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arXiv:1709.10015 · Applied Physics Letters

Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators

Greg Calusine, Alexander J. Melville, Wayne H. Woods, Rabindra Nath Das, Corey Stull, Vladimir Bolkhovsky, Danielle Braje, David J. Hover, David K. Kim, Xhovalin Miloshi, Danna Rosenberg, Arjan Sevi, Jonilyn Yoder, Eric A. Dauler, William D. Oliver

Published Feb 5, 2018• 168 citations
arXivHTMLPDF

Abstract

Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quality factors and coherence times. Here, we demonstrate titanium nitride coplanar waveguide resonators with mean quality factors exceeding two million and controlled trenching reaching 2.2 μm in the silicon substrate. Additionally, we measure sets of resonators with a range of sizes and trench depths and compare these results with finite-element simulations to demonstrate quantitative agreement with a model of interface dielectric loss. We then apply this analysis to determine the extent to which trenching can improve resonator performance.

DOI
10.1063/1.5006888

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Improving the performance of superconducting qubits and resonators generally results from a combination of materials and fabrication process improvements and design modifications that reduce device sensitivity to residual losses. One instance of this approach is to use trenching into the device substrate in combination with superconductors and dielectrics with low intrinsic losses to improve quality factors and coherence times. Here, we demonstrate titanium nitride coplanar waveguide resonators with mean quality factors exceeding two million and controlled trenching reaching 2.2 μm in the silicon substrate. Additionally, we measure sets of resonators with a range of sizes and trench depths and compare these results with finite-element simulations to demonstrate quantitative agreement with a model of interface dielectric loss. We then apply this analysis to determine the extent to which trenching can improve resonator performance.
Reducing the contribution of all sources of microwave loss is important for increasing coherence times in superconducting qubits. In this paper we investigate reducing the loss by systematically removing Si substrate material from the gap region in titanium nitride coplanar waveguides fabricated on intrinsic Si substrates. By exploiting the radial dependence of the etch rate in a parallel plate reactive ion etcher, otherwise identical coplanar waveguides with only the Si gaps etched to varying depth, i.e., trenched, were created in a single TiN film within a single processing step. Measurements at these multiple depths permit the study of the loss reduction in isolation to the unintentional effects caused by any single processing step. When comparing the loss from all trench depths we found that the high power loss was similar, but in the single photon limit the loss was reduced by a factor of two for deeper trenches in agreement with predictions from finite element analysis.
Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to the resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal–air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric etch and find that it reduced losses from the substrate–air interface, thereby improving the quality factor.
© 2020 Author(s). Lossy dielectrics are a significant source of decoherence in superconducting quantum circuits. In this report, we model and compare the dielectric loss in bulk and interfacial dielectrics in titanium nitride (TiN) and aluminum (Al) superconducting coplanar waveguide resonators. We fabricate isotropically trenched resonators to produce a series of device geometries that accentuate a specific dielectric region's contribution to the resonator quality factor. While each dielectric region contributes significantly to loss in TiN devices, the metal-air interface dominates the loss in the Al devices. Furthermore, we evaluate the quality factor of each TiN resonator geometry with and without a post-process hydrofluoric etch and find that it reduced losses from the substrate-air interface, thereby improving the quality factor.
Superconducting quantum computing systems, including coplanar waveguide (CPW) resonators and qubits, are highly susceptible to energy dissipation from two-level systems (TLS) within bulk and interfacial dielectrics. CPW resonators serve as an ideal platform for characterizing these material losses at the single-photon excitation level. Building on recent experimental evidence that interface engineering can mitigate TLS losses, this study employs simulations to evaluate resonator quality factors across various interface modifications. Our results demonstrate that reducing losses at the substrate–air (SA) interface can increase the internal quality factor Qi by up to three orders of magnitude. While etching the SA interface also enhances Qi, material loss remains the dominant dissipation mechanism. Furthermore, we find that other lossy interfaces have a significantly smaller impact on the quality factor compared to the SA interface. These simulation results align with established experimental findings, providing a robust framework for refining resonator design. This work offers precise guidelines for TLS mitigation, essential for enhancing coherence times and developing more reliable superconducting quantum processors.
Superconducting coplanar-waveguide (CPW) resonators are one of the key devices in circuit quantum electrodynamics (cQED). Their performance can be limited by dielectric losses in the substrate and in the material interfaces. Reliable modeling is required to aid in the design of low-loss CPW structures for cQED. We analyze the geometric dependence of the dielectric losses in CPW structures using finite-element modeling of the participation ratios of the lossy regions. In a practical scenario, uncertainties in the the dielectric constants and loss tangents of these regions introduce uncertainties in the theoretically predicted participation ratios. We present a method for combining loss simulations with measurements of two-level-system-limited quality factors and resonance frequencies of CPW resonators. Namely, we solve an inverse problem to find model parameters producing the measured values. High quality factors are obtainable by properly designing the cross-sectional geometries of the CPW structures, but more accurate modeling and design methods for low-loss CPW resonators are called for major future improvements. Our nonlinear optimization methodology for solving the aforementioned inverse problem is a step in this direction.
Abstract The performance of state-of-the-art superconducting quantum devices is currently limited by microwave dielectric loss at different interfaces. α -tantalum is a superconductor that has proven effective in reducing dielectric loss and improving device performance due to its thin low-loss oxide. Here, we demonstrate the fabrication of high-quality factor α -tantalum coplanar-waveguide resonators directly on pristine 300 mm silicon wafers over a variety of metal deposition conditions and perform a comprehensive material and electrical characterization study. Additionally, we apply a surface treatment based on hydrofluoric acid that allows us to modify different resonators surfaces, leading to a reduction in two-level system loss in the devices by a factor of three. This loss reduction can be entirely attributed to the removal of surface oxides. Our study indicates that large scale manufacturing of low-loss superconducting circuits should indeed be feasible and suggests a viable avenue to materials-driven advancements in superconducting circuit performance.