Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Log inSign up
Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Blog
Job Board
Q3AS

© 2026 Aqora Quantum S.A.S.

TermsPrivacyLegal Notice

IEEE Transactions on Applied Superconductivity

Characterization of Superconducting Josephson Junctions on Electro-Optic LiNbO 3 Substrates at mK Temperatures

Saba Kousar, Roberta Satariano, G. Ausanio, Antonio Vettoliere, C. Granata, M. Cirillo, L. Parlato, Giovanni Piero Pepe

Published Feb 23, 2026• 0 citations
Publisher

Abstract

We report on the fabrication and millikelvin char acterization of Nb/Al–AlOx/Nb Josephson junctions directly de posited on X-cut LiNbO3 substrates. Motivated by the strong electro-optic and piezoelectric properties of LiNbO3, such devices are of interest for future hybrid superconducting–electro-optic architectures. The junctions were fabricated using standard processes involving DC magnetron sputtering followed by controlled thermal oxidation of the aluminum layer to form an AlOx tunnel barrier with reproducible junction areas. Insulation of the junctions was achieved by anodization and SiOx deposition. Electrical measurements performed at 30 mK reveal high-quality Josephson tunnel junction behavior with a critical current density ofJc= 70 A/cm2and a characteristic voltage reaching values up toVm= 286 mV. Differential conductance measurements exhibit pronounced quasiparticle peaks corresponding to a sum gap energy of 2Δ = (2.73 ± 0.05) meV, confirming the good quality of the Nb electrodes. Magnetic-field-dependent measure ments yield a Josephson penetration depth of λJ= 45 μm, confirming operation in the small-junction regime, with deviations from the ideal Josephson interference pattern attributed to non-uniform current distribution across the junction area. Compared to our previous characterization at 4.2 K, this work demonstrates reliable Josephson junction operation on LiNbO3 at dilution-refrigerator temperatures relevant for quantum circuits, supporting the suitability of lithium niobate as a promising substrate for future hybrid superconducting–electro-optic device implementations.

DOI
10.1109/tasc.2026.3665482

Related papers

High-quality superconducting Josephson junctions on LiNbO3 electro-optical crystals

L. Parlato, Gianpiero Pepe, Rossella Latempa +5 more

The attainment of high-quality Josephson junctions on electro-optical substrates constitutes a key step toward the fabrication of functional superconducting opto-electronics. We report on the fabrication of high-quality all-refractory niobium superconducting tunnel junctions deposited on X-cut LiNbO3 single crystals. A high quality factor Vm=0.7ΔIgR2mV (where ΔIg is the current jump at the sum gap voltage and R2mV the static resistance at V=2mV) up to 61 mV has been measured at T=4.2K. The very low contribution of subgap leakage currents is demonstrated by the BCS-like quasiparticle current measured at V=0.1mV down to T=1.9K.

Applied Physics Letters•May 9, 2005•3 citations

Nb/AlOx/Nb Josephson Tunnel Junctions Using Electron Beam Evaporation

Atsuki Inoue, Akiyoshi Nakayama, Yoichi Okabe

Niobium/aluminum-oxide/niobium Josephson tunnel junctions have been fabricated using electron beam evaporation to form all-metal films in a high vacuum system. A quality factor, V m (the product of the maximum dc Josephson current and the subgap resistance defined at 2 mV) between 36–37 mV, has been obtained for the best junctions of a 6 nm-thick Al layer by cooling down the surface of the base electrode for 100 minutes under a high background pressure, before the deposition of aluminum, after the formation of the base niobium electrode. An array of 80 series-connected junctions has also been fabricated using the selective niobium anodization process and the planarization process. The current-voltage characteristics of the array showed a standard deviation of the maximum dc Josephson current of 3.3%.

Japanese Journal of Applied Physics•Jul 1, 1988•11 citations

Fabrication And Characterization Of High-Quality Nb/Al-AlO$_x$/Nb Cross-Type Josephson Tunnel Junctions Utilising CMP-based Planarisation Techniques

Alexander Stoll, Andreas Reifenberger, Daniel Hengstler +2 more

Josephson tunnel junctions (JJs) are the fundamental building blocks of today's most advanced superconducting electronic components, such as qubits and superconducting quantum interference devices (SQUIDs). Given the ongoing demand for scalability of these devices on the wafer-scale, it is crucial to control the fabrication process as precisely as possible to ensure uniform quality and reproducibility. Today, window-type JJs are often used in the production of DC SQUIDs and while they are reliable and reproducible, they suffer from alignment inaccuracies caused by photolithography and unavoidable parasitic capacitances, thus limiting the energy sensitivity of DC SQUIDs. These problems can be circumvented by producing JJs with cross-type geometry, which allows for smaller junction areas and eliminates parasitic capacitances. Here we discuss the fabrication of Nb/Al-AlOx/Nb-based cross-type JJs, where the trilayer is embedded in sputter-deposited SiO$_2$ to allow for planarisation of the structures and to ensure the reliable insulation of the sidewalls of the bottom electrode. Instead of lift-off processes that require a lot of time and potentially leave unwanted wings along the edges of microstructures behind that might compromise subsequent layers, we use chemical-mechanical polishing (CMP) for the removal of excess SiO$_2$. This is not only much faster, but produces smooth and uniform surfaces, which in turn effectively improves the reliability of our JJ production process resulting in a high yield of over $90\,\%$ on wafer-scale. In addition, we discuss the influence of fabrication details on the quality and electrical properties of our JJs with different junction areas down to $1\,\mathrm{μm} \times 1\,\mathrm{μm}$ distributed across the wafer and extract the junction specific quality parameters from their IV-characteristics and their Fraunhofer patterns.

arXiv:2609.08569•Aug 26, 2026•0 citations

Nb/a-Si/Nb Josephson junctions for high-density superconducting circuits

David I. Olaya, John Biesecker, Manuel A. Castellanos-Beltran +4 more

We present electrical characterization data of sputtered Nb/a-Si/Nb Josephson junctions (JJs) for high-speed and high-density superconducting circuits. Junctions were studied with critical current densities (Jc) ranging from 0.01 to 3 mA/μm2 at 4 K. For junctions deposited at room temperature and processed to a maximum temperature of 150 °C, the dependence of Jc on barrier thickness d is exponential, Jc∝exp (−d/d0), with d0 constant over the entire range of Jc values studied. Junctions were annealed at temperatures up to 300 °C to study changes in their electrical properties and possible compatibility with high temperature fabrication processes. Current–voltage characteristics, critical current uniformity, critical current modulation with in-plane magnetic field, and sub-gap resistance behavior of these junctions were measured at 4 K and demonstrate that the junction properties do not degrade with annealing. These data indicate that Nb/a-Si/Nb JJs are a potential candidate for higher speed and higher density superconducting circuits.

Applied Physics Letters•May 1, 2023•16 citations

Fabrication of NbTiN/Al–AlNX/NbTiN Josephson Junctions for Superconducting Circuits Operating Around 10 K

Hiroyuki Akaike, Shunya Sakamoto, Kentaro Munemoto +1 more

We have fabricated NbTiN/Al-AlNX/NbTiN Josephson tunnel junctions on thermally oxidized Si substrates for their applications to single-flux-quantum circuits operating around 10 K. NbTiN films with a critical temperature Tcof 14.2 K and a root-mean-square value of their surface roughness of 0.45 nm were used as junction electrodes. For a junction barrier, radical-nitrided AlNXwas used to realize high uniformity in the critical current Icof the junctions. We obtained NbTiN junctions with a gap voltage Vg of 4.3 mV and an IcRn. product of 2.6 mV at 4.2 K, where R. is the junction resistance. The critical current density Jc, at 4.2 K was obtained in the range between 0.2 and 6.2 kA/cm2by changing a nitridation time for the AlNXbarrier formation. A series array of 200 junctions with an area of 10 μm × 10 μm exhibited a small I', spread, and the standard deviation 1-σ in Icuniformity was less than 1.6% in the temperature range between 4 K and 10 K.

IEEE Transactions on Applied Superconductivity•May 10, 2016•8 citations

Development of Nb/Al–AlOx/Nb Tunnel Junction for Large-Scale Integrated Digital Circuits

Wei Xiong, Liliang Ying, Yu Wu +3 more

We present the latest development of an Nb/Al-AlOx/Nb Josephson junction fabrication process for superconducting integrated circuits at SIMIT. Our fabrication process has four niobium superconducting layers and one Ti/Pd resistor layer with 1.0 Ω/square sheet resistor for junction shunting and circuit biasing. Critical current density Jcof the junctions is controlled from 30 A/cm2to 10 kA/cm2by exposing aluminum layer to pure or mixed O2atmosphere. Correlation between measured Jcand exposure conditions has been established. Average quality factor (Rsg/Rn) of the junctions in our process is larger than 20 with subgap leakage factor (Vm) beyond 30 mV. Critical current uniformity is obtained according to the switching current (Is) distribution of a 1000-JJ array. Measured standard deviation sigma of Isis less than 4% over the 100-mm wafer. Plasma resonance in a large Josephson junction is used to measure specific capacitance (Cs) of the junction. Sheet inductances of superconducting niobium strip-lines are extracted by a SQUID diagnose circuit and the measured results show good agreement with our design values.

IEEE Transactions on Applied Superconductivity•Dec 24, 2016•13 citations
We report on the fabrication and millikelvin char acterization of Nb/Al–AlOx/Nb Josephson junctions directly de posited on X-cut LiNbO3 substrates. Motivated by the strong electro-optic and piezoelectric properties of LiNbO3, such devices are of interest for future hybrid superconducting–electro-optic architectures. The junctions were fabricated using standard processes involving DC magnetron sputtering followed by controlled thermal oxidation of the aluminum layer to form an AlOx tunnel barrier with reproducible junction areas. Insulation of the junctions was achieved by anodization and SiOx deposition. Electrical measurements performed at 30 mK reveal high-quality Josephson tunnel junction behavior with a critical current density ofJc= 70 A/cm2and a characteristic voltage reaching values up toVm= 286 mV. Differential conductance measurements exhibit pronounced quasiparticle peaks corresponding to a sum gap energy of 2Δ = (2.73 ± 0.05) meV, confirming the good quality of the Nb electrodes. Magnetic-field-dependent measure ments yield a Josephson penetration depth of λJ= 45 μm, confirming operation in the small-junction regime, with deviations from the ideal Josephson interference pattern attributed to non-uniform current distribution across the junction area. Compared to our previous characterization at 4.2 K, this work demonstrates reliable Josephson junction operation on LiNbO3 at dilution-refrigerator temperatures relevant for quantum circuits, supporting the suitability of lithium niobate as a promising substrate for future hybrid superconducting–electro-optic device implementations.
The attainment of high-quality Josephson junctions on electro-optical substrates constitutes a key step toward the fabrication of functional superconducting opto-electronics. We report on the fabrication of high-quality all-refractory niobium superconducting tunnel junctions deposited on X-cut LiNbO3 single crystals. A high quality factor Vm=0.7ΔIgR2mV (where ΔIg is the current jump at the sum gap voltage and R2mV the static resistance at V=2mV) up to 61 mV has been measured at T=4.2K. The very low contribution of subgap leakage currents is demonstrated by the BCS-like quasiparticle current measured at V=0.1mV down to T=1.9K.
Niobium/aluminum-oxide/niobium Josephson tunnel junctions have been fabricated using electron beam evaporation to form all-metal films in a high vacuum system. A quality factor, V m (the product of the maximum dc Josephson current and the subgap resistance defined at 2 mV) between 36–37 mV, has been obtained for the best junctions of a 6 nm-thick Al layer by cooling down the surface of the base electrode for 100 minutes under a high background pressure, before the deposition of aluminum, after the formation of the base niobium electrode. An array of 80 series-connected junctions has also been fabricated using the selective niobium anodization process and the planarization process. The current-voltage characteristics of the array showed a standard deviation of the maximum dc Josephson current of 3.3%.
Fabrication And Characterization Of High-Quality Nb/Al-AlOx_xx​/Nb Cross-Type Josephson Tunnel Junctions Utilising CMP-based Planarisation Techniques
Josephson tunnel junctions (JJs) are the fundamental building blocks of today's most advanced superconducting electronic components, such as qubits and superconducting quantum interference devices (SQUIDs). Given the ongoing demand for scalability of these devices on the wafer-scale, it is crucial to control the fabrication process as precisely as possible to ensure uniform quality and reproducibility. Today, window-type JJs are often used in the production of DC SQUIDs and while they are reliable and reproducible, they suffer from alignment inaccuracies caused by photolithography and unavoidable parasitic capacitances, thus limiting the energy sensitivity of DC SQUIDs. These problems can be circumvented by producing JJs with cross-type geometry, which allows for smaller junction areas and eliminates parasitic capacitances. Here we discuss the fabrication of Nb/Al-AlOx/Nb-based cross-type JJs, where the trilayer is embedded in sputter-deposited SiO2_22​ to allow for planarisation of the structures and to ensure the reliable insulation of the sidewalls of the bottom electrode. Instead of lift-off processes that require a lot of time and potentially leave unwanted wings along the edges of microstructures behind that might compromise subsequent layers, we use chemical-mechanical polishing (CMP) for the removal of excess SiO2_22​. This is not only much faster, but produces smooth and uniform surfaces, which in turn effectively improves the reliability of our JJ production process resulting in a high yield of over 90 %90\,\%90% on wafer-scale. In addition, we discuss the influence of fabrication details on the quality and electrical properties of our JJs with different junction areas down to 1 μm×1 μm1\,\mathrm{μm} \times 1\,\mathrm{μm}1μm×1μm distributed across the wafer and extract the junction specific quality parameters from their IV-characteristics and their Fraunhofer patterns.
We present electrical characterization data of sputtered Nb/a-Si/Nb Josephson junctions (JJs) for high-speed and high-density superconducting circuits. Junctions were studied with critical current densities (Jc) ranging from 0.01 to 3 mA/μm2 at 4 K. For junctions deposited at room temperature and processed to a maximum temperature of 150 °C, the dependence of Jc on barrier thickness d is exponential, Jc∝exp (−d/d0), with d0 constant over the entire range of Jc values studied. Junctions were annealed at temperatures up to 300 °C to study changes in their electrical properties and possible compatibility with high temperature fabrication processes. Current–voltage characteristics, critical current uniformity, critical current modulation with in-plane magnetic field, and sub-gap resistance behavior of these junctions were measured at 4 K and demonstrate that the junction properties do not degrade with annealing. These data indicate that Nb/a-Si/Nb JJs are a potential candidate for higher speed and higher density superconducting circuits.
We have fabricated NbTiN/Al-AlNX/NbTiN Josephson tunnel junctions on thermally oxidized Si substrates for their applications to single-flux-quantum circuits operating around 10 K. NbTiN films with a critical temperature Tcof 14.2 K and a root-mean-square value of their surface roughness of 0.45 nm were used as junction electrodes. For a junction barrier, radical-nitrided AlNXwas used to realize high uniformity in the critical current Icof the junctions. We obtained NbTiN junctions with a gap voltage Vg of 4.3 mV and an IcRn. product of 2.6 mV at 4.2 K, where R. is the junction resistance. The critical current density Jc, at 4.2 K was obtained in the range between 0.2 and 6.2 kA/cm2by changing a nitridation time for the AlNXbarrier formation. A series array of 200 junctions with an area of 10 μm × 10 μm exhibited a small I', spread, and the standard deviation 1-σ in Icuniformity was less than 1.6% in the temperature range between 4 K and 10 K.
We present the latest development of an Nb/Al-AlOx/Nb Josephson junction fabrication process for superconducting integrated circuits at SIMIT. Our fabrication process has four niobium superconducting layers and one Ti/Pd resistor layer with 1.0 Ω/square sheet resistor for junction shunting and circuit biasing. Critical current density Jcof the junctions is controlled from 30 A/cm2to 10 kA/cm2by exposing aluminum layer to pure or mixed O2atmosphere. Correlation between measured Jcand exposure conditions has been established. Average quality factor (Rsg/Rn) of the junctions in our process is larger than 20 with subgap leakage factor (Vm) beyond 30 mV. Critical current uniformity is obtained according to the switching current (Is) distribution of a 1000-JJ array. Measured standard deviation sigma of Isis less than 4% over the 100-mm wafer. Plasma resonance in a large Josephson junction is used to measure specific capacitance (Cs) of the junction. Sheet inductances of superconducting niobium strip-lines are extracted by a SQUID diagnose circuit and the measured results show good agreement with our design values.