristics of the junctions. These results establish a scalable fabrication process for epitaxial Josephson junctions and provide a promising platform for high-coherence nitride-based superconducting qubits.
Fabrication And Characterization Of High-Quality Nb/Al-AlOx/Nb Cross-Type Josephson Tunnel Junctions Utilising CMP-based Planarisation Techniques
Josephson tunnel junctions (JJs) are the fundamental building blocks of today's most advanced superconducting electronic components, such as qubits and superconducting quantum interference devices (SQUIDs). Given the ongoing demand for scalability of these devices on the wafer-scale, it is crucial to control the fabrication process as precisely as possible to ensure uniform quality and reproducibility. Today, window-type JJs are often used in the production of DC SQUIDs and while they are reliable and reproducible, they suffer from alignment inaccuracies caused by photolithography and unavoidable parasitic capacitances, thus limiting the energy sensitivity of DC SQUIDs. These problems can be circumvented by producing JJs with cross-type geometry, which allows for smaller junction areas and eliminates parasitic capacitances. Here we discuss the fabrication of Nb/Al-AlOx/Nb-based cross-type JJs, where the trilayer is embedded in sputter-deposited SiO2 to allow for planarisation of the structures and to ensure the reliable insulation of the sidewalls of the bottom electrode. Instead of lift-off processes that require a lot of time and potentially leave unwanted wings along the edges of microstructures behind that might compromise subsequent layers, we use chemical-mechanical polishing (CMP) for the removal of excess SiO2. This is not only much faster, but produces smooth and uniform surfaces, which in turn effectively improves the reliability of our JJ production process resulting in a high yield of over 90% on wafer-scale. In addition, we discuss the influence of fabrication details on the quality and electrical properties of our JJs with different junction areas down to 1μm×1μm distributed across the wafer and extract the junction specific quality parameters from their IV-characteristics and their Fraunhofer patterns.
ABSTRACT Epitaxial all‐nitride Josephson junctions are promising components for high coherence superconducting qubits, yet nanoscale defects often limit their performance. The key to mitigating these defects lies in understanding the atomic‐scale relationship between polymorph selection, defect chemistry, and device performance. Here, we investigate structural and chemical defects in epitaxially grown 𝛿‐NbN/AlN/𝛿‐NbN, 𝛾‐Nb 4 N 3 /AlN/𝛾‐Nb 4 N 3 , β‐Nb 2 N/AlN/β‐Nb 2 N heterostructures on c‐plane sapphire using molecular beam epitaxy. Advanced microscopy integrated with density functional theory shows varying impurity distribution across different polymorphs. The chemical distribution reveals that δ‐NbN electrodes contain significant oxygen, whereas in β‐Nb 2 N/AlN/β‐Nb 2 N heterostructures oxygen preferentially segregates to the AlN barrier. DFT calculations indicate that these differences arise from phase‐dependent oxygen energetics and diffusion kinetics, with oxygen remaining kinetically trapped in δ‐NbN while exhibiting greater mobility in β‐Nb 2 N. These structural and chemical differences are consistent with the distinct transport behavior observed in the two junction architectures and provide mechanistic insight into the role of defect chemistry in epitaxial nitride Josephson junctions. The observed impurity distribution may influence superconducting properties and contribute to the formation of two‐level systems, a major source of loss and decoherence in superconducting quantum circuits.
Materials defects in Josephson junctions (JJs), often referred to as two-level systems (TLS), couple to superconducting qubits and are a critical bottleneck for scalable quantum processors. Despite their importance, understanding the microscopic sources of TLS and how to mitigate them has remained a major challenge. Here, we demonstrate a high-throughput, correlated approach to trace the microstructural origins of strongly-coupled TLS in Josephson circuits. We assembled a massive dataset of TLS across 6,000 Al/AlOx/Al JJs and more than 600 atomic resolution transmission electron microscopy images. We statistically link fabrication, microstructure, and TLS occurrence, revealing a strong correlation between Al electrode thickness, Al grain size, and TLS density. Correspondingly, we find a two-thirds reduction in TLS prompted by a change in electrode fabrication parameters. These results demonstrate a robust, data-driven methodology to understand and control defects in quantum circuits and pave the way for significantly reducing TLS density.