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arXiv:2610.04820

Sidewall spacer passivated epitaxial NbN/AlN/NbN Josephson junctions for superconducting qubit applications

Koki Honda, Daiki Kurihara, Hiroki Kutsuma, Hirotaka Terai, Taro Yamashita

quant-phcond-mat.supr-conSubmitted Oct 4, 2026• Announced Oct 6, 2026• 0 citations
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Abstract

Epitaxial NbN/AlN/NbN Josephson junctions are promising alternatives to conventional Al/AlO$_x$/Al junctions for superconducting qubits due to their crystalline tunnel barriers and the high transition temperature of NbN. However, their integration into quantum circuits typically requires complex fabrication processes involving amorphous interlayer dielectrics, which can degrade qubit coherence times. To address these issues, we developed sidewall spacer passivated epitaxial NbN/AlN/NbN junctions using a fabrication process that reduces both the volume of amorphous dielectric material and fabrication complexity. The fabricated junctions exhibited a large gap voltage of approximately 5.6 mV and low subgap leakage currents. By varying the thickness of the AlN tunnel barrier, high-quality junctions were fabricated over a wide range of critical current densities ${\it J}_c$, from 0.3 to 10$^4$ A/cm$^2$. In addition, the comparison of the current-voltage characteristics before and after buffered hydrofluoric acid treatment indicated that the wet etching process did not degrade the electrical characteristics of the junctions. These results establish a scalable fabrication process for epitaxial Josephson junctions and provide a promising platform for high-coherence nitride-based superconducting qubits.

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9 pages, 4 figures

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Epitaxial NbN/AlN/NbN Josephson junctions are promising alternatives to conventional Al/AlOx_xx​/Al junctions for superconducting qubits due to their crystalline tunnel barriers and the high transition temperature of NbN. However, their integration into quantum circuits typically requires complex fabrication processes involving amorphous interlayer dielectrics, which can degrade qubit coherence times. To address these issues, we developed sidewall spacer passivated epitaxial NbN/AlN/NbN junctions using a fabrication process that reduces both the volume of amorphous dielectric material and fabrication complexity. The fabricated junctions exhibited a large gap voltage of approximately 5.6 mV and low subgap leakage currents. By varying the thickness of the AlN tunnel barrier, high-quality junctions were fabricated over a wide range of critical current densities Jc{\it J}_cJc​, from 0.3 to 104^44 A/cm2^22. In addition, the comparison of the current-voltage characteristics before and after buffered hydrofluoric acid treatment indicated that the wet etching process did not degrade the electrical characteristics of the junctions. These results establish a scalable fabrication process for epitaxial Josephson junctions and provide a promising platform for high-coherence nitride-based superconducting qubits.
Superconducting qubit circuits require high quality low critical current density Josephson tunnel junctions. We have developed high quality epitaxial NbN/AlN/NbN tunnel junctions with critical current density, Jc, ranging from as low as a few A/cm2to a few tens of kA/cm2. In this work, we measured current-voltage characteristics for junctions with a Jc~ 32 A/cm2in the temperature range from 17 mK to above 6.7 K. All the junctions are in good quality and have a high gap voltage (>; 5.5 mV). We found that the junctions' sub-gap resistances were temperature dependent above 2.5 K and saturated at temperatures below 2.5 K. A junction sub-gap leakage current Irof about 23 pA was measured. The voltage noise power spectral density for 3 junctions with different sizes has been measured at the base temperature of 17 mK with the junctions biased above the gap voltage. The spectral densities clearly show 1/fbehavior at low frequency and are proportional to the junction's linear dimension.
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We describe the fabrication processes and electrical characteristics of two types of NbN junctions. One is a self-shunted NbN/NbNx/AlN/NbN Josephson junction, which is expected to improve the density of integrated circuits; the other is an underdamped NbN/AlNx/NbN tunnel junction with radical-nitride AlNx barriers, which has highly controllable junction characteristics. In the former, the junction characteristics were changed from underdamped to overdamped by varying the thickness of the NbNx layer. Overdamped junctions with a 6-nm-thick NbNx film exhibited a characteristic voltage of Vc =0.8mV and a critical current density of Jc =22A/cm2 at 4.2K. In the junctions with radical-nitride AlNx barriers, Jc could be controlled in the range 0.01-3kA/cm2 by varying the process conditions, and good uniformity of the junction characteristics was obtained.
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We have developed resistively shunted NbN junctions to realize superconducting single flux quantum circuits operating at 10 K and/or high speed. The junctions consist of epitaxial NbN/AlN/NbN tunnel junctions and molybdenum (Mo) resistors fabricated on single-crystal MgO substrates. The junction qualities are systematically investigated in a wide range of critical current density (Jc). The gap voltage and the ratio of Rsg/RN were about 5.6 mV and 11 for the junctions with the Jc of 10 kA/cm2, respectively. The overdamped Josephson junctions with parallel Mo resistors having a nominal sheet resistance showed non-hysteretic current-voltage characteristics for the junctions with Jc of 10 kA/cm2.
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