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arXiv:2507.18672

Analysis of RF Surface Loss in a Planar 2D Qubit

Andrei Lunin, Mustafa Bal, Akshay A. Murthy, Shaojiang Zhu, Anna Grassellino, Alexander Romanenko

Published Jul 24, 2025• 0 citations
arXivHTMLPDF

Abstract

The Josephson junction and shunt capacitor form a transmon qubit, which is the cornerstone of modern quantum computing platforms. For reliable quantum computing, it is important how long a qubit can remain in a superposition of quantum states, which is determined by the coherence time (T1). The coherence time of a qubit effectively sets the "lifetime" of usable quantum information, determining how long quantum computations can be performed before errors occur and information is lost. There are several sources of decoherence in transmon qubits, but the predominant one is generally considered to be dielectric losses in the natural oxide layer formed on the surface of the superconductor. In this paper, we present a numerical study of microwave surface losses in planar superconducting antennas of different transmon qubit designs. An asymptotic method for estimating the energy participation ratio in ultrathin films of nanometer scales is proposed, and estimates are given for the limits of achievable minimum RF losses depending on the electrical properties of the surface oxide and the interface of the qubit with the substrate material.

DOI
10.48550/arxiv.2507.18672

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The Josephson junction and shunt capacitor form a transmon qubit, which is the cornerstone of modern quantum computing platforms. For reliable quantum computing, it is important how long a qubit can remain in a superposition of quantum states, which is determined by the coherence time (T1). The coherence time of a qubit effectively sets the "lifetime" of usable quantum information, determining how long quantum computations can be performed before errors occur and information is lost. There are several sources of decoherence in transmon qubits, but the predominant one is generally considered to be dielectric losses in the natural oxide layer formed on the surface of the superconductor. In this paper, we present a numerical study of microwave surface losses in planar superconducting antennas of different transmon qubit designs. An asymptotic method for estimating the energy participation ratio in ultrathin films of nanometer scales is proposed, and estimates are given for the limits of achievable minimum RF losses depending on the electrical properties of the surface oxide and the interface of the qubit with the substrate material.
Superconducting qubits are sensitive to a variety of loss mechanisms, which include dielectric loss from interfaces. The calculation of participation near the key interfaces of planar designs can be accomplished through an analytical description of the electric field density based on conformal mapping. In this way, a 2-D approximation to coplanar waveguide and capacitor designs produces values of the participation as a function of depth from the top metallization layer as well as the volume participation within a given thickness from this surface by reducing the problem to a surface integration over the region of interest. These quantities are compared to finite-element method numerical solutions, which validate the values at large distances from the coplanar metallization but diverge near the edges of the metallization features due to the singular nature of the electric fields. A simple approximation to the electric field energy at shallow depths (relative to the waveguide width) is also presented that closely replicates the numerical results based on conformal mapping and those reported in prior literature. These techniques are applied to the calculation of surface participation within a transmon qubit design, where the effects due to shunting capacitors can be easily integrated with those associated with metallization comprising the local environment of the qubit junction.
Dielectric loss is one of the major decoherence sources of superconducting qubits. Contemporary high-coherence superconducting qubits are formed by material systems mostly consisting of superconducting films on substrate with low dielectric loss, where the loss mainly originates from the surfaces and interfaces. Among the multiple candidates for material systems, a combination of titanium nitride (TiN\mathrm{Ti}\mathrm{N}TiN) film and sapphire substrate has good potential because of its chemical stability against oxidization and its high quality at interfaces. In this work, we report a TiN\mathrm{Ti}\mathrm{N}TiN film deposited onto sapphire substrate achieving low dielectric loss at the material interface. Through the systematic characterizations of a series of transmon qubits fabricated with identical batches of TiN\mathrm{Ti}\mathrm{N}TiN base layers but different geometries of qubit shunting capacitors with various participation ratios of the material interface, we quantitatively extract the loss-tangent value at the substrate-metal interface, which is smaller than $8.9\ifmmode\times\else\texttimes\fi{}{10}^{\ensuremath{-}4}$ in a 1-nm disordered layer, and a limiting quality factor of about 7.3 million. By optimizing the interface participation ratio of the two-dimensional (2D) transmon qubit, we reproducibly achieve a quality factor of 5.7 million on average. The best 2D qubits show lifetimes of up to $300\phantom{\rule{0.2em}{0ex}}\ensuremath{\mu}\mathrm{s}$ and quality factors achieving 8.1 million. We demonstrate that TiN\mathrm{Ti}\mathrm{N}TiN film on sapphire substrate is an ideal material system for high-coherence superconducting qubits. Our analyses further suggest that the interface dielectric loss around the Josephson-junction part of the circuit could be the dominant limitation of lifetimes for state-of-the-art transmon qubits.
We study the energy relaxation times (T1) of superconducting transmon qubits in 3D cavities as a function of dielectric participation ratios of material surfaces. This surface participation ratio, representing the fraction of electric field energy stored in a dissipative surface layer, is computed by a two-step finite-element simulation and experimentally varied by qubit geometry. With a clean electromagnetic environment and suppressed non-equilibrium quasiparticle density, we find an approximately proportional relation between the transmon relaxation rates and surface participation ratios. These results suggest dielectric dissipation arising from material interfaces is the major limiting factor for the T1 of transmons in 3D circuit quantum electrodynamics architecture. Our analysis also supports the notion of spatial discreteness of surface dielectric dissipation.
The recent realization of millisecond-scale coherence with tantalum-on-silicon transmon qubits showed that depositing the Al/AlOx/Al Josephson junction in a high purity, ultrahigh vacuum environment was critical for achieving lifetime-limited coherence, motivating careful examination of the aluminum surface two-level system (TLS) bath. Here, we measure the microwave absorption arising from surface TLSs in superconducting aluminum resonators, following methodology developed for tantalum resonators. We vary film and surface properties and correlate microwave measurements with materials characterization. We find that the lifetimes of superconducting aluminum resonators are primarily limited by surface losses associated with TLSs in the 2.7 nm-thick native AlOx. Treatment with 49% HF removes surface AlOx completely; however, rapid oxide regrowth limits improvements in surface loss and long term device stability. Using these measurements we estimate that TLSs in aluminum interfaces contribute around 27% of the relaxation rate of state-of-the-art tantalum-on-silicon qubits that incorporate aluminum-based Josephson junctions.
Abstract Surface dielectric loss from superconducting transmon qubits is believed to be one of the dominant sources of decoherence. Reducing surface dielectric loss is crucial for achieving a high quality factor and a long relaxation time (T 1), which can be engineered by carefully changing the geometry of a transmon. In this paper, we present a shape-optimization approach to reduce surface dielectric loss in a transmon qubit. The capacitor pads and junction wires of transmons are shaped as spline curves and optimized through the finite-element method and a global optimization algorithm. We find that the participation ratio of capacitor pads and junction wires can be reduced by 15 % − 18 % and 22 % − 26 % compared to previous designs, while the overall footprint and anharmonicity are maintained at acceptable values. As a result, the two-level system-limited quality factor and the corresponding T 1 were increased by 21.6%.
State-of-the-art transmon qubits rely on large capacitors, which systematically improve their coherence due to reduced surface-loss participation. However, this approach increases both the footprint and the parasitic cross-coupling and is ultimately limited by radiation losses---a potential roadblock for scaling up quantum processors to millions of qubits. In this work we present transmon qubits with sizes as low as $36\phantom{\rule{0.2em}{0ex}}\ifmmode\times\else\texttimes\fi{}\phantom{\rule{0.2em}{0ex}}39\phantom{\rule{0.2em}{0ex}}\text{\ensuremath{\mu}}{\mathrm{m}}^{2}$ with $\ensuremath{\gtrsim}100$-nm-wide vacuum-gap capacitors that are micromachined from commercial silicon-on-insulator wafers and shadow evaporated with aluminum. We achieve a vacuum participation ratio up to 99.6% in an in-plane design that is compatible with standard coplanar circuits. Qubit relaxation-time measurements for small gaps with high zero-point electric field variance of up to 22 V/m reveal a double exponential decay indicating comparably strong qubit interaction with long-lived two-level systems. The exceptionally high selectivity of up to 20 dB to the superconductor-vacuum interface allows us to precisely back out the sub-single-photon dielectric loss tangent of aluminum oxide previously exposed to ambient conditions. In terms of future scaling potential, we achieve a ratio of qubit quality factor to a footprint area equal to $20\phantom{\rule{0.2em}{0ex}}\text{\ensuremath{\mu}}{\mathrm{m}}^{\ensuremath{-}2}$, which is comparable with the highest T1{T}_{1}T1​ devices relying on larger geometries, a value that could improve substantially for lower surface-loss superconductors.