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International Conference on Solid State Devices and Materials (SSDM)

Disentangling and Mitigating Packaging-Induced Loss in a Large-Scale Superconducting Quantum Processor

Rui Wang, Yu Zhou, Shinya Sasaki, Toru Abe, Shu Watanabe, Tsuyoshi Takahashi, Shuhei Tamate, Yasunobu Nakamura, Norinao Kouma, Shintaro Sato

Published Sep 15, 2026• 0 citations
Publisher
DOI
10.7567/ssdm.2026.c-2-02

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